Articles by San-tron Inc.

San-tron Inc. has written a white paper on passive intermodulation (PIM), its effects on modern communications systems, and how it can be minimized in high-frequency cables, connectors, and cable assemblies.

Discusses the causes of PIM and its impact on next generation wireless networks

San-tron Inc. has a full line of field-replaceable SMAs for applications from DC to 26.5 GHz (and with usable performance to 31 GHz). The connector families include models for mating with 0.012-, 0.015-, 0.018-, and 0.020-in. center pins to accommodate a wide range of RF/microwave circuit dimensions.

San-tron Inc. has announced the launch of S292 Connectors, a new series of 2.92 mm connectors that operate through K band. The launch diameters of these S292 connectors are specifically oriented to the Thunderline-Z .012 pinned glass beads and are RF matched to the dielectric properties of the Corning glass #7070.

San-tron Inc., a manufacturer of RF coaxial connectors and cable assemblies, has announced the release of a new UG-27 C/U, the first right angle adapter to feature solderless construction. The solder-free construction offers dependability equal to a straight plug while achieving 90° bends.

San-tron, Inc., a manufacturer of RF coaxial connectors and cable assemblies, has announced the release of a UG-58 A/U Type N panel receptacle that features single piece body construction. The seamless UG-58s are manufactured using a custom machine designed and built by San-tron for fully automated assembly.

San-tron Inc., a manufacturer of RF coaxial connectors and cable assemblies, has announced the release of their “RF & Microwave Coaxial Connectors and Cable Assemblies” brochure. The brochure outlines their entire product offering, categorized by connector types. Connector offerings include, but are not limited to, SMA, N, BNC, TNC, HN, and 7/16 connectors.

San-tron Inc. has announced the release of a new 7/16 panel receptacle that consistently delivers intermodulation levels of -175 dBc. This receptacle is especially suited for up-link communications. It ensures high grade transmission by delivering VSWR < 1.03 (PCS) and PIM of -175 dBc.