Articles by Ian Doyle, Bourns Electronics Inc.

Integrated Passive and Active Devices Using CSP, DFN and QFN Packaging for Portable Electronic Applications

Over the past five years, an explosion in growth of the portable electronics industry has provided numerous opportunities for manufacturers of RF components. Today, the designers of compact electronic systems, especially handheld/wireless devices, are faced with tightening board space constraints, thus driving the requirement for alternative integrated passive technologies....
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