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Articles by Molex Inc.

Molex acquires SDP Telecom

Molex Inc., a leading global interconnect and cable assembly provider, announced that it and certain of its affiliates have acquired SDP Telecom. Headquartered in Montreal, Canada, SDP designs and manufactures RF/microwave solutions for the wireless communications industry.


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Molex to feature products at IMS2014

Molex Inc. announced that it will exhibit at the IEEE 2014 International Microwave Symposium (IMS) in Tampa Bay, FL June 1-6.  Molex will showcase its broad range of products and solutions available for the RF/microwave market in Booth 508.


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Molex zCD AOC interface scalable up to 400 Gbps

The interface of the recently released Molex Inc. zCD™ active optical cable (AOC) interconnect solution has been selected by the industry leading CDFP MSA as the interface for the consortium’s 400 Gbps hot pluggable module.  The zCD AOC assembly will be highlighted at Molex booth 3863, OFC 2014, March 11-13, San Francisco, CA.


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Molex showcased NeoScale high-speed mezzanine system at DesignCon

Molex Inc. announced its NeoScaleTM High-Speed Mezzanine System at DesignCon 2014.  Delivering remarkably clean signal integrity at data rates of 28+ Gbps, the modular mezzanine interconnect is designed for high-density printed circuit board (PCB) mezzanine applications with limited PCB real estate.  Industry applications include enterprise networking towers, telecommunication hubs and servers, industrial controllers, and medical and military high data-rate scanning equipment.


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Molex introduces electromagnetic interference absorption tape and sheets

Molex Inc. launched its innovative HOZOX™ Electromagnetic Interference (EMI) Absorption Tape and Sheets, ideally suited for manufacturers of high-frequency equipment in multiple industries, including medical, consumer electronics, data/telecommunications and microwave/radio frequency.  HOZOX absorption technology utilizes a unique dual-layer design to maximize the EMI noise mitigation performance.  .


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Molex SpeedStack mezzanine connectors achieve 40 Gbps data rates

The Molex SpeedStack™ mezzanine connector system provides a low profile solution for PCB space savings and a narrow body width for optimized airflow in high-speed and very dense applications.  Compact SpeedStack connectors feature a stack height of 4.00mm and support data rates up to 40 Gbps per differential pair.  SpeedStack connectors will be displayed at Molex booth 117, DesignCon 2014.


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