advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement

Articles by Molex Inc.

Molex unveils new microminiature board-to-board connectors

Molex Inc.
No Comments

 Molex Inc., announces the launch of its new SlimStack™ SSB6 SMT microminiature board-to-board connectors.  


Read More

Molex to feature products at IMS2014

Molex Inc.
No Comments

Molex Inc. announced that it will exhibit at the IEEE 2014 International Microwave Symposium (IMS) in Tampa Bay, FL June 1-6.  Molex will showcase its broad range of products and solutions available for the RF/microwave market in Booth 508.


Read More

Molex flexible microwave cable assemblies offer superior electrical performance

Molex Inc.
No Comments

Molex Inc. will showcase its flexible microwave cable assemblies at the International Microwave Symposium, June 1 – 6, Tampa Bay, FL, Booth 508.  The assemblies replace stiff, semi-rigid assemblies with a combination of Temp-Flex® coaxial cables and high-performance radio frequency (RF) connectors. 


Read More

Molex zCD AOC interface scalable up to 400 Gbps

Molex Inc.
No Comments

The interface of the recently released Molex Inc. zCD™ active optical cable (AOC) interconnect solution has been selected by the industry leading CDFP MSA as the interface for the consortium’s 400 Gbps hot pluggable module.  The zCD AOC assembly will be highlighted at Molex booth 3863, OFC 2014, March 11-13, San Francisco, CA.


Read More

Molex showcased NeoScale high-speed mezzanine system at DesignCon

Molex Inc.
No Comments

Molex Inc. announced its NeoScaleTM High-Speed Mezzanine System at DesignCon 2014.  Delivering remarkably clean signal integrity at data rates of 28+ Gbps, the modular mezzanine interconnect is designed for high-density printed circuit board (PCB) mezzanine applications with limited PCB real estate.  Industry applications include enterprise networking towers, telecommunication hubs and servers, industrial controllers, and medical and military high data-rate scanning equipment.


Read More

Molex introduces electromagnetic interference absorption tape and sheets

Molex Inc.
No Comments

Molex Inc. launched its innovative HOZOX™ Electromagnetic Interference (EMI) Absorption Tape and Sheets, ideally suited for manufacturers of high-frequency equipment in multiple industries, including medical, consumer electronics, data/telecommunications and microwave/radio frequency.  HOZOX absorption technology utilizes a unique dual-layer design to maximize the EMI noise mitigation performance.  .


Read More

Molex SpeedStack mezzanine connectors achieve 40 Gbps data rates

Molex Inc.
No Comments

The Molex SpeedStack™ mezzanine connector system provides a low profile solution for PCB space savings and a narrow body width for optimized airflow in high-speed and very dense applications.  Compact SpeedStack connectors feature a stack height of 4.00mm and support data rates up to 40 Gbps per differential pair.  SpeedStack connectors will be displayed at Molex booth 117, DesignCon 2014.


Read More

Molex experts showcase products that meet the next wave of advanced technology requirements

Molex Inc.
No Comments

Molex Inc. will showcase its deep technical expertise and extensive product portfolio at DesignCon 2014, January 29 – 30, Santa Clara, CA, booth 117.  Company experts will conduct technical paper presentations and product demonstrations to illustrate how Molex solutions meet the demand for increased network bandwidth and advanced technology. The company will also have on display a vast representation of its products that support a wide-range of data rates in a variety of connector sizes and shapes.


Read More

Koch Industries completes purchase of Molex

Koch Industries Inc. and Molex Inc.
No Comments

Koch Industries Inc. has completed its $7.2 billion acquisition of Molex Inc., a global electronic components company.


Read More

Molex showcases leading edge data transmission technologies at ECOC 2013

Molex Inc.
No Comments

Molex Inc. will present leading edge high-speed, high-density solutions at the 39th European Conference on Optical Communication (ECOC 2013) being held September 22-26 at the ICC London ExCEL, England.  ECOC is the largest European optical communications event for the fiber optic industry.


Read More

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up

advertisment Advertisement