Molex will display its innovative, diverse portfolio of RF/Microwave connectors and cable assemblies in booth 1911 at the IEEE 2016 International Microwave Symposium (IMS), held May 22–27 at The Moscone Center in San Francisco, Calif. Molex develops and delivers integrated RF/Microwave solutions for multiple industries, including aerospace and defense, automotive, medical, instrumentation, telecom and wireless.
Molex, a leading global manufacturer of electronic solutions, announced the acquisition of Interconnect Systems Inc. which specializes in the design and manufacture of high density silicon packaging with advanced interconnect technologies.
Molex Inc., one of the world’s leading electronic connector companies, has launched a new product family of MediSpec™ Non-magnetic RF (radio frequency) Contacts and Modules as an extension to its existing line of RF/Microwave interconnect solutions.
Molex Inc., a leading global interconnect and cable assembly provider, announced that it and certain of its affiliates have acquired SDP Telecom. Headquartered in Montreal, Canada, SDP designs and manufactures RF/microwave solutions for the wireless communications industry.
Molex Inc., a leading global manufacturer of electronic solutions, announced it has signed a definitive agreement as a strategic partner and investor in Chicago-based NuCurrent, a developer of wireless power antenna technology.
Molex Inc. announced that it will exhibit at the IEEE 2014 International Microwave Symposium (IMS) in Tampa Bay, FL June 1-6. Molex will showcase its broad range of products and solutions available for the RF/microwave market in Booth 508.
Molex Inc. will showcase its flexible microwave cable assemblies at the International Microwave Symposium, June 1 – 6, Tampa Bay, FL, Booth 508. The assemblies replace stiff, semi-rigid assemblies with a combination of Temp-Flex® coaxial cables and high-performance radio frequency (RF) connectors.
The interface of the recently released Molex Inc. zCD™ active optical cable (AOC) interconnect solution has been selected by the industry leading CDFP MSA as the interface for the consortium’s 400 Gbps hot pluggable module. The zCD AOC assembly will be highlighted at Molex booth 3863, OFC 2014, March 11-13, San Francisco, CA.
Molex Inc. announced its NeoScaleTM High-Speed Mezzanine System at DesignCon 2014. Delivering remarkably clean signal integrity at data rates of 28+ Gbps, the modular mezzanine interconnect is designed for high-density printed circuit board (PCB) mezzanine applications with limited PCB real estate. Industry applications include enterprise networking towers, telecommunication hubs and servers, industrial controllers, and medical and military high data-rate scanning equipment.