Articles by Infineon Technologies

Infineon has in development a complete family of packaged RF Transceiver for Mobile Backhaul – beside BGT70 and BGT80 for E-band radio, also BGT60 for V-band radio. 

Infineon Technologies has introduced its first power switching devices designed specifically for use in space and avionics applications. The new Radiation Hardened (RH) PowerMOS devices of the BUY25CSXX family are claimed to offer best-in-class performance to support design of energy-efficient power conditioning and power supply systems for space use.

Infineon Technologies has introduced a new series of Receive Front-End Modules for implementation of Global Navigation Satellite System (GNSS) functionality in smartphones and other handheld devices. The new BGM103xN7 Series devices are claimed to be the first modules available that support separate or simultaneous reception of both Global Positioning...

Infineon Technologies will invest $160 M this year to expand its production capacity and research and development and upgrade its manufacturing facilities in Malacca, Malaysia. The investment will mainly increase the capacity to produce power semiconductors for energy efficiency applications and will add 350 jobs to the approximately 7,000...

Infineon Technologies AG has opened a new facility in China called Infineon Integrated Circuits (Beijing) Co. Ltd., located in the Beijing Economic and Technological Development Area. In addition to sales and marketing, application R&D and central functions, the new entity houses an IGBT stack manufacturing facility and a technical...

Infineon Technologies has been conferred the Global Award for Supply Chain Excellence by the renowned Supply Chain Council (SCC) in recognition of outstanding contributions towards logistics process improvement. The company also received the Award for Supply Chain Operational Excellence. Both awards honor the successful reorganization of the company’s global...

Infineon Technologies has introduced the ThinPAK 8x8, a new leadless SMD package for HV MOSFETs. It has a very small footprint of only 64 mm 2 and a very low profile of only 1 mm in height. The significantly smaller package size, combined with benchmark low parasitic inductances, provides...

A research project to strengthen German competiveness by developing processes and verification methods for more flexible and secure automated manufacturing has been launched by leading German companies. The SANITAS (“Enabling safer systems by a new collaborative verification methodology across the entire value chain”) project includes nine partners – research...

Infineon Technologies AG has agreed to sell its Wireline Communications (WLC) business to an affiliate of US-based investor Golden Gate Capital for €250 M. Closing is expected in autumn 2009. This transaction will enable Infineon to focus on four segments in the future: Automotive, Industrial and Multimarket, Chipcard and...

As part of its refinancing strategy aimed at strengthening the company’s liquidity position and extending its debt maturity profile Infineon Technologies AG has launched an offering of guaranteed subordinated convertible bonds that will be issued by Infineon Technologies Holding B.V., a wholly-owned subsidiary of Infineon. The offering was substantially...