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ARTICLES

Endicott Interconnect Technologies names Raj Rai CTO

Endicott Interconnect Technologies Inc. (EI) announced the promotion of Rajinder Rai to the position of chief technology officer (CTO) reporting to James J. McNamara Jr., president and CEO. In his new position, Raj will be responsible for monitoring new technologies, overseeing the selection of research projects, generating a technology road-map and ensuring its progress and assessing the potential of new product introduction.


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Endicott Interconnect Introduces LCP Laminate Product Offering

Endicott Interconnect Technologies Inc. (EI) announced that the company has added LCP Laminates to its family of microelectronics packaging product offerings. Custom designed LCP Laminates are suitable for semiconductor packages as LCP coreless designs for up to 6 layers as well as in combination with other rigid materials as...
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Endicott Interconnect Technologies Awarded DoD Accreditation

Endicott Interconnect Technologies Inc. (EI) has received Trusted Accreditation by the Defense Microelectronics Activity (DMEA) as a trusted source to the Department of Defense and all other US government agencies. EI, a world class supplier of engineered electronic interconnect solutions for mission critical and high performance applications, has been...
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