Rogers

Rogers to highlight high-reliability laminates for satellite communications at Satellite 2012

March 13, 2012

Rogers Corp. will be highlighting two of its leading printed-circuit-board (PCB) laminate materials for commercial and military satellite-communications (satcom) electronic applications at the upcoming Satellite 2012 Exhibition.

Rogers Corp. appoints Jeffrey Grudzien to lead its ACM division

February 28, 2012

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Rogers Corp. announced the appointment of Jeffrey Grudzien as Vice President of its Advanced Circuit Materials Division, replacing Michael Bessette, who is retiring after 37 years with the company.

Rogers to highlight pair of high-flying laminates at Satellite 2012

February 27, 2012

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Rogers Corp. will be highlighting two of its leading printed-circuit-board (PCB) laminate materials for commercial and military satellite-communications (SATCOM) electronic applications at the upcoming Satellite 2012 Exhibition.

Rogers to show and present power electronics solutions

February 27, 2012

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Rogers Corp., represented by its Power Distribution System (PDS) Division, will showcase some of its more popular products for power electronics applications at the upcoming Motor, Drive & Automation Systems Conference, March 13-14, at the Rosen Plaza Hotel in Orlando, FL.

Rogers combines DesignCon presentation with products

February 3, 2012

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Rogers Corp. exhibited and presented a white paper concerning thermal conductivity at the DesignCon 2012 conference and exhibition. DesignCon, held January 31 through February 1, 2012, at the Santa Clara Convention Center, Santa Clara, Calif., is one of the electronic industry’s key meeting places for printed-circuit-board (PCB) designers.

Rogers to showcase power electronics products at APEC 2012

February 3, 2012

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Rogers Corp., represented by its Power Electronics Solutions (PES) Business Group, will showcase some of its more popular products for power electronics applications at the upcoming APEC 2012 conference and exhibition.

Rogers To Highlight PCB Materials

April 27, 2011

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Rogers Corp. will display some of its latest laminate materials for high speed digital and high power RF/microwave circuits at the upcoming Del Mar Electronics & Design Show. Representatives from Rogers Advanced Circuit Materials Division will be at Booth 622 to offer guidance on the use of their wide...

Rogers Durel to Showcase Printed Electronics & EL Lighting Solutions

November 19, 2009

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The Durel Division of Rogers Corp. will be showcasing its Printed Electronics and EL Lighting Solutions at the upcoming Printed Electronics show, December 2-3, in San Jose, CA (Rogers booth #43). With over 20 years of design and high volume manufacturing experience in printed electronics, Rogers Durel offers comprehensive...

Rogers Debuts LoPro™ Laminates

July 23, 2009

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The Advanced Circuit Materials (ACM) Division of Rogers Corp. introduced RO4730™ LoPro™ laminates for base station, RFID and other antenna designs. RO4730 LoPro laminate materials combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss. The specially formulated RO4730 LoPro thermoset resin system...

Rogers to Feature Advanced Circuit Material and Thermal Solutions

October 16, 2008

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Rogers will be showcasing new advanced packaging material and thermal management solutions at the upcoming IMAPS show (November 4-6, Providence, RI). Rogers' Advanced Circuit Materials Division (ACMD) will feature its new RO2808 high frequency circuit material. With a dielectric constant of 7.6, the ceramic-filled PTFE material offers the stability...

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