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May 2013

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Efficiency Enhanced Amplifier Using a Digitally-Controlled Dynamic Bias Switching Circuit

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Home » Authors

Authors (sorted by last name)

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7
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C
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P
Q
R
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T
U
V
W
X
Y
Z

4

4RF Communications

7

7Layers

A

A Mediavilla, A. Tazon, J.A. Pereda, M. Lazaro, C. Pantaleon, I. Santamaria

A. Bessemoulin, W. Marsetz, Y. Baeyens, R. Osorio, H. Massler, A. Hulsmann and M. Schlechtweg

A. Edwards, C. Park, S. Singhal, Q. Martin, K.J. Linthicum and I.C. Kizilyalli, Nitronex Corp.

A. Goñi, J. del Pino, O. Medina, S.L. Khemchandani and A. Hernández, Universidad de Las Palmas de Gran Canaria

A. Lázaro, M.C. Maya and L. Pradell

A. Nešić, I. Radnovicć, Z. Mićić and S. Jovanović, IMTEL Institute, Belgrade, Serbia

A. Petosa and A. Ittipiboon, Communications Research Centre Canada

A. Shoory, A. Smorgonskiy, and F. Vega, Swiss Federal Institute of Technology, Lausanne

A.E. Ashtiani, T. Gokdemir, G. Passiopoulos, A.A. Rezazadeh, S. Nam and I.D. Robertson

A.H. Feingold, R.L. Wahlers, P. Amstutz, C. Huang, S.J. Stein and J. Mazzochette

A.M. Peláez-Pérez, J.I. Alonso and P. Almorox-González, Universidad Politécnica de Madrid, Madrid, Spain; J. González-Martín, Indra Sistemas S.A., Tor

A.P. Venguer, J.L. Medina, R.A. Chávez, A. Velázquez and A. Zamudio, CICESE Research Center; G.N. Il’in, Special Astrophysics Observatory

A.P.S. (Paul) Khanna, Phase Matrix Inc.

A.S. Virdee and B.S. Virdee

A.T. Mobashsher, M.T. Islam and N. Misran, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia

A.T. Wall

A.T. Wall Co.

A*STAR Institute of Microelectronics

AABroadband

AAI Test & Training

Abby Monaco, CID. Product and Marketing Mgr. at Intercept Technology Inc

Abdelnasser A. Eldek, Jackson State University

Abdelnasser A. Eldek, Jackson State University, Jackson, MS

Abderraouf Methlouthi Olivier Rouaud and Lionel Boillereaux

Abdullah Eroglu

ABI Research

ABI Research

Abilis Systems

ABIresearch®

Accel-RF

Accel-RF Corp.

Acceleware

Accellera

Ace Antenna Co.

Active Spectrum

Adam Baddeley

ADI

Adrian Sutinjo and Edwin Tung, Murandi Communications Ltd.

Advanced Linear Devices Inc.

Advanced Microwave Technologies Inc., ADVANTECH

Advantage Electronic Product Development

Advantech Wireless

Advantech, Advanced Microwave Technologies Inc.

Advantest America Measuring Solutions Inc, Edison, NJ

Advantest Corp.

Aeris Communications

Aeroflex

Aeroflex / Metelics, Londonderry, NH

Aeroflex / Weinschel

Aeroflex and Centro de Tecnología de las Comunicaciones

Aeroflex Comstron

Aeroflex Inc.

Aeroflex Limited

Aeroflex Ltd.

Aeroflex Test Solutions

Aeroflex Test Solutions, Instruments Division

Aeroflex-KDI Integrated Products

Aeroflex-Metelics

Aeroflex/7 layers

Aeroflex/Inmet

Aeroflex/Inmet, Ann Arbor, MI

Aeroflex/Metelics

Aeroflex/Weinschel Inc.

Aethercomm

Aethercomm Imc.

Aethercomm Inc.

Aethercomm Inc., San Marcos, CA

AFT Microwave GmbH

Agilent

Agilent EEsof

Agilent EEsof EDA

Agilent EEsof EDA Santa Rosa, CA

Agilent EEsof EDA, Santa Clara, CA

Agilent Technologies

Agilent Technologies Inc

Agilent Technologies Inc.

Agilent Technologies Inc. and NXP Semiconductors

Agilent Technologies Inc. Santa Clara, CA

Agilent Technologies Inc., Santa Clara, CA

Agilent Technologies/Lime Microsystems

Agilent Technoologies

Agilent White Paper

AHAM

Ahmet Sertbas, Istanbul University

AIM UK

Airbus Military

Ajay K. Poddar and Ulrich L. Rohde, Synergy Microwave Corp., Paterson, NJ

Aki Nakatani and Lawrence Williams, Ansoft Corp.

Alain Michel

Alain Michel, Ansoft LLC

Alan Jenkins, Tyco Electronics, M/A-COM Products

Alan Lindner, StratEdge Corp.

Alan Noll

Alan Victor and Walter Nagy, Nitronex Corp., Durham, NC

Alastair Upton and Victor Steel RFMD Inc. Greensboro, NC

Albert J. Klappenberger and William B. Lurie

Albert Jerng, RFIC 2012 General Chairman

Alberto Asensio, José Luis Serrano, Javier Gismero and Alvaro Blanco Universidad Politécnica de Madrid, Department of Signals Systems and Radiocommuni

Alberto Asensio, Jose Luis Serrano, Javier Gismero and Alvaro Blanco, Universidad Politecnica de Madrid

Alcatel

Alcatel Alenia Space

Alcatel Lucent

Alcatel Telecom Radio, Space & Defense Division

Alcatel-Lucent

Alcatel-Lucent and EADS (DS)

Alcatel-Lucent/Indra

Alereon Inc.

Alessandro Scannavini, Lars J. Foged, Meryam Abou El Anouar, Nicolas Gross, John Estrada

Alex D. Lapidus

Alex D. Lapidus and Chris Rossiter, L3 Communications Narda Microwave-West

Alex D. Lapidus; L3 Communications Narda-West; Folsom, CA

Alex Lapidus, L-3 Communications, Narda Microwave-West

Alexander Chenakin Phase Matrix Inc. San Jose, CA

Alexander Chenakin, Phase Matrix Inc., San Jose, CA

Alexander Chenakin, Phase Matrix/National Instruments

Alexander Chenakin, Vice President, Phase Matrix Signal Sources

Alexander E. Braun

Alexander Yarovoy

Alfonso J. Zozaya, Eduard Bertran, Alberti and Jordi Berenguer-Sau

Ali A. Rezazadeh, EuMIC 2011 Conference Chair

Ali Abuelma’atti

Ali Darwish

Ali M.T. Abuelma'atti and Ian Thayne, University of Glasgow, Glasgow, Scotland; Muhammad Taher Abuelma'atti, King Fahd University of Petroleum and Min

Ali Zamanian

Alice Ford-Hutchinson, Product Manager, Acceleware Corp.

Allan R. Scott

Allen Chien

Allen Henley, Agilent Technologies Inc.

Allen Katz

Alliance for Wireless Power (A4WP)

Alpha Industries

Alpha Industries Inc.

Alpha Micro Wireless

Alpine Investors

Altair Semiconductor

Altis Semiconductor

Amalfi Semiconductor Inc.

Amanda MacArthur, Mequoda.com

AMCAD

AMCAD Engineering

Amcom Communications

America II Electronics Inc.

American Microwave Corp.

American Technical Ceramics

AMETEK

AMETEK Inc.

Amir Effendy Muhammad-Afifi and Widad Ismail, Universiti Sains, Pulau Pinang, Malaysia; Jit Singh Mandeep, Universiti Kebangsaan, Darul Ehsan, Malaysi

Amit Rawal, Monash University, Clayton, Victoria, Australia

AML Communications

AML Communications Inc.

AMO/SUSS MicroTec

Amolak Singh Badesha; Agilent Technologies, EEsof, Santa Rosa, CA

Amp’ed RF Inc.

Amphenol Industrial Global Operations

Amphenol RF

Amphenol RF, Danbury, CT

Amplidyne Inc.

Amplifier Research

Amplifier Solutions Corp.

Amplifier Technology

AmpliTech

AmpliTech and PMI

ANADIGICS

ANADIGICS Inc.

Analog Devices

Analog Devices Inc.

Analog Devices Inc.

Analog Devices Inc., Norwood, MA

Analog Devices, Norwood, MA

Analogic Corporation

Analysys Mason

AnaPico AG

AnaPico AG, Zurich, Switzerland

AnaPico Ltd., Zurich, Switzerland

Anaren

Anaren Inc.

Anaren Inc., East Syracuse, NY

Anaren Microwave Inc.

Anaren Microwave Inc., E. Syracuse, NY

Anaren, Syracuse, NY

Anatech Electronics

Song Chengtian, Beijing Institute of Technology, Beijing, China Zhang Xiangjun, Zhou Li and Ma Xiaoping China University of Mining and Technology, Xuzhou, China

Kristen Anderson

Anderson Power Products®

Andreas Roessler and Sandra Merkel, Rohde & Schwarz, Munich, Germany

Andrei Grebennikov

Andrei Grebennikov, Alcatel-Lucent, Dublin, Ireland

Andrei Grebennikov, M/A-COM Eurotec Operations

Andrei Grebennikov, M/A-COM Eurotec Operations, Cork, Ireland

Andrei Müller, Dan C. Dascalu, IMT-Bucharest; Pablo Soto, Vicente E. Boria, University Politécnica de Valencia

Andrew

Andrew Corp.

Andrew Edwards, Bernard Geller and Isik C. Kizilyalli, Nitronex Corp.

Andrew Solutions

Andrew Solutions Inc.

Andrew Ware

Andrew®

Andrew®

Andrey V. Grebennikov

Andria Elliott, Corporate Content Manager at National Instruments

Andrzej Sawicki, Ericsson AB

Andy Botka, Agilent Technologies Inc.

Andy Singer

Andy Singer, Radio Waves Inc.

Anite

Anoison

Anritsu

Anritsu Co.

Anritsu Co. Morgan Hill, CA

Anritsu Co., Morgan Hill, CA

Anritsu Company

Anritsu Corp.

Anritsu Corp. and SATIMO

Anritsu Corp./Emite

Anritsu White Paper

Anritsu Wiltron Co.

Anritsu/Verios

Ansoft

Ansoft Corp.

Ansoft Corp., Pittsburgh, PA

Ansoft Corporation

Ansoft, Pittsburgh, PA

ANSYS

ANSYS Inc.

ANSYS Inc., Canonsburg, PA

ANSYS Inc., Pittsburgh, PA

Antenova

Antenova Ltd.

Anthony Sweeney, Endwave Corp., San Jose, CA

Antoine Rabany

Antonio Ciccomancini Scogna, CST of America, Framingham, MA; Jianmin Zhang, CISCO Systems, San Jose, CA

Anurag Bhargava, ISRO

APA Wireless

API Technologies

API Technologies Corp.

APLAC Solutions Corp.

APLAC Solutions Inc.

APLAC Solutions Oy

Application Brief, California Eastern Labs (CEL)

Application Note

Application Note, Anatech Electronics

Application Note, Anritsu

Application Note, Focus Microwave

Application note, Micro-Coax

Applied Engineering Products (AEP)

Applied Radar Inc.

Applied Research Associates Inc.

Applied Wave Research

Applied Wave Research (AWR)

Applied Wave Research Inc.

Applied Wave Research Inc. (AWR)

AR

AR Electronic Conversion Poster

AR Europe

AR Modular

AR Modular RF

AR RF/Microwave Instrumentation

AR RF/Microwave Instrumentation, Application Note

AR RF/Microwave Instrumentation, Souderton, PA

AR Worldwide

AR Worldwide – Modular RF, Bothell, WA

AR Worldwide Modular RF

AR Worldwide RF/Microwave Instrumentation

ARC International

ARC Technologies

Archie W. Straiton & Charles W. Tolbert

Arkivator Telecom

Arlon

Arlon Inc.

Arlon, Materials for Electronics Division

ARMMS

ARMMS RF & Microwave Society

ARMMS RF and Microwave Society

Arrowhead Global Solutions

Artech House Inc.

Artem Saakian

ASC Signal Corp.

Aselsan

Ashkan Mashhour

Ashkan Mashhour and Assaad Borjak

Ashkan Mashhour, William Domino, Norman Beamish

Ashwin Prasad, National Instruments

ASIC North Inc.

Asif Anwar, Director at Strategy Analytics

Asif Anwar, Director, Strategy Analytics

Asif Anwar, Program Director, Strategy Analytics

Asif Anwar, Strategy Analytics

Asif Anwar, Strategy Analytics, London, UK

Aspen Electronics

Assaad Borjak and Taoufik Bourdi

Astrium

Astrium Services/Thales Alenia Space

Astrolab

AT4 wireless

AtlanTecRF

AtlanTecRF, Braintree, UK

Atlantic Microwave Ltd.

Atmel® Corp.

Auriga Measurement Systems LLC, Lowell, MA

Auriga Microwave

Auriga Microwave

Autotalks

Avago

Avago Technologies

Avago Technologies Inc.; San Jose, CA

Avago Technologies, San Jose, CA

Averna

Avi Brillant

Aviat Networks

Aviat Networks Inc.

Aviel Electronics

Aviv Ronai CMO, Ceragon Networks, Ltd.

Aviv Ronai, Chief Marketing Officer, Ceragon Networks

Aviv Ronai, CMO, Ceragon Networks Ltd.

Aviv Ronai, Ron Nadiv and Tsachi Rosenhouse

Avtar S. Virdee and Bal S. Virdee

Avu Brilliant and David Pezo

AVX Corp.

AWR

AWR and Anritsu Co.

AWR and Rohde & Schwarz

AWR Corp.

AWR Corp., El Segundo, CA

AWR Corp.and Antenna Magus

AWR® Corp.

AWR® Corp. and LFoundry GmbH

AWT Global

Azimuth Systems

B

B. Buchin and R. Leschhorn, Rohde & Schwarz GmbH

B. Come, R. Ness, S. Donnay, L. Van der Perre, W. Eberle, P. Wambacq, M. Engels, I. Bolsens

B. Debaillie, B. Come, W. Eberle, S. Donnay and H. Minami

B. Eged, R. Fiengo, F. Persia and S. Thompson, National Instruments, Austin, TX

B. Gellar, B. Thaler, A. Fathy M.J. Liberatore, H.D. Chen, G. Ayers, V. Pendrick and Y. Narayan

B. Guillaume, J. Mabire, P. Maurin, D. Reffet, F. Chirol and E.K. Polzer

B. Kapilevich

B.D. Shank, J.A. Heilman and A.J. Dahm

B.S. Virdee

BAE Systems

Baker IDI

Ball Aerospace

Ball Aerospace & Technologies Corp.

Bantam Instruments

Bao Lu, Xi Gong, Jin Ling and Hong Wei Yuan, Xidian University, Xi’an, China

Bar-Giora Goldberg

Barney Arntz

Barry Alcorn, Agilent Technologies, Inc.

Barry Industries Inc.

Barry Trimmer, Thales Defence Mission Systems Business, Redhill, UK

Basel F. Azzam

BC Systems

Beceem Communications

Ben Thomas and Jackie Johnson; RFMD, Greensboro, NC

Bengt Svensson, Goran Snygg and Per Holmberg

Benson D. Evans, PhD

Benson D. Evans, PhD, Managing Director, www.rfjobstoday.com

Berkeley Nucleonics

Berkeley Varitronics Systems Inc.

Bernd Heinemann and Alexander Fox, IHP, Frankfurt, Germany

Bertram Arbesser-Rastburg, General Chairman, EuMW 2012; Ivar Bazzy, President, Horizon House Publications

BeSpoon

BethelTronix Inc. (BTI)

BFi OPTiLAS

Bhawani Shankar

Bill

Bill Anklam, Victor Grothen and Doug Olney, Agilent Technologies, Santa Clara, CA

Bill Jennewein

Bill Oldfield

Bill Rosas, Southwest Microwave

Bill Rosas, Southwest Microwave Inc.

Bing Li and Jing-Song Hong, University of Electronic Science and Technology of China, Chengdu, China

Bird Technologies Group

BL Microwave

Marleah Blades

Blighter Surveillance Systems

Bliley Technologies

Bliley Technologies Inc.

Blue Cell Technology

Bob Koupal, Marshall Wang and Cory Edelman

Bob McLaughlin and Kipp Schoen, Picosecond Pulse Labs (PSPL)

Bob Thiele and Stan Hardin, Dynawave Cable Inc., Haverhill, MA

Bob VanBuskirk

Boeing

Boeing Defence Australia

Bogdan Sadowski, Harris Stratex Networks Inc.

Bonding Source

Boonton

Boram Lee and Sungtek Kahng, University of Incheon

Boris Aleiner, boris_aleiner@hotmail.com, Nijmegen, The Netherlands

Boris Aleiner, Motorola

Boris Aleiner, Nijmegen, The Netherlands

Boris Sheyer

Bradley K. Benton

Brent Campbell, Marketing Communications Specialist

Brett Chermansky, JFW Industries Inc., Indianapolis, IN

Brian Avenell, National Instruments Corp., Austin, TX

Brian Battaglia

Brian Battaglia, Dave Rice, Phuong Le and Mike Purchine, HVVi Semiconductor

Brian Cheng

Brian Coaker and Tony Challis, e2v

Brian Coaker, e2v Technologies Ltd., Chelmsford, Essex, UK

Brian D. Battaglia, Integra Technologies, El Segundo, CA

Brian D. Battaglia, Jeff Burger and John Titizian

Brian Drozd and William T. Joines, Duke University

Brian S. Collins

BridgeWave Communications

Broadband Antenna Tracking Systems and DragonWave Inc.

Broadcom

Brock J. LaMeres and T.S. Kalkur

Bruce A. Kopp, Elizabeth A. Ouellette and Amy J. Billups

Bruce Marks, Mini-Circuits

Bruce P. Mahler

Bruno Pattan, Federal Communications Commission

Brush Ceramic Products Inc.

Brush Engineered Materials Inc.

BSC Filters

BTI Systems and DragonWave

Bud Noren, Agile Materials & Technologies

Business Wire

BUSINESSWIRE

by Brendan P. Rivers, Attleboro, MA

By David Strand, Strand Marketing Inc.

by Doug Allen, Telecommunications® Online

by Ek Heng, Asia-Pacific Correspondent, Telecommunications® Online

By Jack Daniels, EastBridge Partners LLC, Brookline, MA

By Jun Lee, Skyworks Solutions, Inc.

by Kendrick Struthers-Watson, Telecommunications® Online

By Melissa Drozdowski, Social Media Evangelist, Interprose Public Relations

By Raghu Das, CEO, IDTechEx

Byung-Jun Jang

Byung-Jun Jang, In-Bok Yom and Moon-Que Lee

Byung-Jun Jang, In-Bok Yom and Seong-Pal Lee

C

C-MAC MicroTechnology

C. Quemada, H. Solar and G. Bistué, Centro de Estudios e Investigaciones Técnicas de Gipuzkoa San Sebastián, Spain <br>J. de No and I. Sancho,Escuela

C. Tsironis and N. Misljenovic, Focus Microwaves

C.B. Dietrich, Jr., R.M. Barts, W.L. Stutzman, W.A. Davis

C.L. Wei, B.F. Jia, Z.J. Zhu and M.C. Tang, University of Electronic Science and Technology of China, Chengdu, China

C.S. Whelan, P.F. Marsh, W.E. Hoke, S.M. Lardizabal, R. Leoni III, K.C. Hwang and T.E. Kazior

C.Y. Su, S.J. Chang, L.P. Chen, Y.P. Ho, G.W. Huang, D.C. Lin, B.M. Tseng, H.Y. Lee, J.F. Kuan, Y.M. Deng, K.A. Wen, C.Y. Chang

Cadence Design Systems

Cadence Design Systems Inc.

Caixia Chen, Manh Anh Do, Kiat Seng Yeo, Chirn Chye Boon and Wei Meng Lim, Nanyang Technological University

Calex Mfg. Co. Inc.

California Eastern Laboratories

Cambium Networks

Cambridge Broadband Networks

Cambridge Broadband Networks Ltd.

Cambridge Consultants

Camille Cox, President, OnRamp Communications

Camstar Systems Inc.

CAP Wireless

CAP Wireless Inc. Newbury Park, CA

CAP Wireless Inc., Newbury Park, CA

Capella Intelligent Subsystems Inc.

CapRock Government Solutions

Carl Falcon, AMI Semiconductor

Carl L. Everett, Bell Helicopter Textron Inc.

Carl Sheffres, Microwave Journal Publisher

Carl Sheffres, Publisher

Carl Sheffres, Publisher Microwave Journal

Carl Sheffres, Publisher, <i>Microwave Journal</i>

Carl Sheffres, Publisher, Microwave Journal

Carlisle Companies Inc.

Carlisle Interconnect Technologies

Carlisle Interconnect Technologies/ECS

Carlo Kopp, Monash University

Carlos Calvo and Matthew Pilotte Analog Devices Inc. Norwood, MA

Carlos Fuentes

Carlos Fuentes, Gigatronics Incorporated

Carlson Wireless

Carlson Wireless Technologies

Carnegie Institution for Science

Carol L. Kory

CASAGRAS project

Cascade

Cascade Microtech

Cascade Microtech Inc.

CASSIDIAN

Cassidian/Frequentis Nachrichtentechnik GmbH

CEA-Leti

Cecil Deisch, Tellabs Operations

Cecil W. Deisch, Tellabs

CEITEC

Celcite

Celiant Corp.

Cellphone-Mate

Centellax

Centerline Technologies LLC

Ceragon

Ceragon Networks

Ceragon Networks Ltd

Ceragon Networks Ltd.

CETECOM Spain

Chalmers

Chalmers University of Technology

Champion Technologies Inc.

Changhua Wan, Senior Member, IEEE and Jian-X. Zheng, Member, IEEE

Channel Microwave

Channel Microwave Corp.

Charles Baylis University of South Florida Tampa, FL; Lawrence Dunleavy University of South Florida and Modelithics Inc.Tampa, FL; William Clausen Mod

Charles Baylis, Lawrence Dunleavy and William Clausen

Charles Blackwood

Charles D. McCarrick

Charles R. Buffer and Per O. Risman

Charles Walker, Conference Chair

Charles Wright, Chief Scientist, Azimuth Systems

Charlie Jackson

Chelton Microwave Corp.

Chemring Group/Roke Manor Research

Chen Zhu, Jianyi Zhou and Yanwei Wang

Cheng-Chi Yen and Huey-Ru Chuang

Cheng-Chi Yen, Huey-Ru Chuang

Cheng-Ying Hsu, Chu-Yu Chen and Chuang Hao Huang, Shu-Te University

Cheng-yuan Liu, Ying-song Li, Tao Jang (also affiliated with Harbin Institute of Technology) and Xiao-dong Yang, Harbin Engineering University, Harbi

Chengdu D Fine Technology Co. Ltd.

Chi-Chang Lin, Yu-Jui Chang and Huey-Ru Chuang, National Cheng Kung University

Chia Song Wu, Hsien-Chin Chiu, Yi-Feng Lin

Chia-Shih Cheng, Hsien-Chin Chiu, Shao-Wei Lin and Jeffrey S. Fu Chang Gung UniversityTao-Yuan, Taiwan, ROC

Chia-Song Wu and Hsing-Chung Liu, Vanung University, Taiwan, ROC; Hsien-Chin Chiu and Yi-Feng Lin, Chang Gung University, Taiwan, ROC

Chia-Song Wu and Hsing-Chung Liu, Vanung University; Hsien-Chin Chiu and Wei-Hsien Lee, Chang Gung University

Chia-Song Wu, Vanung University; Hsien-Chin Chiu, Chang Gung University

Chien-Cheng Wei, Chin-Ta Fan, Ta-Hsiang Chiang, Ming-Kuen Chiu and Shao-Pin Ru Tong Hsing Electronic Industries Ltd.Taipei Hsien, Taiwan

Chien-Cheng Wei, Chin-Ta Fan, Ta-Hsiang Chiang, Ming-Kuen Chiu and Shao-Pin Ru, Tong Hsing Electronic Industries Ltd.Taipei Hsien, Taiwan

Chien-Cheng Wei, Hsien-Chin Chiu and Wu-Shiung Feng, Chang Gung University

Chin Leong Lim, Avago Technologies

Chin-Chun Meng and Tzung-Han Wu, National Chiao Tung University

Chin-Leong Lim

Chin-Leong Lim, Avago Technologies, Penang, Malaysia

China Mobile Research Institute and SkyCross

Chipcon AS

Choice Communications

Chris Aden

Chris Brinton, Matthew Wharton and Allen Katz, The College of New Jersey

Chris G. Morton and Chris M. Snowden

Chris Hults, Jim Stack, and M. Jeffrey Barney

Chris Marshall and Bill Murphy, Richardson Electronics Ltd., LaFox, IL

Chris O'Connor

Chris Petrole

Chris Rehorn, Agilent Technologies Inc.

Chris Snow, Telecom Engine

Chris W. Liu, Morten Damgaard, Broadcom Corporation

Chris Walker, European Antennas Ltd.

Christer Stoij, Sivers IMA AB, Kista, Sweden

Christian Bean, Patrick Roblin, Vakur Ertuk and Roberto Rojas

Christian Rye Iversen

Christina Geßner; Rohde & Schwarz, Munich, Germany

Christopher Penney and Yong Wang, Remcom Inc.

Christopher Penny, REMCOM Inc.

Christopher Snowden General Chairman, EuMW 2006; Charles A. Ayotte Horizon House Publications Inc.

Christopher T. Rodenbeck and Kai Chang, Texas A&M University; John Aubin, ORBIT/FR Inc.

Christopher T. Rodenbeck and Richard T. Knudson, Sandia National Laboratories, Albuquerque, NM

Christopher Tutt, Carlisle Interconnect Technologies

Christos Tsironis, Apostolos Samelis and Klaus Buehring

Chu-Yu Chen and Cheng-Ying Hsu

Chu-Yu Chen and Li-Mei Tu

Chu-Yu Chen, Li-Mei Tu

Chuck Swift and Les Besser

Chuck Swift with Bob Eisenhart

Chuck Wheatley

Chung-I G. Hsu Da-Yeh University Changhua, Taiwan, ROC, Ching-Her Lee and He-Kai Jhuang National Changhua University of Education Changhua, Taiwan, RO

Chunlei Wang, Christopher T. Rodenbeck and Kai Chang, Matthew R. Coutant

Chunming Liu, Heng Xioa, Fu Li, Qiang Wu

Ciao Wireless

CirQon Technologies Corp.

Claes Beckman and Ulrik Wahlberg

Clara E. Centeno-Calero, SV Microwave Inc.

Claude M. Weil and Roger B. Marks

ClearCount Medical Solutions

Clifford Fung, MEMS Industry Group

CMC Wireless Components

CML Microcircuits

Coaxial Components Corp./Coaxicom

Cobham

Cobham Antenna Systems

Cobham Antenna Systems (Microwave Antennas)

Cobham Antenna Systems, Microwave Antennas

Cobham Antennas

Cobham plc

Cobham Sensor Systems

Cobham Technical Services

Codan Ltd.

Cohda Wireless

Coilcraft CPS

Colin Warwick, Signal Integrity Product Manager, Agilent EEsof EDA

COM DEV Ltd.

COM DEV USA LLC

Comchip Technology Corp.

CommQuest

CommScope

CommScope

CommScope Inc.

Communication Power Corp.

Communication Solutions Inc.

Communications & Power Industries (CPI)

Communications & Power Industries Canada Inc. (CPI Canada)

Communications & Power Industries Canada Inc. (CPI)

Communications & Power Industries Inc.

Company ABC

COMPRION

Computer Simulation Technology

Computer Simulation Technology (CST)

Computer Simulation Technology AG

COMSAT RSI, Anghel Laboratories

Comsearch

COMSOL

COMSOL Inc.

COMSOL Inc., Burlington, MA

Comtech Telecommunications

Comtech Telecommunications Corp

Comtech Telecommunications Corp.

Comtech Xicom Technology

Cong Wang, Won-Sang Lee and Nam-Young Kim Kwangwoon University, Seoul, Korea, NanoENS Co. Ltd., Gyeonggi, Korea

Constant Wave, Colorado Springs, CO

Copper Mountain Technologies

Cornell Dubilier

Corning Gilbert

Coupling Wave Solutions S.A.

CPI Aerostructures Inc.

CPI International Inc.

Craig Moore and Bruce Kopp

Craig Wall, Agilent Technologies Inc., Santa Clara, CA

Crane

Crane Aerospace & Electronics

Crane Aerospace & Electronics Microwave Solutions

Crane Aerospace & Electronics Power Solutions

Crane Aerospace & Electronics, Microwave Systems, Beverly, MA

Crane Aerospace and Electronics

Crane Aerospace and Electronics Group

Crane Co.

Cranfield University Knowledge Transfer Partnership

Credowan Ltd., Chichester, UK

Cree

Cree Inc.

Cree Research

Creowave

CRFS

CRFS

Crystal RFI Solutions LLC

Crystek

Crystek Corp.

Crystek Crystals

Crystek Microwave

CSR

CSR and SiRF

CST

CST - Computer Simulation Technology, Framingham, MA

CST GmbH

CST of America

CST of America Inc.

CST of America, Framingham, MA

CST of America, Wellesley Hills, MA

CTIA - The Wireless Association

CTS

CTS Corp.

CTS Corp. and Valpey Fisher Corp.

CTT Inc.

Curtis Industries

Cushcraft Corp.

Custom MMIC

Custom MMIC

Cypress Semiconductor Corp. and Oscium

D

D. Djebouri, Space Techniques National Centre;

D. Kaddour, J.D. Arnould and P. Ferrari, ESISAR, Valence, France

D. Packiaraj, M. Ramesh and A.T. Kalghatgi, Bharat Electronics Ltd., Bangalore, India

D.L.S. Electronic Systems Inc.

D.R. Huang, H.R. Chuang National Cheng Kung University Tainan, Taiwan, ROC, Y.K. Chu Himax Technologies, Tainan, Taiwan and C.L. Lu Kun Shan Universit

D.R. Lang

Daa Sheen Technology Co. Ltd.

DaisyRS Inc., San Jose, CA

Dale Robinette, Peregrine Semiconductor Inc. San Diego, CA

Damian Gotch, Filtronic Defence Ltd.

Dan Massé, Associate Technical Editor

Dan Aubertin, Agilent Technologies

Dan Aubertin, Agilent Technologies Inc.

Dan Massé, Associate Technical Editor

Dan Nehring - VP of Engineering, Valpey Fisher Corporation.

Dan Nehring, VP, Engineering, Valpey Fisher Corp.

Dana Whitlow, Analog Devices

Danaher

Daniel Faria, Lawrence Dunleavy and Terje Svensen

Daniel Gandhi, Christopher Lyons

Daniel I. Amey, Samuel J. Horwitz, Stephen Sekel, Jeff Powell and Brian Durwood

Daniel Kehrer and Deepak Bachu, Infineon Technologies AG, Munich, Germany

Daniel M. Dobkin Enigmatics Sunnyvale, CA, Steven M. Weigand WJ Communications Inc. San Jose, CA

DANIEL M. DOBKIN, Enigmatics, Sunnyvale, CA., STEVEN M. WEIGAND, WJ Communications Inc., San Jose, CA

Daniel M. Dobkin, Steven M. Weigand and Nathan Iye

Daniel Schaubert, University of Massachusetts; Jennifer Bernhard, University of Illinois; Robert Mailloux, US Air Force Research Laboratory; W. Devere

Danielle Vanhoenacker-Janvier, EMC 2010 Chair

Darcy Poulin, SiGe Semiconductor

Darcy Poulin, SiGe Semiconductor Inc.

Darioush Agahi, William Domino and Nooshin Vakilian

DARPA

Darren McCarthy

Darren McCarthy, Tektronix and Wally Arceneaux, Mesuro

Darren McCarthy, Tektronix Inc.

Darren McCarthy, Tektronix Inc., Beaverton, OR

Darren McCarthy, Tektronix, Beaverton, OR

Darren McCarthy, Tektronix, Beverton, OR

Data Patterns Group

Datum Inc.

Dave Blackham and Ken Wong, Agilent Technologies Inc.

Dave Giles, A-T Solutions; and Sean Thompson, National Instruments

Dave Russell, HXI/Renaissance

Dave Strand, Strand Marketing

Dave Vondran

Dave Whipple, Agilent Technologies

Dave Whipple, Agilent Technologies Inc.

Dave White

David (Da Wei) Vye, Microwave Journal Editor

David A. Hairfield, Phillip D. Harvey, Yvonne L. Krayer and Troy S. Voytko

David A. Hall, National Instruments, Austin, TX

David A. Hall, National Instruments, Austin, TX; Janne Roos, AWR – APLAC Division, Espoo, Finland

David A. Hall, National Instruments, Austin, TX; Steve Narciso and Jared Richard, Agilent Technologies Inc., Santa Clara, CA; Edited by David Vye, Mic

David Ballo

David Broadbent, National Instruments, Austin, TX

David Critelli, Times Microwave Systems

David Crook

David Cruickshank, TransTech Inc.

David E. Kelly and Kelly Mekechuk

David Halchin and Michael Golio

David Haskin

David J. Vondran, OML Inc., Morgan Hill, CA

David Johns and Patrick DeRoy, CST of America, Framingham, MA

David Johns, VP, Electromagnetic Engineering, Flomerics Inc.

David K. Barton

David K. Walker, Dylan F. Williams, Allen Padilla, Uwe Arz, Hartmut Grabinski

David Lester

David Light, Anthony Faraci and Joe Fjelstad

David M. Jacobson, Andrew J.W. Ogilvy and Alan G. Leatham, Sandvick Osprey Ltd. Neath, UK

David M. Klymyshyn and Surinder Kumar

David Manela and Alan Avidan

David Ngo, RFIC 2011 General Chairman

David Owen

David P. Menzer, Auriga Measurement Systems LLC

David R. Spielman

David R. Vizard, Farran Technology Ltd. Ballincollig, Co. Cork, Ireland

David Robbins and Moeness G. Amin

David Root

David Shively

David Strand, Strand Marketing

David Vondran

David Vye

David Vye - Editor, Microwave Journal

David Vye, Editor

David Vye, Editor, Microwave Journal

David Vye, Editor, Microwave Journal; Leonard Pelletier, Freescale Semiconductor; Steven Theeuwen, NXP Semiconductors; Dave Aichele, RFMD; Ray Crampto

David Vye, Microwave Journal

David Vye, Microwave Journal Editor

David Vye, MWJ Editor

David Vye, Richard Mumford and Patrick Hindle, Microwave Journal Editors

David Vye, Sean Kim, Soung Ho Myoung, Jason Yun and Charlie Jeung, Ansoft Corp. Pittsburgh, PA

David Vye, technical editor

David Vye, Technical Editor Microwave Journal

David Vye, Technical Editor, Microwave Journal

dB Control Inc.

dBm Corp.

DCM Industries Inc.

Dean Priddy, CFO

Debatosh Guha, University of Calcutta, India; Yahia M.M. Antar, Royal Military College of Canada Kingston, Ontario, Canada; P. Béland and M. Roper, Sp

Debra L. Seifert, Managing Partner, Debra Seifert Communications LLC

Debra Seifert

DecaWave

DelfMEMS

Dell'Oro Group

Delphi Components Inc.

Delta Electronics Manufacturing

Delta Electronics Mfg. Corp.

Delta Microwave

Dennis Colin

Dennis Friday

Department of Defense

Derek Skousen, MI Technologies; Charlie Orlenius, Bluetest

Derek Smith

DesignArt Networks

DesignCon

DesignCon 2011

Deutsche Telekom, T-Mobile & Telit Communications

Dialogic

Dialogic Inc.

Diamond Antenna & Microwave Corp.

Diamond Antenna Europe BVBA

Dielectric Communications

Dielectric Laboratories

Dielectric Laboratories Inc.

Dielectric Laboratories Inc. (DLI)

Dieter Pelz

Dilek Barlas, Gregory Henderson, Xiandong Zhang, Matthias Bopp and Andreas Schuppen

Dima A. Smolyansky and Steven D. Corey

Jenn DiMarco

diminuSys, Irvine, CA

Dingqing LU, Agilent Technologies, Santa Clara, CA

DiTom Microwave

Diversified Technologies Inc.

Diversified Technologies, Inc.

DKN Research

Dominic Clancy and Evert van Veldhuizen

Dominique Schreurs, ARFTG Conference Chair

Don Krause, NDK

Don Metzger

Don Metzger, Constant Wave

Dongke Zhang and Fuqiang Liu, School of Electronics and Information, Tongji University;

Donn Harvey

Dorothy Crenshaw, Crenshaw Communications

Doug Allen

Doug Allen, Telecom Engine

Doug Allen, Telecommunications

Doug Reed, Spirent Communications

Dow-Key Microwave Corp.

Dow-Key Microwave Corp., Ventura, CA

Dr. A. Uhlir, Jr.

Dr. Ali Abuelmaatti RFMD (UK)

Dr. Anil Kumar Singh and Dr. S. Christopher

Dr. David Johns V.P. Electromagnetic Engineering Flomerics Inc.

Dr. David Root

Dr. Don Metzger, Constant Wave

Dr. Florian Ramian, Rohde & Schwarz

Dr. John M. Osepchuk

Dr. Jonthan Wells

Dr. Lin Sun

Dr. Mike Heimlich

Dr. Robert Aigner, Director - R&D Acoustic Technologies, TriQuint Semiconductor

Dr. Robert Aigner, Director, R&D Acoustic Technologies, TriQuint Semiconductor

Drago Kostevc and Joze Mlakar

DragonWave

DragonWave Inc.

Dror Regev, Tower Semiconductor

Ducommun Inc.

Ian Dunn, Mercury Computer Systems

DuPont Microcircuit Materials

DuPont Polymers and Electronic Materials

DV

Dwayne

DYMAX Corp.

Dynawave Inc.

E

E. Chen, D. Heo, J. Laskar, D. Bien

E. Conner

E. Géron and J. Lewiner, Ecole Supérieure de Physique et de Chimie Industrielle

E. Hernández, R. Berenguer, J. Aguilera and J. Ibarguren Centro de Estudios e Investigaciones Técnicas de Gipuzkoa (CEIT);I. Gutierrez, Tecnun, Univer

E. James Crescenzi, Jr. amd Walter A. Strifler

E. Rius, C. Quendo, A. Manchec, Y. Clavet, C. Person and J.F. Favennec LEST-UMR CNRS no. 6165, Brest, France, G. Jarthon, O. Bosch, J.C. Cayrou, P. Mo

E.F. Knott, A.W. Reed and P.S.P. Wei

E.M. DomÌnguez, R.F. Tigrek, M. Ruggiano, G. Lellouch and W. de Heij, Thales Nederland B.V.; D. Bockstal; Agilent Technologies Inc.; P. van Genderen I

e2v

e2v technologies

e2v technologies (UK) Ltd.

e2v/SP Devices

EADS

EADS and Astrium

EADS Defence & Security

EADS Defence & Security/Alcatel-Lucent

EADS North America Test and Services

Eagleware Corp.

Eamon Nash

Eamon Nash, Analog Devices

Earl McCune

East Coast Microwave Distributors Inc.

Eastern OptX

EB

EB (Elektrobit), Oulu, Finland

EB, Elektrobit Corp.

Economist Intelligence Unit (EIU)

EDA Consortium

EDI CON

Efield

egc

EiC Corp.

Eid Alsabbagh, Haoyang Yu and Kevin Gallagher, TriQuint Semiconductor

EJL Wireless Research

Ek Heng, Asia-Pacific Correspondent

Elanix Inc.

Elcom Technologies Inc.

Elcoteq

Electro Rent Corp.

Electro Technik Industries Inc.

Electro-Metrics

Electronic Assembly Manufacturing Inc.

Electronic Assembly Manufacturing Inc.

electronica 2010

Electropages

Elektrobit

Elektrobit Corp.

Elektrobit Ltd.

Element Six

Eli Brookner, Raytheon Co.

Eli Conner

Elisra

Elisra Electronic Systems Ltd., Microwave Division Bene Beraq, Israel

Ellen Ferraro and Drew Ganter

Ellen Modock

Elma Electronic Inc.

ELVA-1

EM Research

EM Research Inc.

EM Software & Systems

EM Software & Systems-SA (Pty) Ltd., Stellenbosch, South Africa

EM Software and Systems GmbH

EM Solutions

Emblation Microwave

Emblation Microwave Alloa, Scotland, UK

Emblation Microwave, Alloa, Scotland, UK

EMC Technology

EMC Technology Inc.

Emerson & Cuming Microwave Products

Emerson Network Power

Emerson Network Power Connectivity Solutions

Emhiser Research Inc.

EMITE

EMITE Ing

EMITE Ing, Murcia, Spain

Empower

Empower RF Systems

Empower RF Systems Inc.

EMS SATCOM

EMS Technologies

EMS Technologies Inc.

EMSCAN

Endicott Interconnect Technologies Inc.

Endwave

Endwave Corp.

Engalco

ENS Microwave LLC

Entropic Communications Inc.

Environmental Stress Systems Inc. (ESS)

eong-Sik Yang, Jong-Hwan Lee and Kyung-Whan Yeom

EPCOS

Epic Communications

Epic Communications Inc.

Eric Drucker, Agilent Technologies, Santa Clara, CA

Eric Higham, Strategy Analytics

Eric Jacquet, Jean-Pierre Bardon and Olivier Bignon

Ericsson

Ericsson Components, RF Power Products

Ericsson RF Power Products

Erik Boch, CTO & VP Engineering Dragonwave, Inc.

Erik Boch, Dragonwave Inc.

Erik Boch, Dragonwave, Inc.

Ernest Rejman

Ervin J. Nalos, General Electric Co.

Erwin A. Ulbrich, Jr. and Dan Bryden

ERZIA Technologies S.L.

Escape

Escape Communications Inc.

ESIA

Essad Tahan

Etenna Corp.

Ethertronics Inc.

ETS-Lindgren

ETS-Lindgren L.P.

ETSI

EuMW

Euroconsult

Eurofighter/Selex Galileo

Europa Worldwide Logistics

European Space Agency

European Space Agency (ESA)

European Standardization Organizations (ESO)

European Telecommunications Standards Institute

Evans Capacitor Co.

everything RF

Exa¨el Alexander, Temex

Exalt Communications

Eyelit Inc.

F

F. Alimenti, G. Stopponi, V. Palazzari, P. Placidi, L. Roselli and A. Scorzoni, University of Perugia; P. Ciampolini, University of Parma

F. Amrani, M. Trabelsi and R. Aksas, Telecommunication Laboratory of ENP Algiers, Algeria, A. Azrar, University of Shamed Bouguarra Boumrdes, Algeria

F. Ditore and R. Cutler , Agilent Technologies Inc., Santa Clara, CA; S. Jennis, PrismTech, Boston, MA

F. Mohd-Yasin and M.K. Khaw, Multimedia University; M.B.I. Reaz, International Islamic University Malaysia

F. Mohd-Yasin, M.K. Khaw and F. Choong, Multimedia University; M.B.I. Reaz, International Islamic University Malaysia

F. Mohd-Yasin, M.K. Khaw and M.B.I. Reaz Multimedia University Cyberjaya, Malaysia

F. Mohd-Yasin, M.K. Khaw and M.B.I. Reaz, Multimedia University, Cyberjaya, Malaysia

F. Robert, R. Leblanc, J. Moron, A. Gasmi, N. Santos and M. Rocchi, OMMIC, Limeil-Brévannes, France

F.J. Ortega-Gonzalez, J.M. Pardo-Martin, A. Gimeno-Martin and C.B. Peces, Universidad Politécnica de Madrid

F&K Delvotec Inc.

Fadhel M. Ghannouchi and Abbas Mohammadi

Fadhel M. Ghannouchi, University of Calgary

Fairchild Semiconductor

Fairchild Semiconductor Corp.

Falcon

Farran Technology Ltd.

Fastrax

Fei Zhang, Lina Shi and Chengfang Li

Fei Zhang, Lina Shi and Chengfang Li, Wuhan University

FEKO

Femto Forum

Ferdo Ivanek

Ferenc & Christopher Marki, Ph.D.

Ferenc Marki

Ferro Electronic Materials

FilResearch

Filtronic Compound Semiconductors

Filtronic Compound Semiconductors Ltd.

Firas Mohammed Ali Al-Raie

Flexiguide

Flomerics

Flomerics EM LOB

Florian Krug and Jean Wilwert

Florida RF Labs

Florida RF Labs Inc

Florida RF Labs Inc.

Florida RF Labs/EMC Technology

Focus Display Solutions

Focus Microwaves

Focus Microwaves Corp.

Focus Microwaves Inc.

Focus Microwaves, Inc.

Fordahl–FOQ Group

Forward Concepts

Fractus SA

Francesco Soldovieri IREA-CNR, Naples, Italy, Giancarlo Prisco and Adriana Brancaccio Second University of Naples, Italy; Giovanni Leone, University o

Francesco Soldovieri, IREA-CNR, Naples, Italy Giancarlo Prisco, Second University of Naples, Italy Raffaele Persico, IBAM-CNR, Lecce, Italy Hara

Francisco Javier Ortega Gonzalez, Jose Luis Jimenez Martin and Alberto Asensio Lopez

Francisco Javier Ortega-González and Jose Manuel Pardo-Martín, Universidad Politécnica de Madrid, Grupo de Ingenieria de Radio GIRA, Madrid, Spain

Francisco Javier Ortega-González, Universidad Politécnica de Madrid

Franco Di Paolo

Franco Sechi and Marina Bujatti

Frank Amoroso

Frank Baberg

Frank Bashore

Frank Bashore, <I>Microwave Journal</I> staff

Frank Bashore, Microwave Journal staff

Frank Xiaohui Li and Greg Corsetto

Frank Zavosh and James T. Aberle

Frank Zavosh, Mike Thomas, Chris Thron, Tracy Hall, Daniel Artusi, David Anderson, David Ngo and David Runton

Frank-Werner Thümmler and Thilo Bednorz, Rohde & Schwarz

Fred Bonn

Fred Gardiol and Yves Fournier

Fred Hull, San-tron Inc., Ipswich, MA

Fred Schindler, General Chairman, 2006 Radio and Wireless Symposium

Fred Schindler, Virender Sadhir, Brian Robbins, David Guo and Jerry Paradis, RF Micro Devices, Greensboro, NC, Billerica, MA

Frédéric Aniel, EuMIC 2010 Chairman

Frederic Roger, Scintera Networks, Sunnyvale, CA

Freescale

Freescale Semiconducteurs S.A.S.

Freescale Semiconductor

Freescale Semiconductor Inc.

Freescale Semiconductor, Austin, TX

Freescale Semiconductor, RF Division

Freescale Semiconductor, RF Division Tempe, AZ

Frontlynk Technologies Inc.

Frost & Sullivan

FSY Microwave Inc.

Fu-Ling Lin, Shin-Fu Chen and Huey-Ru Chuang

Fujitsu Microelectronics America Inc.

Fujitsu Semiconductor America Inc.

Fujitsu Semiconductor America Inc., Sunnyvale, CA

Fujitsu Semiconductor Europe

FUJITSU TEN

Full Spectrum

G

G. Cottard, ANTEM, Saint-Maur-des-Fosses, France; Y. Arien, Emerson & Cuming MWP

G. Hau, T.B. Nishimura, and N. Iwata

G. Samuel Dow, Jeff Yang, Kuo-Hsiang Yen, Robert Matreci, Eric Spotted-Elk, Stephen Pettis and Long Trinh

G.A. Sadowy, A.C. Berkun, W. Chun, E. Im, S.L. Durden

G.T. Microwave Inc.

GaAs Code Ltd.

Gaas Labs LLC

GaAsTEK, a unit of ITT Industries

Gaëtan Prigent, Nathalie Raveu, Olivier Pigaglio and Henri Baudrand

Gaëtan Prigent, Nathalie Raveu, Olivier Pigaglio, Henri Baudrand

Galtronics Corporation Ltd.

Gary Simpson, Maury Microwave Corp.

Gary Simpson, Maury Microwave, Ontario, CA; David Ballo, Agilent Technologies Inc., Santa Rosa, CA

Gayle Collins

Gayle Collins and David W. Runton, RF Micro Devices

GBI Research

Geensoft

Geert Carchon, B. Nauwelaers, K.U. Leuven, P. Pieters, K. Vaesen, W. DeRaedt, E. Beyne

General Dynamics

Geneviève Baudoin, EuWiT 2010 Conference Chair

Geonho Jang and Sungtek Kahng, University of Incheon, Incheon, Korea

George D. Vendelin, Vendelin Engineering; José Carlos Pedro and Pedro Miguel Cabral, Universitário de Santiago

George F. Brown, Jr., Blue Canyon Partners Inc.

George Karalias, Rochester Electronics

Georges Roussy, Bernard Dichtel and Haykel Chaabane

Georgi S. Kirov, Technical University of Varna, Bulgaria; Hristo D. Hristov and Rodolfo Feick, Universidad Técnica Federico Santa Maria, Valparaiso, C

Georgia Institute of Technology

Gerard Wimpenny, CTO, Nujira

Gerhard A. Hofbauer

Gerhard A. Hofbauer, Institut für Nachrichtentechnik und Wellenausbreitung

Gerhard P. Fettweis, TU Dresden, Dresden, Germany

German Torregrosa-Penalva, Alberto Asensio-Lopez, Jaime Lluch-Ladron de Guevara and Francisco Javier Ortega-Gonzalez

Kerri Germani

Giga-tronics

Giga-tronics Inc.

GigaLane

GigOptix

GigOptix Inc.

GIL Technologies

Gilat Satellite Networks Ltd.

Gilles Dambrine, General Chair, EuMW 2010; Ivar Bazzy, President, Horizon House Publications

Giorgos E. Stratakos, Paul Bougas and Kostas Gotsis

Giuseppe Macchiarella, Politecnico di Milano; Alberto Bovatti, FOREM S.r.l.

Giuseppe Vacca Bari Polytechnic Bari, Italy

Global mobile Suppliers Association

Global Semiconductor Alliance

Global Test Solutions

Globe Newswire

Globecomm Systems Inc.

Go Long Wireless

Goo-Young Jung and Tae-Yeoul Yun, Hanyan University

Gopinath Gampala and C.J. Reddy, EM Software & Systems Inc.; Oliver Stabler and Thomas Hager, AWE Communications GmbH

Gopinath Gampala, Rohit Sammeta and C.J. Reddy, EM Software & Systems Inc., Hampton VA

Udi Gordon

Gordon Reichard

Gowanda Electronics

Graham Riley, Agilent EEsof EDA, West Lake Village, CA

Graham Teague, Business Development Manager EMEA, TriQuint Semiconductor GmbH.

Graphics for Jenn

Greenray Industries Inc.

Greg Adams and Kong S. Luen

Greg Friesen

Greg Jue and Brad Frieden, Agilent Technologies Inc., Santa Clara, CA

Greg Jue, Agilent Technologies Inc.

Greg Jue, Agilent Technologies, Santa Clara, CA; Thomas Dippon, Agilent Technologies, Boeblingen, Germany

Greg Peters, Agilent Technologies Inc., Santa Clara, CA

Greg Ramon, QinetiQ North America

Greg Skidmore, Jamie Infantalino, Jim Stack, Remcom

Gregory L. Amorese, Agilent Technologies Inc. Santa Rosa, CA

GSMA

Guang Yang, Wei Liu and Falin Liu, University of Science and Technology of China

Guillaume Pailloncy, Frans Verbeyst and Marc Vanden Bossche, NMDG NV, Bornem, Belgium

Gunter Vorlop

Gustavo Lopez-Risueno and Jose I. Alonso

Guy Purchon, Bryan Harbor and Tom McConnell

Guy Sene, President of Agilent Technologies' Electronic Measurement Group

H

H. García-Vázquez, Sunil L. Khemchandani, J. Arias-Pérez and J. del Pino, University of Las Palmas de Gran Canaria Spain

H. Shigematsu, M. Sato, T. Hirose and Y. Watanabe

H. Thust, K.H. Drue, J. Muller, T. Thelemann, T. Tuschick, J. Chilo, C. Golovanov, F. Ndagijimana

H.C. Chiu, C.S. Cheng, C.C. Wei, Y.J. Shih and S.W. Lin, Chang Gung University; F.T. Chien, Feng Chia University

H.D. Hristov and R. Feick, Universidad Técnica Federico Santa María, Valparaíso, Chile, R.J. Urumov and G.S. Kirov, Technical University of Varna, Bul

H.R. Chuang, C.C. Lin and Y.C. Kan, National Cheng Kung University

H.R. Chuang, S.W. Kuo, C.C. Lin and L.C. Kuo National Cheng Kung University Tainan, Taiwan, ROC

H.T. Lin, Y.K. Chu and H.R. Chuang, National Cheng Kung University

Hai-wen Liu, Institute of Optics and Electronics; Zhiguo Shi, Zhejiang University; R.H. Knoechel, Kiel University; K.F. Schuenemann, Technische Univer

Haiwen Liu, Chinese Academy of Sciences, Chengdu, China; Xiaohua Li, University of Electronic Science and Technology of China, Chengdu, China

Haiwen Liu, East China Jiaotong University, Nanchang, China; Fu Tong, Chinese Academy of Sciences, Chengdu, China

Haiwen Liu, Xiaomei Wang, Yulong Zhao, Yan Wang, Baoping Ren, Jiuhuai Lei and Shan Wang, East China Jiaotong University, Nanchang, China

Haki Cebi, Skyworks Solutions Inc., Woburn, MA

Halran Howe

Hans Mollee, Steven O'Shea, Paul Wilson and Korne Vennema

Hans O Johansson, Sivers Ima, Kista, Sweden

Harlan Howe

Harlan Howe Jr. and Richard Mumford

Harlan Howe Jr., Editor Microwave Journal

Harlan Howe Jr., Richard Mumford, Michael Puttré

Harlan Howe, Jr.

Harlan Howe, Jr. – Editor, Microwave Journal, Richard Mumford – European Editor, Microwave Journal, Michael Puttré – Editor-in-Chief, Journal of Elect

Harlan Howe, Jr. Editor, Microwave Journal

Harlan Howe, Jr., <i>Microwave Journal</i> Editor

Harlan Howe, Jr., Editor, <I>Microwave Journal</I>

Harlan Howe, Jr., Editor, Microwave Journal

Harlan Howe, Jr., Microwave Journal

Harlan Howe, Jr., Microwave Journal staff

Harmon Banning, W.L. Gore & Associates

Harris Corp.

Harris Stratex Networks

Harris Stratex Networks Inc.

Harry Chapell, Retired Professional Engineer

Harvey Lehpamer

Harvey Lehpamer, HL Telecom Consulting, San Diego, CA

He-Kai Jhuang and Ching-Her Lee, National Changhua University of Education; Po-Min Hu and Chung-I G. Hsu, Da-Yeh University

He-Xiu Xu, Guang-Ming Wang, Jian-Gang Liang and Tian-Peng Li, Missile Institute of Air Force Engineering University, Sanyuan, China

Heather Bota, Acceleware Corp.

Hector J. De Los Santos, Randy J. Richards

Hee Yong Hwang and Sang-won Yun, Sogang University

Hee-Yong Hwang, Sang-Won Yun and Joong-Sung Chung

GUANG YANG, WEI LIU AND FALIN LIU University of Science and Technology of China, Hefei, China SHENG ZHANG China University of Mining and Technology, Xuzhou, China

HEI Inc.

Heinrich Daembkes, EADS Defence Electronics

Helen Mills, Agilent Technologies Inc.

Helen Wright

Henrik Morkner and Alfred Riddle, M/A-COM Technology Solutions, Lowell, MA

Henry Wojtunik

Heraeus Inc.

Herbert Zirath

Herley Industries Inc.

Herley Industries Inc.</

Herotek

Sherry Hess

Hesse & Knipps

Hesse Mechatronics Inc.

Heuermann

Heuermann and Rosenberger

Heungjae Choi and Yongchae Jeong, Chonbuk National University; J.S. Kenney, Georgia Institute of Technology; Chul Dong Kim, Sewon Teletech Inc.

Hewlett Packard Co.

Hewlett-Packard Co.

Patrick Hindle

HIRAI

Hirai SK Corp.

Hirose

Hirose Electric Co. Ltd.

Hiroyuki Maehara, Agilent Technologies Inc., Santa Clara, CA

Hittite

Hittite Microwave Corp

Hittite Microwave Corp.

Hittite Microwave Corp. Chelmsford, MA

Hittite Microwave Corp., Chelmsford, MA

Hittite Microwave Corporation

Hittite Microwave Inc.

Holzworth Instrumentation

Holzworth Instrumentation Inc.

Holzworth Instrumentation, Boulder, CO

Homayoun Ghani, Toshiba America Electronic Components Inc., Irvine, CA

Homayoun Nikookar

Honeywell

Honeywell, Solid State Electronics Center

Hong-Seop Lee and Hee-Yong Hwang, Kangwon National University

Hongbo Sun, Guosui Liu, Hong Gu, Weimin Su

Hoon Hwangbo, Sung-Chan Jung, Youngoo Yang, Cheon-Seok Park, Byung-Sung Kim and Wansoo Nah,

Hope Microelectronics Ltd.

How-Siang Yap, Agilent

Mike Howard

Howard Hausman

Howard Hausman, MITEQ Inc.

HP EEsof

Hristo D. Hristov, Walter Grote and Rodolfo Feick, Universidad Téchnica Federico Santa María, Valparaiso, Chile

HRL

HRL Laboratories

HRL Laboratories LLC

Hsin-Chih Kuo, Chu-Yun Yang and Huey-Ru Chuang, National Cheng Kung University, Tainan, Taiwan, China

Huang Liang Technologies Co. Ltd.

Huawei

Huber + Suhner

Huber + Suhner AG

HUBER+SUHNER

HUBER+SUHNER AG

HUBER+SUHNER AG, Herisau, Switzerland

HUBER+SUHNER/SPINNER

Huey-Ru Chuang, Liang-Chen Kuo, Chi-Chang Lin and Wen-Tzu Chen

Hugh R. Nudd

Hughes Network Systems LLC

Dennis Hurst

HVS Technologies Inc

HVVi Semiconductors

HVVi Semiconductors Inc.

Hyeong Tae Jeong, Chul Dong Kim and Ik Soo Chang, Sogang University

Hyeonjin Lee and Yeongseog Lim

Hyeonjin Lee, Dongkang College; Jinwoo Jung and Yeongseog Lim

Hyok-Jae Song and Marek E. Bialkowski

Hyun-Chul Go and Yong-Woong Jang; Hankook Antenna Co. Ltd., Keukdong College

Hyun-Chul Go, Hankook Antenna Co. Yong-Woong Jang, Keukdong College

Hyun-Min Park, Kye-Ik Jeon, Songheol Hong

Hyunchul Ku, Wangmyong Woo, J. Stevenson Kenney

Hyung Joun Yoo and Ji-Hoon Kim, Information and Communications University (ICU)

Hyungchul Kim, Hanjin Cho, Min-Su Kim, Mincheol Seo, Junghyun Ham, Cheon-Seok Park and Youngoo Yang, Sungkyunkwan University

Hyungoo Yoon, Myongji College and Byung-Jun Jang, Kookmin University, Seoul, Korea

I

I-Tseng Tang, National University of Tainan

I. Tseng Tang, National University of Tainan; Ding-Bing Lin, Institute of Computer and Communication; Tzu-Hao Lu, Industrial Technology Research Insti

Iain Morris

Iain Morris, Telecommunications Magazine

Ian Doyle, Bourns Electronics Inc.

Ian Hunter, General Chair, EuMW 2011; Ivar Bazzy, President, Horizon House Publications

Icron

IDC

IDirect Government Technologies, Herndon, VA

IEE

IEEE

IEEE IMS/MTT-S 2010 Women in Microwaves

IFEN

IFI

IFR Americas Inc.

IFR Sustems Inc.

IFR Systems Inc.

Ihn S. Kim, Chisung Jo and Yongin Han

Ihn S. Kim, Key Jeong, Jae Kwon Jeong

IHP

IHP–Leibniz-Institut für innovative Mikroelektronik/Ferdinand-Braun-Institut

IHS iSuppli

IKE Micro/Bonding Source

imec

IMS

IMS 2009

IMS 2010

IMS 2011

IMS Connector Systems

IMS Research

IMS2009

IMS2010

IMST

IMST GmbH

In Ho Kang, Shi Wei Shan, Xu Guang Wang and Young Yun, Korea Maritime University; Ji Hoon Kim and Chul Soon Park, Information and Communications Unive

In-ho Kang and Haiyan Xu, National Korea Maritime University

In-Ho Kang and Jin-San Park, Korea Maritime University

In-ho Kang, Joo-yeon Kim

In-ho Kang, Xuguang Wang, Young Yun and Hongchao Zhang

In-ho Kang, Xuguang Wang, Young Yun, Hongchao Zhang

In-Stat

In-Stat Research

Incyte Inc.

Inder J. Bahl

Inder J. Bahl and Mark Dayton, Tyco Electronics, M/A-COM Products

Inder J. Bahl, M/A-COM

Inder J. Bahl, M/A-COM Inc.

Indra

Infineon

Infineon and Nokia

Infineon Technologies

Infineon Technologies AG

Infineon Technologies AG, Neubiberg, Germany

Infineon Technologies and Golden Gate Capital

Infineon Technologies, RF Power Products

Infineon/Nokia

Infolytica Corp

Infonetics

Ingrid De Wolf, Piotr Czarnecki, Anne Jourdain, Robert Modlinski and

INGUN Prüfmittelbau GmbH, Konstanz, Germany

Inmet Corp.

Innovative Micro Technology Inc.

Inphi Corp.

INSIDE Contactless

Institution of Engineering and Technology

Instruments For Industry

Integra

Integra Technologies

Integra Technologies Inc.

Integra Technologies Inc. El Segundo, CA

Integra Technologies Inc., El Segundo, CA

Integral Systems

Integral Systems Inc.

INTEGRATED Engineering Software

INTEGRATED Engineering Software, Winnipeg, MB, Canada

Integrated Microwave Corp.

Integrated Microwave Technologies

Intel

Intelek

Intelliconnect (Europe) Ltd.

Intelsat S.A.

Inter-Continental Microwave

Inter-Continental Microwave (ICM)

Intercept Technology Inc.

International Manufacturing Services Inc

International Manufacturing Services Inc.

International Manufacturing Services Inc. (IMS)

International Telecommunication Union

International Telemetering Conference

inTest Corp.

Introduction by Peter Staecker, Chairman, 1991 MTT-S Boston Symposium; Compiled by David Vye

ip.access

IQD

IQE plc

Iridium Communications Inc.

Irma Swain, Communications Manager

Isaac Mendelson and David Bernstein

Isaac Mendelson, ElectroMagneticCareers.com

Isaac Mendelson, ElectroMagneticCareers.com and David Germond, Cleared Executive Search

ISCO International

Isola Group S.a.r.l.

Isola USA Corp.

iSuppli Corp.

iTerra Communications

ITS Electronics

ITS Electronics Inc.

ITT Corp.

ITT Corp.'s Microwave Systems

ITT Exelis

ITT Industries Inc.

ITT Interconnect Solutions

ITT Microwave Systems

J

J. Capwell, T. Weller, D. Markell and L. Dunleavy, Modelithics Inc.

J. Cheng, S. Li, B. Han and J. Gao, East China Normal UniversityShanghai, PR China; X. Yao, Semiconductor Manufacturing International Corp., Shanghai,

J. L. Allen

J. Laskar, S. Pinel, D. Dawn, S. Sarkar, B. Perumana and P. Sen, Georgia Institute of Technology, Atlanta, GA

J. Randy Fenton

J. Rodriguez-Tellez

J. Rodriguez-Tellez, N.T. Ali and K.A. Mezher, Etisalat College of Engineering; T. Fernandez, A. Mediavilla, A. Tazon and G. Rafael, Universidad de Ca

J. Rodriguez-Tellez, T. Fernandez, A. Mediavilla and A. Tazon

J. Staudinger

J. Wareberg, D. Kennedy, S. Schmidt

J. Wayde Allen

J. Zhou, S. Ming, J. Zhao, C. Ming and L. Zhang Southeast University Nanjing, China

J.A. Tirado-Méndez and H. Jardón-Aguilar, Center for Research and Advanced Studies, IPN; E.A. Andrade-González and M. Reyes-Ayala, Metropolitan Autono

J.E. Mueller, U. Gerlach, G.L. Madonna, M. Pfost, R. Schultheis and P. Zwicknagl

J.J. Yu and S.T. Chew

J.K. McKinney, IMS2010 General Chairman

J.L. Smith

J.M. Cairon, A. Tazon, T. Fernandez, C. Navarro, A. Mediavilla and J. Rodriguez-Tellez

J.M. Huang, (also affiliated with State Key Laboratory of Information Photonics and Optical Communications); H.Z. Zhu, H. Guo, and K. Han, Beijing Uni

J.P. Bridge, Accent Optical Technologies Inc.

J.P. Lanteri and D.J. Carlson, M/A-COM Inc., Lowell, MA

J.S. Kenney and A. Leke

J.S. Mandeep and H. Abdullah, Universiti Kebangsaan Malaysia Selangor, Malaysia; Nitesh Ram, Universiti Sains Malaysia Pulau, Pinang, Malaysia

Jacek Pierzchlewski and Torben Larsen, Aalborg University

Jack Daniels, EastBridge Partners LLC, Brookline, MA

Jack Pollock

Jacket Micro Devices Inc. (JMD)

Jackie Johnson, RFMD, Greensboro, NC

Jackson Labs Technologies Inc.

Jacques C. Rudell, RFIC 2013 General Chairman

Jad Faraj, Verspecht-Teyssier-DeGroote SAS, France; Simon Mathias, Mesuro Ltd., UK; Jean-Pierre Teyssier, XLIM, University of Limoges, France; Johanne

Jae-Ho Yoon, Won-Yong Cho, Ah-Rah Koh, Seung-Jun Lee, Bhanu Shrestha, Gary P. Kennedy and Nam-Young Kim, Kwangwoon University Seoul, Korea

Jaime Leger, Partner at SLN – Sheppard, Leger, Nowak Inc. Marketing Communications

Jaime Leger, SLN

Jake Goldstein and Mehdi Soltan

Jaleh Komaili, Darioush Agahi and Masoud Kahrizi, Senior Members, IEEE

Jaleh Komaili, Senior Member, IEEE, Darioush Agahi, and Masoud Kahrizi, Senior Member, IEEE

Jamal S. Izadian, AntennEM Communication LLC

Jamal S. Izadian, Ph.D, RFCONNEXT, Inc.

James C. Rautio

James C. Rautio, Sonnet Software

James Chen

James E. De Broeck

James Frame, PhD, Jeritt Kent and Ian Lawee, Analog Devices Inc., Norwood, MA

James J. Rosenberg, Michael P. DeLisio and Blythe C. Deckman Wavestream Corp., Chun-Tung Cheung and David B. Rutledge California Institute of Technolo

James Rautio, Sonnet Software, Liverpool, NY

James Rautio, Sonnet Software, Syracuse, NY, John Reynolds and Allen F. Horn III, Rogers Corp., Rogers, CT

James Spoto, Applied Wave Research Inc.

James Swonger, Peter Bacon and Gary Wu, Peregrine Semiconductor, San Diego, CA

James Weiler, IMS MicroApps 2012 Chair

Jan E. Prochnow, Rohde & Schwarz Munich, Germany

Janet Smith

Jang-Hyeon Jeong, Young Yun, Hong-Seung Kim and Nat-Won Jang, Korea Maritime University, Yunju Baek, Pusan National University

Jason Breitbarth and Joe Koebel, Holzworth Instrumentation

Jason Breitbarth, Holzworth Instrumentation, Boulder, CO

Jason Smith

Jason Smith and Pat Malloy

Jason Smith and Pat Malloy, AR Worldwide

Jason Smith; Manager Applications Engineer and Pat Malloy; Sr. Applications Engineer. AR Worldwide

Javelin Semiconductor Inc.

Javelin Semiconductor, Austin, TX

Jazz Semiconductor

Jean-Jacques Bouny

Jean-Pierre Bertinet, Eddie Leleux and Jean-Pierre Cazenave, THALES Microelectronics; Jean-Pierre Ganne, Michel Paté and Richard Lebourgeois, THALES R

Jean-Pierre Bienaime, Chairman, UMTS Forum London, UK

Jed Rice

Jeff Owens

Jeff Stitt

Jeffrey M. Pond, IMS 2011 General Chairman

Jeffrey M. Pond, Naval Research Laboratory and IMS General Chair, Washington, DC

Jenn DiMarco, Staff Editor, Microwave Journal

Jennifer DiMarco and Frank Bashore

Jennifer DiMarco and Frank Bashore Microwave Journal staff

Jennifer DiMarco, Managing Editor

Jennifer DiMarco, Staff Editor

Jenshan Lin, General Chair

Jeong-Gab Ju, Young Yun, Young-Bae Park and Suk-Youb Kang Korea Maritime University, Busan, Korea

Jeonghyeon Cha, Ildu Kim, Sungchul Hong and Bumman Kim, Pohang University of Science and Technology (POSTECH), Gyeongbuk, South Korea, Jong Sung Lee a

Jeremy K. Raines

Jeremy K. Raines, Raines Engineering

Jeremy Wensinger, Cobham Defense Systems, Washington, DC

Jerome Kerr

Jerry D. Neal

Jerry Hausner, Electro Science Technologies

Jerry Jordan

Jerry Yue and Jeff Kriz

Jersey Microwave

Jesper Thaysen, Nokia Denmark; Kaj B. Jakobsen, Technical University of Denmark

Jesse C. James

JFW

JFW Industries

Jian An, Guang-ming Wang, Chen-xin Zhang and Hui-yong Zeng, Air Force Engineering University, Sanyuan, P.R.C.

Jian-kang Xiao South China University of Technology Guangzhou, China, Shi-wei Ma Shanghai Key Laboratory of Power Station Automation Technology Shangh

Jian-Kang Xiao, Xidian University, State Key Laboratory of Millimeter Waves; Wen-Jun Zhu, Hohai University

Jian-Kang Xiao, Xidian University, Xi’an, China, and State Key Laboratory of Millimeter Waves, Nanjing, China; Wen-Jun Zhu, Hohai University, Changzho

Jiang Liu, Hugo Morales, Thomas Weller and Larry Dunleavy, Modelithics Inc., Tampa, FL; Gerhard Schoenthal, Virginia Diodes Inc., Charlottesville, VA

Jianing Zhao, Jianyi Zhou, Jianfeng Zhai, Xiao Liang and Wei Hong, Southeast University, Nanjing, P.R. China

Jianing Zhao, Xiaowei Zhu, Jianyi Zhou, Jin Liu

Jianjun Gao, East China Normal University Shanghai, P.R. China

Jianyi Zhou, Jianing Zhao, Wei Hong and Xiaowei Zhu, Southeast University

Jianyi Zhou, Lei Zhang, Wei Hong, Jianing Zhao and Xiaowei Zhu, Southeast University

Jianyi Zhou, Limin Feng, Xiaowei Zhu and Wei Hong

Jim Barthold

Jim Barthold, <i>Telecommunications</i>®

Jim Barthold, Telecommunications

Jim Barthold, Telecommunications Magazine

Jim Carlini

Jim D’Ostilio Microwave Circuits Inc. Lynchburg, VA

Jim DeLap

Jim Fallon

Jim Fallon President and CEO, Fallon & Associates LLC

Jim Fallon President and CEO, Fallon and Associates LLC

Jim Fallon, Fallon and Associates Consulting LLC

Jim Fallon, Fallon and Associates LLC, Hingham, MA

Jim Fallon, Hittite Microwave Corporation, Corporate Business Development, Military Systems

Jim Fallon, President and CEO of Fallon & Associates Consulting

Jim Fallon, President and CEO, Fallon and Associates Consulting LLC

Jim Fallon, President and CEO, Fallon and Associates LLC

Jim Harvey

Jim Mayock, VIPER RF Ltd.

Jim Morgan, SemiGen Inc.

Jim Stratigos, CEO, Jacket Micro Devices

Jim Tabor Product Planner, Real-Time Spectrum Analyzer Group, Tektronix Inc.

JIN-KUK LEE, SU-TAE KIM AND YONG-CHAE JEONG Chonbuk National University, JONG-SIK LIM Soonchunhyang University, Asan, Korea, CHUL-DONG KIM, Sewon Tele

Jin-Su Kim and Hee-Yong Hwang, Kangwon National University, Chuncheon, South Korea

Jinaing Zhao, Jianyi Zhou, Xiao Liang and Jianfeng Zhai, School of Information Science and Engineering, Southeast University

Jinaing Zhao, Jianyi Zhou, Xiao Liang, Jianfeng Zhai, School of Information Science and Engineering, Southeast University, Nanjing, P.R. China

Jinbiao Xu, Agilent Technologies

Jinwoo Jung and Yeongseog Lim, Chonnam National University Gwangju, Korea; Hyeonjin Lee, Dongkang College, Gwangju, Korea

Jinwoo Jung and Yeongseog Lim, Chonnam National University; Hyeonjin Lee, Dongkang College

Jiri Polivka, Spacek Labs Inc.

Joachim Samuelsson

Jochen Wolle and Rainer Lenz, Rohde & Schwarz, Munich, Germany

Joe Chandler, Millitech Inc., a Smiths Interconnect Business, Northampton, MA

Joe Cozzarelli, Anadigics

Joe Madden Avago Technologies San Jose, CA

Joe Madden, Principal Analyst, Mobile Experts

Joe Pusl, Srikanth Sridharan, Philip Antognetti, David Helms, Anurag Nigam, James Griffiths, Kenneth Louie, Mark Doherty

Joel Dunsmore

Joel Dunsmore, Agilent Technologies Inc., Santa Clara, CA; Ted Heil and Harvey Kaylie, Mini-Circuits, Brooklyn, NY

Joel Dunsmore, Greg Jue and John Kikuchi

Joel Goldstein, President, Goldstein Group Communications Inc.

Joel Kirchman, AWR

Joel Kirschman

Joel Kirshman, AWR Corp.

Joel M. Libove, Brendan R. Illingworth, Steven J. Chacko - Furaxa Inc.; Hal L. Levitt, Naval Research Laboratory

Joel P. Dunsmore, Agilent Technologies Inc., Santa Rosa, CA

Johannes Benedikt

Johanson

Johanson Technology

Johanson Technology Inc.

John Barfuss, Agilent Technologies

John Barr, General Chairman, 2006 International Microwave Symposium

John Brewer

John Brewer and Peter Gammel, SiGe Semiconductor Inc.

John Bushie

John Coonrod, Rogers Corp., Chandler, AZ

John Coonrod, Rogers Corp., Chandler, AZ and Brian Rautio, Sonnet Software, North Syracuse, NY

John Coonrod, Rogers Corp., Rogers, CT

John E. Penn

John E. Penn, Johns Hopkins University

John Esterline, Greenray Industries Inc.

John F. Aubin

John F. Sevic

John Hansen, Agilent Technologies Inc., Santa Clara, CA

John Hendricks, Rogers Corp.

John Hoschette

John M. Seavey

John McKillop, TeraVicta Technologies Inc., Austin, TX

John P. Wendler

John S. Hansen, Agilent Technologies Inc.; Jim Taber, X-COM Systems

John Silvestro, Kezhong Zhao and Arien Sligar; ANSYS Inc., Canonsburg, PA

John Thornton, Andy White and Graham Long, University of York, UK

John W.M. Rogers and Calvin Plett

John Zorzy & R. F. Muehlberger

Emmy Johnson

Joint Program Executive Office, Joint Tactical Radio System

Jonathan Wells, AJIS Consulting

Jonathan Wells, AJIS LLC, San Francisco, CA

Jonathan Wells, Consultant

Jong-Hwan Lee and Kyung-Whan Yeom, Chungnam National University, Daejeon, Korea

Jonthan Wells

Joon-Won Jang and Hee-Yong Hwang

Jorge A. Ruiz-Cruz, Universidad Autónoma de Madrid; Chi Wang, Orbital Sciences Corp.; Kawthar A. Zaki, University of Maryland

José Luis Flores, AT4 Wireless, Málaga, Spain

Joseph Andrews, RFVCO

Joseph F. White, Consulting Editor (May 1979)

Joseph Merenda

Joseph R. Guerci

Joseph R. Jahoda

Josh Moore, Applied Wave Research Inc.

Josh Moore, AWR Corp.

Josh Raha and Mark Andrews, TriQuint Semiconductor

Josh Raha, TriQuint Semiconductor, Hillsboro, OR

Microwave Journal

Joy Laskar, General Chair, 2008 International Microwave Symposium

JQL Electronics

JS Mandeep, School of Electrical and Electronic Engineering, Universiti Sains Malaysia

Ju-Young Moon and Sang-Won Yun, Sogang University; Chang-Soo Ahn and Seon-Joo Kim, Agency for Defense Development

Juan Cordovez, James Victory, Samir Chaudhry, Volker Blaschke, Zhixin Yan, Robert Milkovits, Ivan Ban and Marco Racanelli, Jazz Semiconductor

Juan Cordovez, James Victory, Samir Chaudhry, Volker Blaschke, Zhixin Yan, Robert Milkovits, Ivan Ban, Grady Lyda and Marco Racanelli, Jazz Semiconduc

Juan Eusebio Garrido Arenas, Alberto Barcia Cancio and Jose Manuel Paez Borrallo

Juan L. Cano and Eduardo Artal, University of Cantabria, Santander, Spain

Julie Declercq

Julie Teinert (julie@julieteinert.com) and Robyn Tinsley (robyn@tinsleypr.com)

Julie Teinert, Mimix Broadband

Julien Regoli, VP Operations, Maravedis Inc.

Jun Lee, Skyworks Solutions Inc., Irvine, CA

Jun Won Huh, Ik Soo Chang, Chul D. Kim

Jun-Seok Park, Kookmin University

Juniper Research

Junying Liu, Dongjin Wang, Shengzhao Xiang, Weidong Wang and Sheng Zhang, University of Science and Technology of China, P.R. China

Jürgen Hartung; Cadence Design Systems Inc., Munich, Germany

Jwo-Shiun Sun

Jwo-Shiun Sun , Kwong-Kau Tiong and Jiann-Hwang Liu

Jwo-Shiun Sun and Guan-Yu Chen

Jwo-Shiun Sun and Jier-Chih Hsieh

Jwo-Shiun Sun and Yao-Liang Huang

Jwo-Shiun Sun, Ren-Hao Chen, Shao-kai Liu, and Cheng-Fu Yang

Jwo-Shiun Sun, Tsung-Lin Lee

K

K K Jain, Kirti Bansal, Meenakshi Aggarwal, B S Matheru

K. Narendra, Motorola Technology; M.F. Ain, J.S. Mandeep and S.I.S. Hassan, University Sains Malaysia

K. Rambabu, M. Ramesh and A.T. Kalghatgi

K. Singh and K. Ngachenchaiah, Semi-Conductor Laboratory Near Chandigarh, India, D. Bhatnagar, University of Rajasthan, Jaipur, India, S. Pal, ISRO Sa

K. Singh, V. Vinayakarohit, R. Ramasubramanian and S. Pal

K. Werner and S. Theeuwen, NXP Semiconductors, Nijmegen, The Netherlands

K.A. Jose, Vasundara V. Varadan and Vijay K. Varadan

K.J. Cho, W.J. Kim and S.P. Stapleton, J.H. Kim, J.Y. Kim, B. Lee, J.J. Choi and J.C. Lee

K.V. Puglia

K.V. Puglia, Tyco Electronics

K.W. Kobayashi

K.W. Kobayashi A.K. Oki, A. Gutierrez-Aitken. J. Cowles, L.T. Tran, T.R. Block and D.C. Streit

K&L Microwave

K&L Microwave Inc.

K&L Microwave, Salisbury, MD

Kaben Research

Kaben Wireless Silicon Inc.

Kaelus

Kaltman Creations

Kamaljeet Singh and K. Nagachenchaiah, Semiconductor Laboratory

Kamaljeet Singh and Surendra Pal, ISRO Satellite Center

Kamil Janeczek, Malgorzata Jakubowska, Grazyna Koziol and Wojciech Steplewski, Tele & Radio Research Institute

Kang Chen, Spirent Communications

Karin van Oort and Peter Hoogeboom, TNO Defence, Security and Safety

Karl B. Niclas and Michael Madera-Meza

Karl L. Kovach and Karen J. Van Dyke

Katherine J. Herrick, Linda P.B. Katehi, Robert T. Kihm

Kathiravan Krishnamurthi and Stephen P. Jurgiel

Kathiravan Krishnamurthi, Zhiyang Liu and Ian Gresham, NXP Semiconductors, Billerica, MA

KDI/triangle Corp.

Ke Wu, IMS 2012 General Chairman

Ke-Li Wu and Gordon McDonald

Kefeng Liu, ETS-Lindgren, Cedar Park, TX

Keith Howell and Ken Wong

Keith Moore and Frank Bashore

Keith Willetts, Chairman and CEO, TM Forum

Keith Willey

Keithley

Keithley Instruments

Keithley Instruments Inc.

Kellie Chong, RFMD, Greensboro, NC

Ken Wieland

Ken Wieland, Telecommunications

Ken Wong, Conference Chair

Kendall S. Ching

Kendrick Struthers-Watson

Kendrick Struthers-Watson, Telecom Engine

Kenneth Stern

Kenny Gunderman, Chad Crank, & Ross Rucker

Kent K. Johnson, Agilent Technologies

Kerri Germani, Staff Editor

Kerry Z. Cai and Pengfei Zhang

Kevin Danehy and Mark Wolf

Kevin Harrington and Scott Vasquez, M/A-COM Technology Solutions, Lowell, MA

Kevin Spencer, Crane Aerospace & Electronics, West Caldwell, NJ

Kevin W. Kobayashi

Kevin W. Kobayashi, Aaron K. Oki and Dwight C. Streit

Kevin Walsh and Jackie Johnson

Kevin Walsh and Jackie Johnson, RFMD

Khanh Tuan Le

Khelifa Hettak and Malcolm G. Stubbs

Kirti Bansal, K.K. Jain, B.S. Matheru and U.C. Ray, Solid State Physics Laboratory, Delhi, India

Klaus-Dietmar Muller

KMW USA Inc., Fullerton, CA

Kohei Fujii and Henrik Morkner, Avago Technologies

Kohei Fujii, John Stanback, and Henrik Morkner - Avago

Kohei Fujii, John Stanback, and Henrik Morkner - Avago Technologies

Kohei Fujii, John Stanback, and Henrik Morkner, Avago Technologies

Kokulathasan Thalayasingam and Holger Heuermann, Heuermann HF-Technik GmbHAachen, Germany

Henri Komrij, Agilent Technologies

KOR Electronics

Kratos Defense & Security Solutions Inc.

Krešimir Malaric

Kristen Anderson

Kristen Anderson, Marketing and Event Coordinator

Kristen Anderson, Microwave Journal

KRYTAR Inc.

Kumar Narendra & Sangaran Pragash, Motorola Technology, Penang, Malaysia; Lokesh Anand, M.F. Ain & S.I.S. Hassan, University of Science Malaysia

Kumar Narendra, Sangaran Pragash and Chacko Prakash, Motorola Technology; Lokesh Anand, M.F. Ain and S.I.S. Hassan, University Science Malaysia

Kwangjin Koh and Gabriel M. Rebeiz University of California at San Diego

Kyle Labowski, Christopher Penney and James F. Stack, Jr., Remcom Inc., State College, PA

Kyocera America

Kyocera America Inc.

Kyoung-Joon Cho and Wan-Jong Kim, Dali Wireless; Ji-Yeon Kim and Jong-Heon Kim, Kwangwoon University; Shawn P. Stapleton, Simon Fraser University

Kyu-Ho Park, Hee-Seok Song, Young-Shin Lee, and Yong-Chae Jeong

L

L-3 Communications

L-3 Electron Devices

L-3 Electron Technologies Inc.

L-3 Global Connectivity

L-3 Telemetry-East

L-com

L-com Inc.

L. Chen, Y. Shang and Y.L. Zhang, Xi’an Technological University, Xi’an, P.R. China; F. Wei, Xidian University, Xi’an, P.R. China

L. Devlin, A. Dearn, G. Pearson and T. Richards, Plextek Ltd., Great Chesterford, UK

L. Dunleavy, W. Clausen and T. Weller

L. Durand, L. Duchesne, L.J. Foged, Reuven Konevky, Lior Shmidov: SATIMO & ORBIT/FR

L.V. Kasatkin and N.F. Karushkin

Labtech Microwave

Laird Technologies

Laird Technologies Inc.

Lake Shore Cryotronics

Lambert Devoe and Alan Devoe

Lamberto Raffaelli

Lamhroe

Lamina Ceramics

Lance Doherty, Jonathan Simon and Thomas Watteyne, Dust Networks Product Group, Linear Technology Corp., Milpitas, CA

Lantiq and T-Venture

Alex D. Lapidus, L-3 Communications

Lark Engineering

Larry Giacoletto

Laser Services

Guang Yang, Wei Liu and Falin Liu, University of Science and Technology of China Last

Laura Borgstede, Calysto Communications

Laura Casasanto, Staff Editor, Microwave Journal

Laurent Desclos, Ethertronics, Inc.

Lawrence (“Larry”) Dunleavy

Lawrence P. Dunleavy, Modelithics Inc.

Lawrence P. Dunleavy, Thomas M. Weller, Paul G. Flikkema, Horace C. Gordon, Jr. and Rudolph E. Henning

Lawrence Williams, Matthew Commens and Steve Rousselle, ANSYS Inc.

Leader Tech

LeCroy Corp.

Ledezma (USF), Weller (Modelithics), Robin (Motorola)

Lemko Corp.

Len Crane, Coilcraft

Leo G. Maloratsky

Leo G. Maloratsky, Aerospace Electronics Co.

Leo G. Maloratsky, Aerospace Electronics Co., Indialantic FL

Leo G. Maloratsky, Rockwell Collins

Leo G. Maloratsky, Rockwell Collins; Simon Y. London, Advanced Power Technologies Inc.

Leo Gumina

Leonard Pelletier

Leondard Hayden and Brett Grossman, ARFTG Conference Co-Chairs

Les Crane, Coilcraft

Liang Han, Ke Wu, Xiao-Ping Chen and Fanfan He, École Polytechnique de Montréal, Montreal, Canada

Liang-Hui Li and Huey-Ru Chuang, National Cheng Kung University

LightSquared

Lime Microsystems

Lin Qiang, Zhang Zu Ying and Guo Wei; Air Force Radar Academy and Huazhong University of Science and Technology

Lin Sun

Lin-Sheng Liu, University of Electronic Science and Technology of China, Chengdu, China

Linear Technology

Linear Technology Corp.

Linear Technology Corp., Milpitas, CA

Linear Technology, Milpitas, CA

Linearizer Technology Inc.

LingXia Wang Xidian University, Shaanxi, China HaoJia Lin China Academy of Space Technology, Shaanxi, China

Link Microtek

Linwave Electronic Manufacturing Services

Linwave Technology

Linx Technologies

Lise Proust

Litron

LNX Corp.

LNX Corp. Salem, NH

Lockard & White

Lockheed Martin

Lockheed Martin Corporation

Locus Microwave Inc., Boalsburg, PA

Locus Microwave, Boalsburg, PA

Lorch Microwave

Loren Betts, Agilent Technologies and Dylan T. Bespalko and Slim Boumaiza, University of Waterloo, Canada

Loren Betts, Agilent Technologies Inc., Santa Clara, CA

Lorenz-Peter Schmidt, General Chairman; Charles Ayotte, Horizon House Publications Inc.

Louis Fan Fei, Garmin International

LPKF

LPKF Laser & Electronics

LPKF Laser & Electronics AG

LPKF Laser & Electronics AG, Garbsen, Germany

LPKF Laser & Electronics, USA

LPRS

Luca Stroppolo, Ericsson NSI, Rome, Italy

Lucent Technologies Inc.

Lucia David, Selex Systemi Integrati, Rome, Italy

Lucy Berridge, Stephen Stones, Peter Kingsland, Tania Harvey and Ross Parsons

Luso Electronics

LYNX

M

M. ABRI, N. BOUKLI-HACENE AND F.T. BENDIMERAD, Université Abou Bekr Belkaïd, Tlemcen, Algeria; E. CAMBIAGGIO, Université de Nice – Sophia Antipolis, V

M. Fujimoto

M. Gurumurthy and M. McKernan, Spirent Communications

M. Hagensen, Guided Wave Technology ApS, Hilleroed, Denmark

M. Ibrahim Khalil, Armin Liero, Andreas von Müller and Thomas Hoffmann

M. Imran Cheema, Andrew Kirk McGill University

M. Kameche, and N.V. Drozdovski; National Centre of Space Techniques and ETEC

M. Kameche, M. Feham

M. Mathian, E. Korolkewicz, P. Gale and E.G. Lim

M. Obrien

M. Perotoni and L.A. de Andrade, CST AGl; M.C. Rezende and H. Vieira, Jr., IAE Space and Aeronautic Institute

M.B.I. Reaz, National University of MalaysiaSelangor, Malaysia; J. Uddin, S. Hussain, A.N. Nordin and M.I. Ibrahimy, International Islamic University

M.D. Brunsman, TriQuint Semiconductor, Hillsboro, OR

M.F. Ain, J.S. Mandeep, C.T. Chin, S.I.S. Hassan M.A.Othman and B.M. Nawang

M.J. Poulton, K. Krishnamurthy, J. Martin, B. Landberg, R. Vetury and D. Aichele, RF Micro Devices

M.N. Zybin, JSC Pluton, Moscow, Russia

M.O'Brien

M.P.R. Panicker, D. Douriet, M.S. Hyslop and N.L. Greenman

M.S. Muha, C.J. Clark, A.A. Moulthrop and C.P. Silva

M/A-COM

M/A-COM Inc.

M/A-COM Inc., a Tyco Electronics company Roanoke, VA

M/A-COM Tech

M/A-COM Tech Asia

M/A-COM Tech Asia; Taiwan, ROC

M/A-COM Technology

M/A-COM Technology Solutions

M/A-COM Technology Solutions and Mimix Broadband

M/A-COM Technology Solutions Inc.

M/A-COM/Mesuro

M2 Global

M2 Global Technology Ltd.

M2 Global Technology Ltd.

MACOM

Joe Madden

Madhu Gurumurthy, Spirent Communications

MagCap Engineering Inc.

Magfusion Inc.

MagnaChip Semiconductor Corp. and Peregrine Semiconductor Corp

MAGUS, CST and EMSS

MAJ Staff

Majid Razavi-Rad, Changiz Ghobadi, Javad Nourinia and Reza Zaker, Urmia University, Urmia, Iran

Malcolm Edwards, AWR Corp.

Man Seok Uhm and In Bok Yom, ETRI, Daejeon, Korea; Juseop Lee, University of Michigan, Ann Arbor, MI; Jeong Phill Kim, Chung-Ang University, Seoul, Ko

Manny Assurian, Ray Hashemi and Jim Assurian Reactel Inc.

Manny Assurian, Ray Hashemi and Jim Assurian, Reactel Inc.

Mano Vafai, WiMAX Forum® Application Architecture

Manos M. Tentzeris, Rushi Vyas, Vasileios Lakafosis, Taoran Le, Amin Rida and Sangkil Kim School of ECE, Georgia Tech, Atlanta, GA

Manos Tentzeris, Technical Program Chair

Manuel del Castillo and Henry Valenzuela

Mao Tian

Maravedis

Marc Frechette, Marketing Communications, Micronetics

Marcel Kossel, Hansruedi Benedickter, Werner Bachtold, Roland King and Jan Hansen

Marconi Applied Technologies

Marconi Instruments Inc.

Marcus da Silva, Tektronix Inc.

Marcus Dasliva

Marinus (Ron) Korber, Jr.

Marjan Grman

Mark Bailly, EMC Technology, Stuart, FL

Mark Chapman, WiSpry Inc., Irvine, CA

Mark Elo

Mark Elo Director, RF Products Keithley Instruments, Inc.

Mark Elo, Director, RF Products, Keithley Instruments

Mark Elo, Keithley Instruments

Mark Elo, Marketing Director of RF Products, Keithley Instruments

Mark Lombardi, RT Logic, Colorado Springs, CO

Mark R. Simpson and John M. Dixon

Mark Ravenstahl

Mark Saffian - Soultion Architect, AWR Corp.

Mark Slovick

Mark Winebrand and John Aubin, ORBIT/FR Inc.

Mark Winebrand, John Aubin and Russell Soerens, ORBIT/FR Inc.

Chris Marki

Marki Microwave Inc., Morgan Hill, CA

Markus Kopp, ANSYS Corp., Canonsburg, PA, and Juliano Fujioka Mologni, ESSS, Brazil

Marta Iglesias

Marta Iglesias-Xamani

Martha Zemede, Agilent Technologies, Santa Clara, CA

Martin Coleman, The Satellite Interference Reduction Group (sIRG), Douglas, Isle of Man, UK

Martin J. Salter and Nick M. Ridler, National Physical Laboratory, Teddington, Middlesex, UK

Martin Timm

Mary Anne Tupta, Keithley Instruments

Mass Bay Technologies

Massachusetts Institute of Technology

Matajaz Vidmar

Mathew Hubbard, RFMD

MathWorks

Matjaz Vidmar

Matjaz Vidmar, University of Ljubljana

Matt Landry (@mattmatter), Vice President, Matter Communications

Matthew J. Maxwell, Tektronix Inc.

Matthew Morgan and Sander Weinreb, National Radio Astronomy Observatory, Jet Propulsion Laboratory

Mauro Marchetti, Anteverta Microwave B.V. Delft, The Netherlands

Maury Microwave

Maury Microwave Corp.

Maury Microwave Corp., Ontario, CA

Maxim Integrated Products Inc.

MAXRAD Inc.

Maxtek Components Corp.

MBDA

John McClurg

MCE-KDI Integrated Products

MCE/KDI Integrated Products

MECA Electronics

Meca Electronics Inc. Denville, NJ

Meg Tredinnick and David Malanga

MegaPhase

MegaPhase LLC

Mehdi Nosrati, Islamic Azad University (IAU), Ilam Branch, Iran, Mojgan Daneshmand, University of Alberta, Edmonton, Alberta, Canada

Melissa Cortez, MegaPhase, Stroudsburg, PA

Meller Optics Inc.

MEM Research

Mendy Ouzillou, Scintera; Arwyn Roberts, TriQuint Semiconductor

Meng-Chung Tsai, Huey-Ru Chuang

Mentor Graphics

Mentor Graphics Corp.

Mercury Computer Systems Inc.

Mercury Systems Inc.

Meridian Medical Systems

Merrimac Industries Inc.

Mesa Microwave Corp.

MESL Microwave

MESL Microwave/Link Microtek

Messe München GmbH

Messe München International India Pvt. Ltd.

Mesuro

Mesuro Ltd.

MET Laboratories

MFG Galileo Composites

MI Technologies

Mi-Young Lee, Chan-Young Jeong, Jae-Woo Park, Changsik Yoo, Hanyang University, Seoul, Korea; Jin-Soo Park, Samsung Advanced Institute of Technology,

Mic

Michael

Michael Ashman and Inder Bahl, M/A-COM Inc. Roanoke, VA

Michael Case

Michael Casper, President/CEO UltraSource, Inc.

Michael Casper, President/CEO, UltraSource Inc.

Michael D. Foegelle, ETS-Lindgren

Michael D. Foegelle, ETS-Lindgren, L.P.

Michael D. McKinley and Kate A. Remley, National Inst. of Standards and Technology, Boulder, CO; Maciej Myslinski, Katholieke Universiteit, Leuven, Be

Michael Heimlich, Applide Wave Research Inc.

Michael Heimlich, Macquarie University and Joseph Gering, RFMD

Michael Hiebel

Michael Hiebel, Rohde & Schwarz

Michael J. Hannon and Pat Malloy

Michael Keeley, Spirent Communications

Michael Kettner, Patrick Biebersmith, Nelson Roldan and Balram K. Sharma

Michael Knox, Mode 1 Corp. Ben Zarlingo, Agilent Technologies

Michael Lawton and Peter Cain, Agilent Technologies Inc., Santa Clara, CA

Michael Millhaem

Michael O'Brien

Michael Oberle, Schmid & Partner Engineering AG Zurich, Switzerland

Michael Obrien

Michael Parnes

Michael Puttre

Michael S. Heutmaker

Michael Sieber and Attila Simon, European Defence Agency (EDA)

Michael Weizmann

Michal Fiszer and Jerzy Gruszczynski

Michal Fiszer, Collegium Civitas, Warsaw, Poland

Michal Grabowski

Michal Odyniec

Michel M. Bègue, Agilent Technologies Inc.

Mician

Mician GmbH

Micralyne Inc.

Micro Lambda Inc.

Micro Lambda Wireless Inc.

Micro Lambda Wireless Inc., Fremont, CA

Micro Metalsmiths Ltd.

Micro Modular Technologies

Micro Systems Inc.

Micro-Ant Inc.

Micro-Coax

Micro-Coax, Pottstown, PA

Micro-Precision Technlogies Inc. (MPT)

Micro-Precision Technologies Inc.

Micro-Precision Technologies Inc. (MPT)

Microlab

Microlab/FXR

Microlease

Micromanipulator Co.

Micronetics

Micronetics Inc.

microRF Europe

Microsemi

Microsemi Corp.

Microsemi Corp.

Microsemi Corp. and Advanced Power Technology Inc.

Microsemi Corporation

Microsource Inc.

Microwave Components and Systems

Microwave dB

Microwave Development Labs

Microwave Flash

Microwave Hournal

Microwave Innovation Group

Microwave Innovation Group (MIG)

Microwave Innovation Group GmbH & Co. KG

Microwave Jounal

Microwave Jounral

Microwave Journal

Microwave Journal Staff

Microwave Marketing Ltd./Linwave Technology

Microwave Solutions Inc.

Microwave Staff

MicroWave Technology Inc.

MicroWave Technology Inc. (MwT)

Microwave Theory and Techniques Society

Microwave Vision

Microwave Vision Group, ORBIT/FR, Horsham, PA

Microwwave Journal Staff

Micrwoave Journal

Mike

Mike Greenelsh

Mike Heimlich, AWR Corp.

Mike Lincoln

Mike Lincoln, TriQuint Semiconductor Product Marketing

Mike O'Brien

Mike Obrien

Mike Santori, National Instruments; Jean Dassonville and Phil Lorch, Agilent Technologies; and Dave Hutton, Aeroflex

Mike Scarione, Nick Kolias, Michael Booen, Raytheon Co.; David McLaughlin, University of Massachusetts; M.C. Frank Chang, University of California at

MILCOM

MILCOM 2009

Millennium Research Group

MILMEGA

MILMEGA Ltd.

Mimix

Mimix Asia

Mimix Broadband

Mimix Broadband Inc.

Mimix Broadband Inc., Houston, TX

Mimix Broadband, Houston, TX

Mimix Broadband, Inc.

MIMOtech

Mindspeed

Minh-Chau Huynh and Warren Stutzman, Virginia Tech Antenna Group

Mini-Circuits

Mini-Circuits Brooklyn, NY

Mini-Circuits, Brooklyn, NY

Mini-Circuits, Brooklyn, N.Y.

Mirin Lew

Mirin Lew, Agilent Technologies

Mitchell Lazarus

MITEQ

MITEQ Inc.

MITEQ Inc., Hauppauge, NY

Mitsubishi Electric Corporation, Tokyo, Japan

Mobile Experts

Modelithics

Modelithics and Taconic

Modelithics Inc.

Modelithics Inc. and Dielectric Laboratories Inc.

Mohamed Kameche, Centre National des Techniques Spatiales (CNTS), Algeria

Mohamed Sanad and Noha Hassan

Mohamed Sanad, Amant-Antennas, Giza, Egypt; Noha Hassan, Cairo University, Cairo, Egypt

Mohamed Sayed, ARFTG Conference Chair

Mohammad Madihian, General Chairman, 2007 Radio and Wireless Symposium

Mohsen Hayati and Azadeh Khajavi Razi University, Kermanshah, Iran

Mohsen Hayati, Sohrab Majidifar and Omid Sadeghi Fathabadi, Razi University

Molex

Molex Inc.

Molly Heyward, Strand Marketing

Monica Paolini, Senza Fili Consulting

Monika Roth, press@rohde-schwarz.com

Moray Rumney

Moray Rumney, Agilent Technologies

Moray Rumney, Agilent Technologies Inc.

Morris Engelson

Morris Engleson and Len Garrett

Morten Hagensen, Guided Wave Technology ApS, Hilleroed, Denmark, Anders Edquist, ANSYS Inc., Canonsburg, PA

Motorola

Motorola Inc.

Motorola Semiconducteurs S.A.S.

MRCM GmbH

MSC Vertriebs/Micro Crystal AG

MTI-Milliren Technologies Inc.

MtronPTI

Muddaser Mohiyuddin, Rathna Kumar M, Jacob Mathew, Puneet Kumar Pandey, ISRO Satellite Centre

Multigig

Munkyo Seo, Joo-Yeol Lee, Kyung-Kuk Lee and Sangwook Nam

Murat Eron

Murata

Murata Electronics North America

Murata Electronics North America Inc.

Murata Manufacturing Co. Ltd.

Bob Muro, Wireless Telecom Group

MW Journal staff

MWJ

MWJ Ediorial Staff

MWJ Editorial Staff

MWJ Editors

MWJ Staff

MwT Inc.

MX-COM Inc.

My Le Truong

Myrianne Regis, Hugues Lafontaine, Steve Kovacic, Gilles Cibiel, Olivier Llopis

N

N. Benahmed and M. Feham

N. Benahmed and S. Seghier, University of Tlemcen

N. Logan, J.M. Noras and J.G. Gardiner, Alcatel-Lucent

N. Sainz, I. Gutierrez, A. Muñoz and J. de Nó, TECNUN; E. Hernández and A. Garciá-Alonso, CEIT

N.D. du Toit, R. Thomas, J.H. Smith, F.N. Schirk and J.A. Mogel, AR RF/Microwave Instrumentation Souderton, PA

N.M. Ridler, National Physical Laboratory (NPL) Teddington, UK; R.A. Ginley, National Institute of Standards and Technology (NIST), Boulder, CO

Na-Fu Wang and Yu-Zen Tsai, Cheng Shiu University, Taiwan; Tseng Tang, National University of Tainan; Mau-Phon Houng, Institute of Microelectronics, N

Naftali Herscovici

Nan-Lei Larry Wang

Nano Materials International Corp.

Nano Materials International, Tucson, AZ

Narda

Narda Microwave

Narda Microwave-East

Narda Safety Test Solutions

Felix P Nater

Nathan Burley, Ovum

National Association of Broadcasters

National Instruments

National IT and Telecom Agency

National Semiconductor

NDK

Nearfield Systems Inc.

Nearfield Systems Inc., Torrance, CA

NEC

NEC America Inc.

NEC and Renesas

NEC Corp.

NEC Corp. of America

NEC Electronics (Europe) GmbH

NEC Electronics Europe

NEL

NEL Frequency Controls Inc.

Nemai C. Kamakar and Marek E. Bialkowski

Nemai Chandra Karmakar and Mohammad Nurunnabi Mollah, Nanyang Technological University

Nemai Chandra Karmakar, Monash University; Mohammad Nurunnabi Mollah, Nanyang Technological University

Nenad PopoviĆ and Ivana RadnoviĆ; IMTEL Institute, Belgrade, Serbia

New York University

Newtec

Newtec and Quantis

Newtec/SES

Newtec/Vizada Networks

Nexius

Nexyn Corp.

nGimat Co.

NGMN

NIC

Nicholas Cannon

Nicholas Cannon, Anritsu Co., Morgan Hill, CA

Nickander J. Damaskos and Benuel J. Kelsall, Damaskos Inc.

Nickander J. Damaskos, Benuel J. Kelsall and James E. Powell, Jr. Damaskos Inc., Concordville, PA

Nickolas Kingsley, Auriga Measurement Systems

Nigel Bowes, Credowan Limited

Nils Heininger, LPKF Laser & Electronics AG

NIT DOCOMO

Nitero

Nitronex

NITRONEX Corp.

Nkorni Katte, Joseph Haus, Jean-Bosco Serushema, Michael Scalora

NMDG

Noise Com Inc.

Noise XT

Noisecom

NoiseWave

Nokia

Nokia Siemens Networks

Nokia Siemens Networks/Motorola

Noman Rangwala and Rick Myers; Analog Devices Inc., Norwood, MA

Norden Millimeter Inc.

Nordic Semiconductor

Norsat International

Norsat International Inc.

Northrop Grumman

Novatel Wireless

Novotronik

NRL

NRL, Arne Fliflet and M. Ashraf Imam

NTT DOCOMO

Nuhertz Technologies

Nujira

Nujira and TriQuint Semiconductor

Nujira/KCB Signal Solutions

Nujira/Xilinx

Numerical Innovations

Nuno Borges de Carvalho and Jose Carlos Pedro

Nurad Technologies Inc.

NuSil Technology LLC

Nuvotronics LLC

NuWaves Engineering

NXP

NXP Semiconductors

NXP Semiconductors and STMicroelectronics

NXP Semiconductors N.V.

NXP Semiconductors, Eindhoven, The Netherlands

NXP Semiconductors, Eindhoven, The Netherlands

Nynex/Newtec

O

O.K. Jensen, T.E. Kolding, C.R. Iversen, S. Laursen, R.V. Reynisson, J.H. Mikkelsen, E. Pedersen, M.B. Jenner and T. Larsen

Objective Interface Systems Inc.

OctoScope Inc.

octoScope Inc.

ODIN

OEWaves

OEwaves Inc.

Oleksandr Gorbachov

Oleksandr Gorbachov and Yie-Der Shen

Oleksandr Gorbachov STMicroelectronics Taipei, Taiwan, ROC

Oleksandr Gorbachov, Independent Contractor and Mario Paparo STMicroelectronics, Catania, Italy

Oleksandr Gorbachov, Leonid Kasatkin

Oleksandr Gorbachov, STMicroelectronics

Oleson Microwave Labs (OML)

Gopinath Gampala and C.J. Reddy, EM Software & Systems (USA) Inc., Hampton, VA; Oliver Stabler and Thomas Hager, AWE Communications GmbH, Boeblingen, Germany

Olli Pekonen, Arvi Karhumaki and Martti Valtonen

Omid Sotoudeh, Sony Ericsson Mobile Communications; Tilmann Wittig, CST GmbH

OML (Oleson Microwave Labs), Morgan Hill, CA

OML Inc.

OML Inc., Morgan Hill, CA

OMMIC

OMMIC, Paris, France

Omron Electronic Components LLC

ON Semiconductor

ONR

Onyx EMS LLC

Ooredoo

OpenET Alliance

Optotek Ltd.

Orbit

ORBIT Communication Systems

ORBIT Communication Systems Inc.

ORBIT Communication Systems Ltd.

ORBIT Communications Systems

Orbit Technologies

Orbit Technologies Ltd.

Orbit Technology Group

ORBIT/FR

ORBIT/FR - Europe GmbH

ORBIT/FR Israel

Erik Org

Erik Org

Oscilent

Oscilloquartz SA

Osprey Metals Ltd.

OSU Research Communications

OVUM

P

P. Angeletti, European Space Agency, and M. Lisi, Telespazio

P. Asbeck, J. Mink, T. Itoh and G. Haddad

P. Heymann, R. Doerner and M. Rudolph

P.C.A. Hammes, H.F.F. Jos, F. van Rijs, S.J.C.H. Theeuwen and K. Vennema, Philips Semiconductors

P.K. Jain, Space Applications Centre (ISRO), Ahmedabad, India

P.S. Neelakanta, A.K. Stampalia and D. De Groff, Florida Atlantic University

P.S. Neelakanta, Jesada Sivaraks, Charoonkierti Thammakoranonta

P.S. Neelakanta, W. Preedalumpabut and S. Morgera, Florida Atlantic University

P1dB

Paciwave Inc., Sunnyvale, CA

Palomar Technologies

Panasonic

Panasonic Corp. and Renesas Technology Corp.

Pankaj Goyal, National Semiconductor

Paolo Arcioni, Rinaldo Castello, Luca Perregrini, Enrico Sacchi and Francesco Svelto

Paolo Lampariello, General Chairman, EuMW 2009; Ivar Bazzy, President, Horizon House Publications

Paradigm Services

Paratek

Paratek and STMicroelectronics

Paratek Microwave

Paratek Microwave Inc.

Paricon Technologies Corp

Park Electrochemical Corp.

Park Electrochemical Corp., Melville. N.Y.

Parker Hannifin Corp.

Pascall

Pascall Electronics Ltd.

Pascall Electronics Ltd.

Pasquale Dottorato

Passive Plus

Passive Plus Inc.

Pasternack Enterprises Inc.

Pat Hindle

Pat Hindle and Kristen Anderson, MWJ Staff

Pat Hindle, Editor, Microwave Journal

Pat Hindle, Microwave Journal

Pat Hindle, Microwave Journal Technical Editor

Pat Hindle, Technical Editor

Pat Hindle, Technical Editor, Microwave Journal

Patric Heide

Patrick Hindle

Patrick Hindle - Editor, Microwave Journal

Patrick Hindle and Jennifer DiMarco

Patrick Hindle, Microwave Journal Technical Editor

Patrick Hindle, Technical Editor, Microwave Journal

Patrick Hindle; Editor, Microwave Journal

Patrick J. Sullivan, Walter H. Ku and Bernard A. Xavier

Patrick Naraine and Chandra Mohan, Skyworks Solutions Inc., Woburn, MA

Patrick Naraine, Skyworks Solutions Inc.

Patrick Robbins, Micronetics Inc.

Patrizia Mühlbauer, press@rohde-schwarz.com

Patrizia Mühlbauer, Rohde & Schwarz

Paul A. Crandell & Fredrick J. Dominick

Paul Chiavacci

Paul Colestock

Paul Colestock, Agilent EEsof EDA

Paul Mattheijssen, NXP Semiconductors, Eindhoven, The Netherlands

Paul Pino, W. L. Gore & Associates Inc., Landenberg, PA

Paul Pino, W.L. Gore & Associates Inc. Elkton, MD

Paul Pino, W.L. Gore & Associates Inc., Landenberg, PA

Paul Pino, W.L. Gore and Associates Inc.

PCTEL Inc.

Pedro Miguel Cabral, José Carlos Pedro and Nuno Borges Carvalho

Pendulum

Pendulum Instruments

Pendulum Instruments AB

Pengcheng Jia, CAP Wireless Inc.

Pengfei Zhang, RF Micro Devices

Pentek Inc.

Per Viklund

Per Viklund, Mentor Graphics and How-Siang Yap, Agilent

Per Viklund, Mentor Graphics; How-Siang Yap, Agilent Technologies Inc.

Peregrine

Peregrine Semiconductor

Peregrine Semiconductor Corp.

Peregrine Semiconductor Corp., San Diego, CA

Peregrine Semiconductor, San Diego, CA

Permac Electronics

Perry M. Malouf, Ph.D. and Robert E. Wallis, Johns Hopkins University Applied Physics Laboratory

Peter Bacon, Chandra Mohan, David Fryklund and Peter Zampardi, Skyworks Solutions Inc.

Peter Barnwell, Michael O'Neill and Charles Sabo

Peter Cain, Agilent

Peter Hoogeboom

Peter Ladbrooke and James Bridge

Peter Shveshkeyev

Peter Staecker

Peter von Nordheim, Spectrum Elektrotechnik GmbH, Munich, Germany

Peter Y. Hong

Petteri Alinikula

PH

Phase Matrix

Phase Matrix Inc., San Jose, CA

Phil Leslie

Philip F. Dindo

Philip M. Fabis

Philippe Eudeline, EuRAD 2010, Conference Chairman

Philips Semiconductor

Philips Semiconductors

Philsar Electronics Inc.

Phoenix Microwave Corp.

phys.org

Pickering Interfaces

Pico Technology

picoChip

Picochip/Wavesat

Piconics and Modelithics

Piconics Inc.

Picosecond Pulse Labs, Boulder, CO

Piero Angeletti and Marco Lisi, European Space Agency, Noordwijk ZH, The Netherlands

Pierre Bertram, Thales Air Defense

Pierre Piel

Pierre Piel, Wayne Burger, David Burdeaux, Warren Brakensiek, Freescale Semiconductor

Piet van Genderen, General Chairman; Charles Ayotte, Horizon House Publications Inc.

Pike Research

Ping Hui, Nokia Mobile Phones

Ping Yin, RF Micro Devices Inc.

Planar Electronics Technology

Planar Electronics Technology Inc. Frederick, MD

Planar Filter Co.

Planar LLC

Planar Monolithics Industries

Planar Monolithics Industries and AmpliTech

Planar Monolithics Industries Inc.

Platronics

Plessey Semiconductors

Plessey Semiconductors Ltd.

Plextek

Ploughshare Innovations

PMI and AmpliTech

PMR

PMT

Point 35 Microstructures

Polaris Networks

Polaris Wireless

Pole/Zero

Polese Co.

Polytechnic Institute of NYU (NYU-Poly)

Poseidon Scientific Instruments Pty Ltd.

Power Module Technology

Power Module Technology, Carson City, NV

PPC

Pravin Patel, Rubina Ahmed, Moises Cases -IBM; Gourgen Oganessyan, Quellan; Dave Dunham, Molex

Precision Devices

precisionWave Corp.

Premix Oy

Presented by COMSOL

Princeton Electronic Systems Inc. (PES)

PrismTech

PRNewswire

Production Team

Programmed Test Sources (PTS)

Programmed Test Sources Inc.

Programmed Test Sources Inc. (PTS)

Pronghorn Solutions

Protek

Protek Inc.

Protium Technologies Inc.

Provigent

Pulsar Microwave Corp.

Pulse

Pulse Electronics Corp.

PureWave Networks Inc.

Q

Q-par Angus Ltd.

Qian Cheng, Chen Yiyuan and Zhu Xiaowei

Qian Wang, Cheng Yuan and Yasen Huang, Southeast University; Jianjun Gao, East China Normal University

Qiang Wu, Heng Xiao and Fu Li

QinetiQ

Qiu-Huan Huang, Dar-Ron Huang and Huey-Ru Chuang, National Cheng Kung University

Qosmotec

QPER

QUALCOMM

Qualcomm Inc.

QuarterBranch Technologies Inc.

Quartzlock

Quartzlock (UK) Ltd. Totnes, Devon, UK

Quartzlock UK Ltd.

Quectel Wireless Solutions/MSC Vertriebs

Queen’s University Belfast

R

R. Banham, G. Valsecchi, Lucci, G. Pelosi, S. Selleri, V. Natale, R. Nesti, and G. Tofani

R. Chair, A.A. Kishk, K.F. Lee and D. Kajfez, University of Mississippi

R. Fuks and A. Weirback, Astrolab Inc.

R. Fulcoli, M. Sedehi, E. Tilli and L. Timmoneri, SELEX Sistemi Integrati, Rome, Italy

R. Giofre, L. Piazzon, P. Colantonio and F. Giannini, University of Tor Vergata

R. Kumar, N. Gupta and K.P.M. Bhat, Institute of Armament Technology

R. Lai, H. Wang, Y.C. Chen, T. Block, P.H. Liu, D.C. Streit. D. Tran. M. Barsky, W. Jones, P. Siegel and T. Gaier

R. Tayrani, Raytheon Space & Airborne Systems

R. Wolf, A. Joseph, P. Rabbeni and J. Dunn, IBM Microelectronics Division Essex Junction, VT

R.A. Abd-Alhameed, D. Zhou, N.J. McEwan, P.S. Excell and A. Ghorbani

R.A. Abd-Alhameed, M. Zewani, P.S. Excell, J.G. Gardiner and N.J. McEwan, Bradford University; N.T. Ali, Etisalat Polytechnic

R.A. Abd-Alhameed, P.S. Excell and J.G. Gardiner, Bradford University;

R.C. Hansen

R.C. Hansen, Associate Editor MWJ (Dec. 1978)

R&D Microwaves

R&S

Racal Instruments Limited

Racal Instruments Wireless Solutions, an Aeroflex company Slough, UK

Rachid El Assir, Rohde & Schwarz

Radiall

Radiall Inc.

Radiall USA

Radiall USA Inc., Chandler, AZ; Radiall France, Rosny sous Bois (Paris), France

Radio Design Group Inc.

Radio Engineering Services

Radio Frequency Systems

Radio Waves

Radio Waves Inc.

Raffaele Persico and Francesco Soldovieri

Rafi Hershtig and Tim Dolan, 2011 MicroApps Co-Chairmen

Rafi Hershtig, K&L Microwave

Raghavendra G. Kulkarni

Raj Kumar, N. Gupta and K.P.M. Bhat, Institute of Armament Technology; R. Sreehari Rao, Defence Electronics Research Laboratory

Rajanish, P. Onno and N. Jain, Anokiwave Inc.,San Diego, CA; C. Weigand, P. McIntosh and B. Rizzi, M/A-COM Inc.,Lowell, MA; K. Izzac, Paratek Microwav

Rakon

Ralf Kakerow, Continental Automotive and Matthias Tröscher, CST Munich, Germany

Ralph Levy

Randall North, David Kennedy and Mike Murphy

Randall Rhea

Randall W. Rhea

Randy Cochran, Phil Knights, Jarek Lucek - NXP

Randy Haupt, Utah State University

Randy J. Richards and Hector J. De Santos

Randy Rhea and Bill Clausen, Eagleware Corp.

Randy Rhea, Susina LLC

Randy Rhea. Susina LLC

Ranfy Haupt and Hugh Southall

Ravinder Gill, Gigatronics

Ravish R. Shah, Amit Patel, Ved Vyas Dwivedi and Hitesh B. Pandya

Ray Crampton

Ray Schwartz, Cobham DES M/A-COM

Raymond Quéré and Charles A. Ayotte

Raymond Schwartz and Peter Waltz, Cobham Defense Systems, Microwave Components, Exeter, NH

RAYSPAN Corp.

Raytheon

Raytheon Co.

Raytheon Microelectronics

RDECOM CERDEC Public Affairs

RDL Inc.

Reactel

Reactel Inc.

Redline Communications

Reeves-Hoffman Inc.

Regina Gani and Grant A. Ellis, Universiti Teknologi Petronas Perak, Malaysia; Teoh Chin Soon, DreamCore Technologies, Malaysia

RelComm Technologies

RelComm Technologies Inc.

Remcom

Remcom Inc

Remcom Inc.

Remcom Inc., State College Park, PA

REMEC Magnum INC.

Remtec

Remtec Inc.

Renaissance Electronics

Renaissance Electronics Corp.

Renaissance Electronics Corp. (REC)

Renaissance Electronics Corp./HXI

Renee Z. Jones and Bruce A. Kopp

Renesas Electronics

Renesas Electronics Corp.

Renesas Electronics Europe

Renesas Mobile Corporation

Res-Net Microwave Inc.

Research and Markets

Response Microwave Inc.

Reto Germann, HUBER+SUHNER AG, Herisau, Switzerland

Reuters

Reza Firoozabadi, Airvana Network Solutions and Eric L. Miller, Tufts University

Reza Kamali-Sarvestani, Rowan University, Glassboro, NJ and John D. Williams, UAHuntsville, Huntsville, AL

RF & MW Components Group, M/A-COM Inc.

RF Engines Ltd.

RF Industries

RF Industries Ltd.

RF Micro Devices

RF Micro Devices Inc.

RF Micro Devices, Greensboro, NC

RF Microtech

RF Monolithics Inc.

RF Power Components

RF Prime Corp.

RF Systems

RFaxis

RFCONNEXT Inc.

RFCONNEXT inc., San Jose, CA

RFEL

RFHIC

RFHIC Corp.

RFHIC Corporation, Suwon, Korea

RFHIC, Suwon, Korea

RFI

RFI Global Services

RFI Global Services Ltd.

RFIC

RFMD

RFMD Inc.

RFMD, Greensboro, NC

RFMD®, Greensboro, NC

RFMW

RFMW and Aeroflex-Metelics

RFMW Ltd.

rgwergre

Rhode & Schwarz

Rice University

Richard Chen, Neal Mellen, Makoto Shibata and Masahiro Miyazaki, TDK Corp.

Richard F. Bilotta

Richard F. Schwartz

Richard Fiore

Richard G. Ranson

Richard Harlan, Director of Technical Marketing, ParkerVision

Richard I. Harrison, General Telephone and Electronics Labs Inc.

Richard Mumford

Richard Mumford and Jennifer DiMarco, Microwave Journal staff

Richard Mumford and MWJ Staff

Richard Mumford Microwave Journal European Editor

Richard Mumford, European Editor

Richard Mumford, European Editor, Microwave Journal

Richard Mumford, International Editor

Richard Mumford, International Editor – Microwave Journal

Richard Mumford, International Editor, Microwave Journal

Richard Mumford, Microwave Journal

Richard Mumford, Microwave Journal European Editor

Richard Mumford, Microwave Journal European Editor

Richard Mumford, Microwave Journal International Editor

Richard Mumford, Microwave Journal International Editor

Richard Mumford, Microwave Journal, International Editor

Richard Mumford, Microwave Journal’s International Editor

Richard Mumford, MWJ International Editor

Richard Mumford/ARMMS

Richard Remski

Richard V. Snyder

Richardson

Richardson Electronics

Richardson Electronics Inc.

Richardson Electronics Ltd.

Richardson Electronics, Ltd.

Richardson RFPD

Richardson RFPD Inc.

Richardson RFPD, Inc., LaFox, IL

RichardsonRFPD Inc.

Rick Hartman and Tom Bell Kaelus, Smiths Interconnect, Denver, CO

Rick Hartman, Kaelus Inc., Thousand Oaks, CA

Rigol Technologies Inc.

Rikard Eliasson, Anders Sundberg and Anders Wall

Diane Ritchey

RJR Polymers

RLC

RLC Electronics

RLC Electronics Inc.

Rob Lefebvre

Rob Van Brunt

Robab Kazemi, R. Ali Sadeghzadeh, and Reza Fatemi Mofrad, K. N. Toosi University of Technology

Robab Kazemi, R. Ali Sadeghzadeh, Reza Fatemi Mofrad and K.N. Toosi, University of Technology

Robert Grossbach

Robert Gubser and David Kenny, Pletronics Inc.

Robert Gunnels

Robert H. Caverly, Nikolai V. Drozdovski and Michael J. Quinn

Robert P. Bernardo, Micro Networks

Robert Plana, CNRS

Robert Syputa, Senior Analyst, Maravedis

Robert Wagner, Javelin Semiconductor

Roberto Sorrentino

Roberto Sorrentino and Andre Vander Vorst, European Microwave Association

Rochester Electronics

Rockwell Collins

Rodger Billings and Tony Edridge, M2 Global Technology Ltd.

ROG of Rogers Corp (aka John Coonrod)

Roger Clarke

Roger Hill

Rogers

Rogers Corp.

Rogers Corp., Advanced Circuit Materials Division Chandler, AZ

Rogers Corp., Chandler, AZ

Rogers Corp., Rogers, CT

Rohde & Schwarz

Rohde & Schwarz

Rohde & Schwarz

Rohde & Schwarz GmbH & Co. KG

Rohde & Schwarz Professional

Rohde & Schwarz, Munich, Germany

Rohde & Schwarz/Synopsys

Rohde & Schwarz/u-blox

Roke Manor Research

Roke Manor Research Ltd.

Roland Hassun

Roland Hassun, Roland Hassun Consulting

Rolf Jakoby, European Microwave Conference 2007 Chairman

Ron Demcko

Ron Demcko, AVX Applications Engineer

Ron Rausch and Mark Buffo, Keithley Instruments Inc., Cleveland, OH

Ron Williamson Aeroflex Test Solutions, Plainview, NY

Ronald A. Marino

Ronald A. Marino and Wesley Hearst

Ronen Holtzman, Elisra

Ronen Holtzman, Elisra Electronic Systems Ltd., Bene Beraq, Israel

Rosenberger

Rosenberger Hochfrequenztechnik

Rosenberger Hochfrequenztechnik Gm, Fridolfing, Germany

Rosenberger Hochfrequenztechnik, Tittmoning, Germany

Rosenberger Hochrfrequenztechnik GmbH & Co KG

Rosenberger of North America

Rosenberger of North America LLC

Royal Philips Electronics

RT Logic

RTX and SiTel

Rudy Fuks

Rudy Fuks, Astrolab Inc., Warren, NJ

Rui Wang and Jun Xu, University of Electronic Science and Technology of China, Chengdu, China

Ruska Patton and Ning Yang, EMSCAN Corp., Calgary, Canada

Russ Alm (ALC), Dave Strand (Strand Mktg)

Ruth Jackson

S

S C Bera, R V Singh and V K Garg

S. Aich, J. Dhar, S.K. Garg, B.V. Bakori and R.K. Arora, Space Applications Center, ISRO, Ahmedabad, India

S. Azam, C. Svensson and Q. Wahab, Linköping University, Linköping, Sweden; R. Jonsson, Swedish Defense Research Agency Linköping, Sweden

S. Korneev, S. Alyakrinsky.

S. M. Stout-Grandy, J.S. Wight, A. Petosa, I.V. Minin and O.V. Minin

S. Yoo, M.R. Murti, D. Heo and J. Laskar

S.C. Bera and R.V. Singh, Space Applications Centre (ISRO)

S.C. Bera, P.S. Bharadwaj, R.V. Singh and V.K. Garg, Space Applications Center

S.C. Bera, R.V. Singh and V.K. Garg

S.C. Bera, R.V. Singh and V.K. Garg, ISRO

S.C. Bera, R.V. Singh and V.K. Garg, Space Applications Centre (ISRO)

S.C. Bera, R.V. Singh, V.K. Garg Space Applications Centre, ISRO Ahmedabad, India

S.F. Ooi, S. Gao, A. Sambell, D. Smith and P. Butterworth, University of Northumbria

S.J. Caprio, Laurel, MD

S.J.C.H. Theeuwen, J.A.M. de Boet, V.J. Bloem and W.J.A.M. Sneijers, NXP Semiconductors

S.K. Lee, A. Sambell, E. Korolkiewicz, S.F. Loh, S.F. Ooi and Y. Qin

S.P. Yeo and M. Cheng

S.S. Riaz Ahamed

S.Y. Lin, H.R. Chuang and T.S. Horng

Saab

Saab AB

Saab Sensis

Sabritec

Sage Laboratories

Sage Laboratories Inc.

SAGE Millimeter Inc.

Salam Dindo

Salisbury Engineering Inc.

Sam Bookman

Sami Bousnina, PolyGrames Research Center

Samir El-Ghazaly

Samo Vehovc

Samsung

HYUNGCHUL KIM, HANJIN CHO, MIN-SU KIM, MINCHEOL SEO, JUNGHYUN HAM, CHEON-SEOK PARK & YOUNGOO YANG, SUNGKYUNKWAN UNIVERSITY, SUWONG, KOREA YAO XI, SAMSUNG ELECTRONICS, KIHEUNG, KOREA SUNGCHAN JUNG, SAMSUNG TECHWIN, SUNGNAM, KOREA

Samuel C. Yang

San-tron

San-tron Inc.

Sandeep Palreddy and Rudolf Cheung, Microwave Engineering Corp. North Andover, MA

Sandy Fraser, Agilent Technologies Inc.

Sang Hyun Park Chung-Ang University Seoul, Korea

Sang Won Kim, Han Yu Cho, Young Kim, Ik Soo Chang and Won Woo Lee

Sang-Tae Kim, Jong-Soo Lim and Kyoung-Rok Cho

Sang-Tae Kim, Jong-Soo Lim, Kyoung-Rok Cho

Sanggee Kang, Heonjin Hong and Sungyong Hong

Sangshin Elecom

Sanjay Moghe, Babak Matinpour, and Drayton Avera, RF Solutions Inc.

Sapphicon and AWR

SATELLITE 2011

SATIMO (Nicolas Gross. Alessandro Scannavini and Meryam Abou el Anouar) MI Technologies (Derek Skousen)

SATIMO Industries, Villebon-sur-Yvette, France

Sawtek Inc.

Sawtek, Inc.

Scalable Network Technologies

Scalable Network Technologies Inc.

Scalable Network Technologies Inc. and VT MAK

Schmid & Partner Engineering AG

Schmid & Partner Engineering AG (SPEAG)

Schmid & Partner Engineering AG (SPEAG), Zurich, Switzerland

SCHOTT

SCHOTT Electronic Packaging

Science and Technology Facilities Council

Science and Technology Facilities Council’s

Scintera

Scintera Networks Inc.

Scintera, Sunnyvale, CA

Scott Gibson, Symmetricom Inc., San Jose, CA

Scott Wartenberg

Scott Wartenberg, RF Micro Devices

Scott Wedge, Evgeny Wasserman and David Neilson

Scott Wood, Milestone Marketing Inc.

Sean Buckley

Sean Buckley, Telecommunications

Sean Cordone, ISCO International, Elk Grove Village, IL

Sean Cordone, Vice President of Engineering

Sean Thompson, National Instruments

Seikoh Giken Co. Ltd.

Select Fabricators Inc.

Selex ES

Selex Galileo

SELEX Sistemi Integrati

SELEX Systems Integration

SEMA Industries

Sematron

SemiGen

SemiGen Inc.

Semtech Corp.

SenarioTek

Senglee Foo

SenSyTech Inc.

Seok Kyun Park, Ik Soo Chang, Yun Seo Choi, Jun Won Huh, Young Kim

Seong-Jun Kangand Hee-Yong Hwang, Kangwon National University Chuncheon, Korea

Seong-Sik Myoung and Jong-Gwan Yook, Yonsei University

Seongryong Yoo and Sungtek Kahng, University of Incheon, Incheon, Korea; Jong-Guk Kim, LG Innotek Co. Ltd., Ansan, Korea

Septentrio/QinetiQ

Seste Dell'Aera and Tom Riley, Kaben Research Inc.

Seste Dell'Aera and Tom Riley, Kaben Research Inc., Osgoode, Ontario, Canada

SETCOM Wireless

Shahar Peleg, Siklu

Shailender Timiri

Shane Collins and Kieran Flynn

Shaun Cummins, Nujira Limited, Cambridge, UK

Shaun McFall, Harris Stratex Networks, San Jose, CA

Shawn Cheadle, Cougar Components Corp.

Shawn Cheadle, Lockheed Martin Space Systems, Denver, CO

Shawn Cheadle, Teledyne Cougar Inc

Shawn P. Stapleton

Shay Gross, Lawrence P. Dunleavy and Thomas M. Weller

Carl Sheffres

Sheng Zhang, China University of Mining and Technology

Sheng Zhang, Jian-Kang Xiao and Ying Li, Shanghai University

Sheng Zhang, Jian-Kang Xiao, Zi-Hua Wang and Ying Li, Shanghai University Shanghai, China

Sheng Zhang, Tian-Jian Bian and Yao Zhai, China University of Mining and Technology

Sherry Hess

Sherry Hess, AWR Corp.

Sherry Hess, VP Marketing, AWR Corp.

Sherry Hess, WIM Organizer

Shiwei Zhao, Zongxi Tang and Ping Su, University of Electronic Science and Technology of China, Chengdu, China

SHOW: A.T. Wall

SHUMIN WANG AND HAI L, AUBURN UNIVERSITY, AUBURN, AL; C.J. REDDY, EM SOFTWARE & SYSTEMS (USA) INC., HAMPTON, VA

Shumin Wang, Hai Lu, Auburn University; C.J. Reddy, EM Software & Systems (USA) Inc.

SIAE MICROELETTRONICA S.P.A. Milan, Italy

SIAE MICROELETTRONICA, ErreBi Servizi and G&G Eléctronique

Siemens

Siemens AG

Siemens Semiconductors

Sierra Nevada Corp.

SiGe Semiconductor Inc.

Sigma

Sigma Systems Corp.

Sigma Systems Corp., El Cajon, CA

Signal Technology Corp.

Siklu

Silicon Laboratories

Simon L. Cotton and William G. Scanlon Queen’s University Belfast, UK

Simon L. Cotton and William G. Scanlon, Queen's University of Belfast; Efstratios Skafidas, University of Melbourne; Bhopinder K. Madahar, Ministry of

Sirenza Microdevices

Sivers IMA

Sivers IMA AB

Sivers IMA AB, Kista, Sweden

Skylogic

Skyworks

Skyworks Solutions

Skyworks Solutions Inc.

Skyworks Solutions Inc. Woburn, MA

Skyworks Solutions Inc., Woburn, MA

Skyworks, Cork, Ireland

Smiths Group

SMITHS Group plc

Smiths Interconnect

Smiths Interconnect

Soitec

Solution Paper, Motorola

Somnath Mukherjee, Mridul K. Pal, Ralph Inducta

Somnath Mukherjee, RB Technology

Sonja R. Nedeljkovic, John R. McMacken, Paul J. Partyka and Joseph M. Gering, RFMD

Sonnet

Sonnet Software

Sonnet Software Inc.

Sonnet Software Inc., North Syracuse, NY

Sonoscan

Soo Deok Moon and Hee Yong Hwang, Kangwon National University

Sophia Hsu and Yusuke Tajima, ACCO USA Corp.

Sophia Wireless Inc.

Sophia Wireless Inc., Chantilly, VA

Southwest Microwave Inc.

Space Data Corp.

Spacek Labs Inc.

Special Hermetic Products Inc.

Specialist Microwave Solutions Ltd.

Specialty Coating Systems

Spectracom

Spectrum

Spectrum Control

Spectrum Control Inc.

Spectrum Elektrotechnik GmbH

Spectrum Microwave Delmar, DE

Spinnaker Microwave

SPINNER

SPINNER GmbH

Spinner GmbH and Precision Tube Co.

SPINNER GmbH, München, Germany

Spinner GmbH, Munich, Germany

Spirent

Spirent Communications

Spirent Communications plc

Spirent Communications, Sunnyvale, CA

Spirent/ETS-Lindgren

Spreadtrum Communications Inc.

SRC

SRC Inc.

SRCTec

SRI Connector Gage

Srikanth Sridharan

Srikanth Sridharan, Peregrine Semiconductor, San Diego, CA

SSI Cable Corp.

ST-Ericsson

St. D. Ilcev

St. D. Ilcev – Durban University of Technology (DUT)

St. D. Ilcev, Durban University of Technology (DUT)

Stackpole

Stacy Baniszewski, Allison Greco, James T. Walsh

staff

Standford Research Systems, Sunnyvale, CA

Stanford Telecom, Telecom Component Products Group

Stanislaw Alechno

State of the Art Inc.

Stealth Microwave

Steatite Q-par Antennas

Stefan Pongratz, Anritsu

Stefan Zehle

Stefanie Lucas, slucas@remcom.com

Stepan Lucyszyn, EuMC 2011 Conference Chair

Stephane Wloczysiak, Skyworks Solutions, Inc.

Stephanie Knight, Filtronic Compound Semiconductors Ltd.; Bill Johnson, Johnson Graphic Arts, San Francisco welcomes all IEEE

Stephen A. Maas

Stephen A. Maas and Ted Miracco

Stephen D. Turner, Teledyne Paradise Datacom, State College, PA; Tom Dekker, Cree Inc., Durham, NC

Stephen Heiser

Stephen McClelland

Stevan Preradovic and Nemai C. Karmakar Electrical & Computer Systems Engineering, Monash University

Steve C. Cripps

Steve Dudkiewicz, Maury Microwave Corp., Ontario, CA

Steve Egolf

Steve Fry, Greenray Industries Inc.

Steve Loyal

Steve Maas

Steve Maas, Applied Wave Research Inc.

Steve Maas, J. Delacueva, J. Li and S. White

Steve Murray , Keithley

Steve Reyes, DCM Industries Inc.

Steve Williams, RT Logic, an Integral Systems Company, Colorado Springs, CO

Steven Fry, Greenray Industries

Steven G. Pytel JR., PHD.

Steven Theeuwen, NXP Semiconductors

Stilwell Baker Inc.

STMicroelectronics

STMicroelectronics Inc.

STMicroelectronics/CMP

Storm Products

Strand Marketing

Strand Marketing Inc.

StratEdge

Strategy Analytics

Structural Research & Analysis Corp.

Stuart Little, Director of Global and Corporate Marketing of Aviat Networks

Stuart Little, Harris Stratex; Trevor Manning, TMC Global Ltd.

Stuart P. Litt

Sub10 Systems

Sub10 Systems/HUBER+SUHNER

Sumitomo Electric Device Innovations USA Inc.

Summitek Instruments

Summitek Instruments Inc., Englewood, CO

Sun-Sook Kim, Jong-Hwan Lee and Kyung-Whan Yeom, Chungnam National University

SunCastle Microwave LLC

Sunder Gopani

Sungchan Jung, Samsung Techwin

Sungtek Kahng and Dongjin Lim, University of Incheon, Incheon, Korea

Sungwoo

Superconductor Technologies Inc.

Surinder Kumar, Abbas Mohammadi and David Klymshyn

Surrey NanoSystems

SUSS

SUSS MicroTec

SUSS MicroTec Test System

SUSS MicroTec Test Systems

SUSS MicroTec Test Systems, Dresden, Germany

Suss/Rosenberger

SV Microwave

SV Microwave Inc., an Amphenol company, West Palm Beach, FL

SV Microwave, Commercial Products Group

SV Microwave, West Palm Beach, FL

SWE-DISH

Syfer Technology

Symmetricom

Symmetricom Inc.

Symmetricom® Inc.

Synergy Microwave Corp

Synergy Microwave Corp.

Synergy Microwave Corp., Paterson, NJ

Sypris Electronics/ Cassidian

Sypris Solutions Inc.

Sypris Test & Measurement Inc.

T

T. AlSharabati and Y. Chen, University of South Carolina, Columbia, SC

T. Jamsa, J. Malm<sup>1.</sup>; N. Gross, A. Scannavini<sup>2.</sup>

T. Johansson, P. Lundin, J. Engvall, D. Uggla and U. Hagström

T. Korosec, P. Ritosa, B. Batagelj and M. Vidmar University of Ljubljana, Slovenia

T. Santos, L. C. Costa, M. Valente, J. Monteiro, J. Sousa

T. Warnagiris, Southwest Research Institute

T.K. Tsang and M.N. El-Gamal, McGill University; W.S. Best, Triangle ElectroMagnetics LLC; H.J. De Los Santos, NanoMEMS Research LLC

Taconic

Taconic Advanced Dielectric Division

Taconic Advanced Dielectric Division, Petersburgh, NY

Tahoe RF Semiconductor

Tahoe RF Semiconductor Inc.

Tahoe RF Semiconductor, Auburn, CA

Taiwan Union Technology Corp.

Takao Ishida, Mitsubishi Electric Corp. Itami City, Hyogo, Japan

Tamarind Phinisee

Tampa Microwave

Tampa Microwave Inc., Tampa, FL

Tanbir Haque, Leonid Kazakevich and Alpaslan Demir, InterDigital Communications Corp.

Tanner EDA

Tapani Ryhänen, Mikko A. Uusitalo, Olli Ikkala and Asta Kärkkäinen

TASC Inc.

Tata Elxsi Ltd.

Tatsuo Itoh

Tatsuo Itoh, Technical Program Chair, IMS 2007

TDK-EPC

TE Connectivity

Tecdia, Santa Clara, CA

Tech Brief, Tektronix

Technical Communities

Technical Research and Manufacturing Inc. (TRM)

Technology Service Corp., Fairfax, VA

Techtrol Cyclonetics

TECOM

TECOM Industries Inc.

Tecore Networks

Ted Heil, Bill Roehrich and Jack Hakoupian

Ted McKenna, eDefense Online

Ted McKenna, Journal of Electronic Defense

Ted Miracco, Applied Wave Research Inc.

Ted Prema, Times Microwave Systems, Wallingford, CT

Ted Saad

Ted Saad and David Vye

Ted Saad, Harlan Howe, Jr., Peter Staecker and Glen Thoren Former IMS Chairmen Fred Schindler IMS Chairman 2009

TEGAM Inc.

Tektronix

Tektronix Application Note

Tektronix Component Solutions

Tektronix Inc.

Tektronix Service Solutions

Tektronix, Beaverton, OR

Tektronix, Inc.

Telecommunications

Telecommunications Magazine Staff

Telecommunications staff

Telecommunications Staff, from news sources

Teledyne Coax Switches

Teledyne Electronics and Communications Europe

Teledyne LeCroy

Teledyne Ltd.

Teledyne Microwave

Teledyne Relays

Teledyne Relays, a Teledyne Technologies company

Teledyne Reynolds UK

Teledyne Reynolds, Newbury, UK

Teledyne Storm Products

Teledyne Technologies Inc.

Telemakus

Telemakus LLC

TeliaSonera

Telit

Telit Communications

Telit Wireless Solutions

Telonic Berkeley Inc.

Temex

TEMWELL

Tensolite, a Carlisle company

Terence W. Barrett

Terma

Terma/Printca

Tero Ranta and Rodd Novak, Peregrine Semiconductor

Terry Edwards

Teseq AG

Teseq Holding AG

Teseq Inc.

Teseq Ltd.

test

Test Equipment Connection Corp.

Testing Technologies

TestMart

Tetsuo Sato and Chris Grigorean, Hitachi Semiconductor (America) Inc.

Texas Instruments

Texas Instruments Inc.

Thai Hoa Duong and Ihn S. Kim, Kyung Hee University, South Korea

Thales

Thales Alenia Space

Thales Alenia Space España

Thales Electron Devices

Thales MESL, Edinburgh, Scotland

Thales Nederland

ThalesRaytheonSystems

The American Society of Breast Surgeons

The EDA Consortium

The Global Semiconductor Alliance

The IEEE

The IET

The Institute for System Level Integration

The Institution of Engineering and Technology

The International Microwave Symposium

The Micromanipulator Co.

The Microwave Journal Staff

The Vitec Group

The Wi-Fi Alliance

The WiMAX Forum

The Z-Wave Alliance

The ZigBee Alliance

The ZigBee® Alliance and the Wi-Fi Alliance®

Theodore S. Rappaport, Director of NYU WIRELESS, New York, NY

Theodore Trembinski

Thi Thu Nga Tran, Chirn Chye Boon, Manh Anh Do and Kiat Seng Yeo, Nanyang Technological University, Singapore

Thilo Bednorz and Jochen Wolle, Rohde & Schwarz, Munich, Germany

Thintri Inc.

Thomas Arthur, Valpey Fisher Microwave Products Group, Hopkinton, MA

Thomas Gneiting, AdMOS GmbH, (http://www.admos.de), Adrian Scott, CST AG, (http://www.cst.com)

Thomas Gneiting, AdMOS GmbH, Adrian Scott, CST AG

Thomas J. Warnagiris

Thomas Kleine-Ostmann, Buy Harles

Thomas P. Budka, David Antopolsky and Matthew T. Pizzella

Thomas Roeder and Dr. Carolin Troester, Rohde & Schwarz

Thomas Sporkmann

Thunderline-Z

TiaLink Inc.

TiaLinx

TiaLinx Inc.

Ticer Technologies

Tim L. Hillstrom, Agilent Technologies

Times Microwave Systems

Times Microwave Systems, Wallingford, CT

Timo Reinhardt

Timothy Boles and Andrew Freeston - M/A-COM Technology Solutions, Lowell, MA

Tina Quach, General Chair

TMD Technologies

TNO

Toko America Inc.

Tom Cameron

Tom Hill, Tektronix Inc., Beaverton, OR

Tom Lam, Rich Bidwell and Scott Blee, Lockheed Martin, Owego, NY

Tom Newman

Tom Nolle

Tom Raschko, IMS 2013 General Chairman

Tom Rosa, Terabeam-HXI — Haverhill, MA

Tom Weller, David Markell, John Capwell and Vivi Cojocaru

Tommi Jamsa and Juha Ylitalo, Elektrobit

Tony Balistreri, R&D Manager, TriQuint Semiconductor

Tony Brown, EuRAD 2011, Conference Chairman

Tony Edridge; M2 Global Technology Ltd. San Antonio, TX

Tony Fattorini and David A. Richardson, Mimix Broadband Inc. Houston, TX

Tony Gasseling, Amcad-Engineering, Limoges, France

Tony Lymer, Satori-Technology Ltd.

Tore N. Anderson, Airtron Inc.

Toshiba Imaging

TotalTemp Technologies

Tower Semiconductor Ltd.

TowerJazz

TowerJazz and Presto Engineering

TowerJazz, Newport Beach, CA

TRAK Microwave

TRAK Microwave Corp.

Trans-Tech

Transline Technology Inc.

Triad RF Systems Inc., East Brunswick, NJ

Triad Semiconductor Inc. and Kaben Wireless Silicon Inc.

Trilithic

Trilithic Inc.

Trimble

Triquint

TriQuint Semiconductor

TriQuint Semiconductor and Agilent Technologies Inc.

TriQuint Semiconductor Design Center

TriQuint Semiconductor Inc.

TriQuint Semiconductor Inc.

TriQuint Semiconductor Inc., Hillsboro, OR

TriQuint Semiconductor Inc.</

TriQuint Semiconductor, Hillsboro, Oregon

TriQuint Semiconductor, Richardson, TX

TriQuint/VIPER RF

TRM Microwave

Troels Emil Kolding

TRU Corp.

TS2 Satellite Technologies

Tsang-Yen Hsieh and Nai-Chueh Wang, National Central University

TT electronics

TT electronics plc

Tyco Electronics

U

U.L. Rohde and A.K. Poddar

U.L. Rohde and A.K. Poddar, Synergy Microwave Corp.

Ubidyne

UBIFRANCE Press Office, London

UBM Electronics

UBM Tech Electronics

Ulrich L. Rohde and Ajay K. Poddar,

Ulrich L. Rohde and Ajay K. Poddar, Synergy Microwave Corp., Paterson, N.J.

Ulrich L. Rohde and Ajay K. Poddar, Synergy Microwave Corp., Paterson, NJ

Ulrich L. Rohde and Ajay K. Poddar, Synergy Microwave, Paterson, NJ

Ulrich L. Rohde, Ajay K. Poddar and Anisha M. Apte, Synergy Microwave Corp., Paterson, NJ

Ultra Electronics Command & Control Systems

UltraSource

UltraSource Inc.

UltraSource Inc. Hollis, NH

UltraSource Inc., Hollis, NH

UMS

UMS/Agilent Technologies

United Computer and Telecommunication Inc. (UCT)

United Monolithic Semiconductors

United Monolithic Semiconductors S.A.S.

United Monolithic Semiconductors SAS, France

Unity Wireless Systems Corp.

K.D. Xu1,2, Y.H. Zhang1, Y. Yang1, W.T. Joines2, Q.H. Liu2 AND Y. Fan1 University of Electronic Science and Technology of China1, Chengdu, China Duke University2, Durham, NC

University of Manchester

University of South Florida

Uros Mavric and Brian Chase, Fermi National Accelerator Laboratory

Uwe Knorr

V

Valence Semiconductor

Valpey Fisher

Valpey Fisher Corp.

Valpey Fisher Corp., Hopkinton, MA

Vanguard EMS and Tektronix Component Solutions

Vari-L Co. Inc.

Vari-L Company Inc.

Vaunix Technology Corp.

Vaunix Technology Corporation

Vector Fields

Vector Fields Inc.

Vector Fields Ltd.

Vectria Ltd.

Vectron International

Ved Vyas Dwivedi and Y.P. Kosta, MIEEE; Shweta Srivastava and H.B. Pandya, Charotar Institute of Technology

Ved Vyas Dwivedi MIEEE, Y.P. Kosta MIEEE, Shweta Srivastava, H.B. Pandya, Charotar Institute of Technology

Versatile Power Inc.

VI Technology

ViaSat Inc.

Vicente Rodriguez Senior Principal Antenna Design Engineer

Vicente Rodríguez, ETS-Lindgren

Vicente Rodriguez, Senior Principal Antenna Design Engineer

Victor Steel and Art Morris, WiSpry Inc.

Victor Volkov, Michael Parnes, Victor Korolkov

Vida Products

Vince Rodriguez

Vincotech

VIPER RF/WIN Semiconductors

Vishay Intertechnology Inc.

Vishay Precision Group Inc.

Visible Assets Inc.

Vislink

Viswanathan Ganesan, WiMAX Application Engineer, Agilent Technologies

Vladimir Veremey and John Dunn, AWR Corp., El Segundo, CA; Alexander Sulima, AVS Microwave, Toronto, Canada

VRF Micro Devices Inc.

Vsevolod Tanygin Orion Science Research Institute Kiev, Ukraine

VTI Instruments

VTI Instruments Corp.

Vubiq Inc.

VXI Technology Inc.

David Vye

W

W. Ismail, S.A.Z. Murad, T.J. Jiat and J.S. Mandeep, Universiti Sains Malaysia, Pulau Pinang, Malaysia; P. Gardner, University of Birmingham, UK

W. L. Gore & Associates

W. L. Gore & Associates Inc.

W. Simon, J. Kassner, O. Litschke, H. Fischer and S. Holzwarth, IMST GmbH, Kamp-Lintfort, Germany

W. Xue, Y.H. Zhang, Z.J. Feng and Y. Fan, University of Electronic Science and Technology of China, Chengdu, China

W.L. Gore

W.L. Gore & Associates

W.L. Gore & Associates Inc.

W.L. Gore & Associates Inc.,

W.L. Gore & Associates, Inc., Landenberg, PA

W.R. Deal, Y. Qian, T. Itoh and V. Radisc

Wael A. Al-Qaq and JianHua Gu, Ansoft Inc.; William J. Martin and Jeffrey L. Cutcher, Motorola Inc.

Walter A. Wohlmuth, Wayne Struble and Domingo Farías, TriQuint Semiconductor

Walter R. Frei, COMSOL Inc.

Walter R. Frei, Ph.D., COMSOL, Inc.

Walter Witt, Amplifonix

WAMICON 2011

Wan-Jong Kim, Kyoung-Joon Cho and Shawn P. Stapleton Simon Fraser University Burnaby, BC, Canada Jong-Heon Kim Kwangwoon University Seoul, Korea

Wan-Thai Hsu, Discera Inc.; W. Scott Best, Triangle ElectroMagnetics LLC; Héctor J. De Los Santos, NanoMEMS Research LLC

Judy Warner

Warren L. Stutzman and Carey G. Buxton

Watkins-Johnson Co.

Wavesat Inc.

Wavesat Telecom

Wavestream

Wavestream, San Dimas, CA

Wayne A. Shiroma

Wayne A. Shiroma, General Chair, IMS 2007

Wayne Struble

Weber Shandwick

Wei Jiang, Agere System Co. Ltd.; Xiaowei Zhu, Southeast University

Wei Liu, Guang Yang and Fa-Lin Liu, University of Science and Technology of China

Wei-Ting Lee and Huey-Ru Chuang National Cheng Kung University Tainan, Taiwan, ROC, Chun-Lin Lu Kun Shan University Tainan, Taiwan, ROC

Weinschel Associates

Weinschel Associates, Gaithersburg, MD

Weinschel Corp.

Wen Phan

Wen-Chung Liu and Jiun-Kai Chen, National Formosa University Yunlin, Taiwan

Wen-Ling Chen and Guang-Ming Wang, Missile Institute of Air Force Engineering University, Shaanxi Province, P.R. China; Guo-Dong Chen, Guang-Feng Yao,

Wen-Ling Chen, Guang-Ming Wang and Yi-Na Qi, Missile Institute of Air Force Engineering University

Wen-Shan Chen and Bao-Hung Kao Southern Taiwan University of Technology Tainan Hsien, Taiwan, ROC

Wen-Shan Chen and Fu-Mao Hsieh, Southern Taiwan University of Technology

Wen-Shan Chen and Ho-Yu Lin, Southern Taiwan University of Technology

Wen-Shan Chen and Kai-Cheng Yang, Southern Taiwan University

Wen-Shan Chen and Kuang-Yuan Ku, Southern Taiwan University

Wen-Shan Chen and Kuang-Yuan Ku, Southern Taiwan University of Technology Tainan Hsien, Taiwan, ROC

Wen-Shan Chen and Mao-Kai Hsu

Wen-Shan Chen and Mao-Kai Hsu, Southern Taiwan University of Technology, Tainan Hsien, Taiwan, ROC

Wen-Shan Chen and Sheng-Che Wu Southern Taiwan University of Technology Tainan Hsien, Taiwan, ROC

Wen-Shan Chen and Shih-Hung Cheng, Southern Taiwan University, Taiwan, ROC

Wen-Shan Chen and Yen-Hao Yu, Southern Taiwan University

Wen-Shan Chen and Yu-Chen Chang, Southern Taiwan University of Technology

Wen-Shan Chen, Chi-Huang Lin and Mao-Kai Hsu

Wen-Shan Chen, Ho-Yu Lin S. Taiwan Iniversity of Technology

Wen-Shan Chen, Southern Taiwan University of Technology

Wenming Li, University of Electronic Science and Technology of China, Chengdu, China; Haiwen Liu, Institute of Optics and Electronics, Chinese Academy

Wenzel Associates, Austin, TX

Werlatone Inc.

Werlatone, Patterson, NY

Werner Wild

Wes Littlefield, Vice President, Business Development, Hypres

Wes Mickanin

West Technology Research Solutions

White Paper

White Paper, Agilent Technologies

White Paper, AWR Corp.

White Paper, Bridgewave Communications

White Paper, Intelsat

White Paper, Peregrine Semiconductor

White Paper, Polaris Wireless

White Paper, Polaris Wireless, Inc.

White Paper, Skyworks Solutions

Widad Ismail, JS Mandeep and Mohammed Saeed Jawad

Widad Ismail, JS Mandeep, Mohammed Saeed Jawad

Wide Band Systems Inc.

William B. Kuhn and Naveen K. Yanduru

William B. Sullivan

William Bazzy and Carl Sheffres

William Dunham, Cadence Design Systems Inc., San Jose, CA

William T. Thornton and Lawrence E. Larson

William Webb, Neul Ltd., Cambridge, UK

Willie L. Thompson II, Eric V. Miller and Carl White

Willtek Communications

WiMAX Trends

WIN Semiconductors

WIN Semiconductors and Agilent Technologies

WIN Semiconductors Corp.

WIN Semiconductors Corp., Tao Yuan Shien, Taiwan

Winchester Electronics

WIPL-D

WiQuest Communications

Wireless Gigabit Alliance

Wireless Telecom Group

Wireless Telecom Group Inc.

WiSpry Inc.

WJ Communications

WJ Communications Inc.

WJ Communications Inc. San Jose, CA

WJ Communications Inc., San Jose, CA

Wolfgang Damm, Product Management Director

Wolfgang Heinrich, General Chairman; Ivar Bazzy, Horizon House Publications Inc.

Wolfgang Heinrich, President, European Microwave Association

Wolfgang Menzel

Women in Microwave Engineering

WORK Microwave

World Wireless Communications Inc. (WWC)

Ron Worman

Wyman L. Williams and James M. Howell, EMS Technologies Inc.

X

X-COM Systems LLC

X-Series White Paper

X. Li, L. Yang, S.X. Gong, Y.J. Yang, T. Hong and X. Chen, Xidian University, Shaanxi, People’s Republic of China

X. Zhao, T. Haarakangas, J. Katajisto, M. Niemi, P. Myllylä, J. Inget and J. Alasalmi, Elektrobit (EB), Oulu, Finland

X.L. Sun, S.W. Cheung and T.I. Yuk, University of Hong Kong, Hong Kong, China

X.Q. Chen, Y.C. Guo and X.W. Shi, Xidian University

X2Y Attenuators LLC

Xerafy

Xi Yao, S.C. Jung, M.S. Kim, J.H. Van, H. Cho, S.W. Kwon, J.H. Jeong, K.H. Lim, C.S. Park and Y. Yang, Sungkyunkwan University, Suwon, Korea, H.C. Par

Xianrong Zhang, Qingyuan Wang, Jinhua Cao and Anj Peng, University of Electronic Science and Technology of China, Chengdu, China

Xiao Lu, Agilent Technologies Inc.

Xiao Qun Chen, Ling Xia Wang, Chang Yun Cui and Xiao Wei Shi, Xidian University, Shaanxi, China

Xiaoming Chen, BreconRidge Manufacturing Solutions

Xicom Technology

XIO Strategies Inc.

Xiongwen Zhao, Elektrobit (EB)

Xiuping Li, Beijing University of Posts and Telecommunications, Beijing, P.R. China; Jianjun Gao, East China Normal University, Shanghai, P.R. China;

Xiuping Li, Beijing University of Posts and Telecommunications, China, Jianjun Gao, Southeast University, Nanjing, China, Georg Boeck, Technische Univ

XL Microwave Inc.

XMA

XMA Corp.

Xpedion Design Systems Inc.

Xpedion Design Systems Inc. and Jazz Semiconductor

Xu Li, Ji-hui Yu, Quan-di Wang and Yong-ming Li

Xu Liang and Chia Yan Wah Michael

Xudong Wang, Dawn Wang, Chris Masse and Peter Bacon

Y

Y. Pennec, Y. El Hassouani, C. Li, B. Djafari Rouhani, E.H. El Boudouti, H. Larabi, A. Akjouj

Y. Sun, Utrecht T. Tieman, H. Pflung and W. Velthuis

Y. Tkachenko, Y. Zhao, C. Wei and D. Bartle

Y. Yang, P. Zampardi, M. Fredriksson, J. Xu, S Chen and G. Zhang, Skyworks Solutions Inc.; J. Sifri, Agilent Technologies / Agilent EEsof EDA

Y.C. Moon, J.R. Lee, S.W. Yun and I.S. Chang

Y.W. Yeap

Y.W. Yeap, E.C. Teh and T.W. Chua

Y.W. Yeap, L.H. Chua and S.H. Tan, Nanyang Technological University

Y.Y. Wei, P. Gale and E. Korolkiewicz

Y.Y. Yang, X.W. Shi, X.H. Wang, X.Q. Chen and D.Z. Chen, Xidian University, Shanxi, China

Yair Shemesh

Yan Christian Venot and Peter Kielhorn, EADS Defence & Security

Yan Zhou, Beihang University, Beijing, China

Yang Zhang, Qualcomm Inc.

Yanmin Wang, Shandong University of Science and Technology

Yann Deval, 2010 RFIC General Chair

Yanwei Wang, Jianyi Zhou and Wei Hong, Southeast University, Nanjing, PR China

Yao Xi, Samsung Electronics

Yao-Huang Kao, Chun-Chieh Chien

Yasin Yousefzadeh and Mohsen Hayati, Razi University, Kermashah, Iran

Yevgeniy A. Tkachenko, Dylan Bartle and Ce-Jun Wei

Yew Hui Liew, Mook Seng Leong and Jurianto Joe

Yingjie Xu, Jingqi Wang and Xiaowei Zhu, Southeast University, Nanjing, China

Yong Zhang and Dafu Lu; University of Electronics Science and Technology of China, Chengdu, China

Yong-Chae Jeong

Yong-Chae Jeong and Sang-Young Yun

Yong-Chae Jeong, Chonbuk National University; Si-Gyun Jeong, Samsung Electronics; Jong-Sik Lim, Korean Intellectual Property Office; and Chul-Dong Kim

Yong-Chae Jeong, Chonbuk National University; Young Kim, Kumoh National Institute of Technology; Chul D. Kim, Sewon Teletech Inc.

Yong-Chae Jeong, Dal Ahn, Chul-Dong Kim, Ik-Soo Chang

Yong-Chae Jeong, Do-Kyeong Hwang and Jong-Sik Lim; Soonchunhyang University, Chonbuk National University and ACE Technology

Yong-Chae Jeong, Young-Jean Song, In-Ju Oh and Chul-Dong Kim

Yong-Woong Jang

Yong-Woong Jang Keukdong College Chungbuk, Korea Hyun-Chul Go AMC Centurion Korea Co. Ltd. Seoul, Korea

Yong-Woong Jang, Ho-Sub Shin

Yong-Woong Jang, Jeong-Chull Yoon and Ho-Sub Shin

Yong-Woong Jang, Keukdong College

Yong-Woong Jang, Keukdong College; Hyun-Chul Go, Hankook Antenna Co. Ltd.; Sang-Woo Lee, Mokpo Maritime University

Yong-Woong Jang, Keukdong College; Sang Woo Lee, Mokpo National Maritime University

Yong-Woong Jang, Keukdong College; Sang-Woo Lee, Hankook Antenna Co. Ltd.

Yong-Woong Jang, Sang-Woo Lee and Jeong-Hye Kwon

Yong-Woong Jang, Sang-Woo Lee, Jeong-Hye Kwon

Yongin Han and Ihn S. Kim

Yongxi Qian, Roberto Coccioli, Dan Sievenpiper, Vesna Radisic, Eli Yablonovitch and Tatsu Itoh

Yongzhong Zhu, Dan Li, Yongjun Xie and Rui Yang, Xidian University

Yongzhong Zhu, Dan Li, Yongjun Xie and Rui Yang, Xidian University, Xian Shaanxi, China

Yorgos Stratakos and Panayotis Betzios, National Technical University

Yoshihisa Amano, Atsushi Yamada, Eiji Suematsu, Hiroya Sato

Young Bin Cho, Kye Suk Jun and Ihn S. Kim, Kyung Hee University; Byung Soo Kim, Shinsung College

Young Kim, Ik-Soo Chang, Yong-Chae Jeong

Young Kim, Ki-Kyung Jeon, Ell-Kou Kim and Byung-Chul Kim, Kumoh National Institute of Technology, Gumi, South Korea

Young Yun

Young Yun and Jang-Hyeon Jeong, Korea Maritime University, Busan, Korea

Young Yun Woo, Youngoo Yang, Jaehyok Yi, Joongjin Nam, Jeonghyeon Cha and Bumman Kim

Young Yun, In-Ho Kang and Ji-Won Jung, Korea Maritime University

Young Yun, Jang-Hyeon Jeong, Hong-Seung Kim and Nak-Won Jang, Korea Maritime University

Young Yun, Korea Maritime University, Busan, Korea

Young Yun, Young-Bae Park, Suk-Youb Kang, In-Ho Kang and Ji-Won Jung, Korea Maritime University Busan, Republic of Korea; Kyu-Ho Park, Korea Electroni

Young-Bae Park, Young Yun, Suk-Youb Kang, In-Ho Kang, Ji-Won Jung and Kyu-Ho Park, Korea Maritime University, Busan, Korea; Kwang-Ho Anh, Korea Electr

Young-Kil Kwag, Korea Aerospace University, Seoul, Republic of Korea

Youngoo Yang, Jaehyok Yi, Joongjin Nam and Bumman Kim

Youngoo Yang, Jaehyok Yi, Young Yun Woo and Bumman Kim

Younkyu Chung, Dal Ahn and Tatsuo Itoh; California Institute of Technology, Soonchunhyang University and University of California

Yu Zhu, Jason Gerber and Qian Cai

Yuan-Kai Chu and Huey-Ru Chuang

Yuan-Kai Chu and Huey-Ru Chuang, National Cheng Kung University

Yung-Ming Chiu and Huey-Ru Chuang, Institute of Computer and Communication Engineering, National Cheng Kung University

Yuping Toh

Yuriy Kitaev, Voronezh State University; Aleksey Shulga, Voronezh Institute of Communications

Yusuke Tajima Auriga Measurement Systems LLC Lowell, MA

Yvan Droinet

Z

Z-Communications

Z-Communications Inc.

Z.D. Tan, J.S. Mandeep, S.I.S. Hassan and M.F. Ain School of Electrical and Electronic Engineering, Universiti Sains Malaysi

Z.D. Tan, J.S. Mandeep, S.I.S. Hassan and M.F. Ain, Universiti Sains Malaysia

Bill Zalud

Zeland Software Inc.

Zhaolong Li and Xuping Zhang, Nanjing University, Nanjing, P. R. China, Ke Wu and Xiaoping Chen, École Polytechnique de Montreal, Canada

Zhe Chen, Wei Hong, Jianyi Zhou, Jixin Chen and Chen Yu, Southeast University, Nanjing, China

Zhen Li, P.F. Maccarini, O.A. Arabe, V. Stakhursky, W.T. Joines and P.R. Stauffer, Duke University; M. Vogel and D. Crawford, Ansoft Corp.

Zhiqiang Yu, Jianyi Zhou, Jianing Zhao, Teng Zhao and Wei Hong, Southeast University, Nanjing, China

Zhong Yin Xiao, Shan Gao, De Chen Ma and Liang Liang Xiang, Shanghai University, Shanghai, China

ZigBee Alliance

Ziptronix

Zoltan J. Cendes, Ansoft Corp.

Zoltan J. Cendes, Ansoft Corporation

Ping Su, Shiwei Zhao, Shanghai Radio Equipment Research Institute, Shanghai, China; Zongxi Tang, University of Electronic Science and Technology of China, Chengdu, China

Zoran Golubicic, Sasa Dragas and Zoran Cvetkovic, TTI Technologías de Telecomunicaciones y de la Informacíon

Zord Gabor Laszlo

Zoya Popovic, Sébastien Rondineau and Dejan Filipovic, University of Colorado; David Sherrer, Chris Nicholas, Jean-Marc Rollin and Ken Vanhille, Rohm

ZTEC Instruments

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