Industry News

EDI CON China

EDI CON China 2019 Opens Call For Abstracts

EDI CON China 2019, a conference that brings together engineers working on high frequency analog and high speed digital designs, taking place April 1-3, 2019 at the China National Convention Center in Beijing, announces the Call for Abstracts for its technical sessions is open.

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Sensera

Sensera Expands Fabrication Capabilities

Sensera Inc. is pleased to announce it has acquired and qualified additional thin-film processing equipment including a dicing saw, a wafer bonder and an electroplating cell to meet the growing customer demand in this segment.


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