EMC/EMI

Compatibility in the Capital - IEEE EMC 2016

EMC 2016 featured Dr. Robert Scully, NASA Johnson Space Lab, kicking off the plenary session with his light hearted talk, “EMC in 2016 and Beyond: What Is It and Why Do We Care?”. As the IEEE EMC is an international organization, they periodically hold EMC outside of the US so traveled to Ottawa, Canada this year. 


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UTAC and AT&S collaborate on turnkey supply for 3D SiP solutions

UTAC Holdings Ltd. (UTAC), one of the leading semiconductor assembly and test services provider in Asia, announced a joint collaboration with AT&S, one of the global leading manufacturers of high-end printed circuit boards (PCBs) with headquarters in Leoben, Austria, to provide complete turnkey supply chain solutions for three-dimensional system-in-package (“3D SiP”) requirements.


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EDI CON China 2016 achieves record attendance

EDI CON China 2016 took place April 19-21 in Beijing at the China National Convention Center (CNCC). Continuing on a strong trajectory of growth, EDI CON China achieved a 35 percent increase in attendees and 32 percent increase in exhibition space over 2015. This year’s conference included partnerships with the China Radar Industry Association Conference and EMC China Conference/Exhibition.


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