EMC/EMI

UTAC and AT&S collaborate on turnkey supply for 3D SiP solutions

UTAC Holdings Ltd. (UTAC), one of the leading semiconductor assembly and test services provider in Asia, announced a joint collaboration with AT&S, one of the global leading manufacturers of high-end printed circuit boards (PCBs) with headquarters in Leoben, Austria, to provide complete turnkey supply chain solutions for three-dimensional system-in-package (“3D SiP”) requirements.


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EDI CON China 2016 achieves record attendance

EDI CON China 2016 took place April 19-21 in Beijing at the China National Convention Center (CNCC). Continuing on a strong trajectory of growth, EDI CON China achieved a 35 percent increase in attendees and 32 percent increase in exhibition space over 2015. This year’s conference included partnerships with the China Radar Industry Association Conference and EMC China Conference/Exhibition.


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Richardson Electronics at EDI CON 2016

Richardson Electronics Ltd. announces its participation at EDI CON CHINA 2016. The Electronic Design Innovation Conference (EDI CON) brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers.


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Dr. Eli Brookner to serve as Chair of EDI CON USA 2016 and present short course

EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, is pleased to announce Dr. Eli Brookner’s participation as Honorary Chair. As part of his participation, Dr. Brookner will also teach a short course at the conference, covering advancements in phased array and MIMO radar technology.


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