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Working with WORK Microwave and Eutelsat, the Fraunhofer Institute for Integrated Circuits IIS has successfully demonstrated beam hopping in an over-the-air (OTA) test for the first time.
The RF front-end (RFFE) modules market will be so highly impacted by new 5G standard. According to Yole Développement, it is expected to reach US$35.2 billion in 2023.
The rollout of 5G in North America buoyed Ericsson’s second quarter financial results, arguably the highlight of a mixed quarter of declining year-over-year sales, improving margins, and greater net income loss.
Nanotron Technologies GmbH and DecaWave announce that they have signed an IP License and Co-operation Agreement, which will enable the development of next-generation micro-location technologies.
Infineon Technologies announced cumulative shipments of 5 billion bulk CMOS RF switches since it began volume production in 2008, with annual shipments now well above 1 billion. Infineon's new antenna swapping devices are sampling now.
Leti and Soitec announced a new collaboration and five-year partnership agreement to drive the R&D of advanced engineered substrates, including SOI and beyond.
Nokia and China Mobile have signed a one-year agreement to support the Chinese mobile operator's transition to a future network infrastructure with "seamless connectivity" to meet growing data traffic. Nokia said the agreement has a value of up to €1 billion.