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GLOBALFOUNDRIES (GF) and Soitec announced the two companies have signed multiple long-term supply agreements for 300 mm silicon-on-insulator (SOI) wafers. The agreements assure GF will have sufficient high volume wafer supply to meet the demand for its RF SOI, fully-depleted SOI (FD-SOI) and silicon photonics process platforms.
The EMEA Satellite Operators Association (ESOA) and the Next Generation Mobile Networks Alliance (NGMN) have signed a cooperation agreement to strengthen their relationship and foster integration of satellite solutions into the 5G ecosystem.
Infineon Technologies AG and Cypress Semiconductor Corp. announced that the companies have signed a definitive agreement under which Infineon will acquire Cypress for US$23.85 per share in cash, corresponding to an enterprise value of €9 billion.
Arralis has released an E-Band automotive radar, branded Corvus, saying the radar’s performance is better than other systems in the automotive marketplace, specifically detection range, elevation resolution and scan area.
ICONIC RF has announced two MMIC power amplifiers with high back-off efficiency, targeting 5G mmWave and satellite applications: a 5 W GaN on SiC covering 24 to 31 GHz and a 700 mW, 24 to 27 GHz GaAs Doherty amplifier.
NXP Semiconductors N.V. announced that its wholly owned subsidiary has entered into a definitive agreement with Marvell, under which NXP will acquire Marvell’s Wireless Connectivity portfolio in an all-cash, asset transaction valued at $1.76 billion.
A dual-channel Ka-Band microwave rotary joint designed and produced by Link Microtek is playing a crucial role within a new stabilised antenna platform developed by Italian firm ADS International S.r.l. for high-end SOTM applications.
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