We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
The new Semiconductor Packaging education program that was developed by Hogeschool Arnhem en Nijmegen (HAN) and Chip Integration Technology Center (CITC) has launched.
NXP Semiconductors has introduced two ultra-wideband ICs for IoT applications requiring fine range, high precision location sensing, such as smart locks and real-time location system tags.
Nokia has announced further details after being named by NASA as a partner to advance “Tipping Point” technologies for the Moon, deploying the first LTE/4G communications system in space and helping pave the way towards sustainable human presence on the lunar surface.
HUBER+SUHNER has reinforced its commitment to developing products dedicated to the mission-critical applications of the professional and secure communication market as it joins the 450 MHz Alliance.
Insight SIP is launching the 1907-HT RF module, which offers a huge range of capabilities in a tiny package, ideal for smart lighting/smart building applications, and includes Bluetooth Mesh, Zigbee and Thread protocols to enable multimode networks.
Antenova Ltd has added a high performing 5G SMD design to its array of 5G antennas, the Lepida SR4L054 is a wideband antenna in SMD form, designed to achieve high efficiency and performance right across the spectrum from 600 MHz to 3800 MHz.
Finnish telecommunications service provider, Elisa, has selected Ericsson for a comprehensive 5G technology deployment spanning 5G Core and 5G radio access network (RAN).
RSS
