After successful trials on Halcyon Unmanned Surface Vehicle, Thales and ASV have signed an agreement to develop autonomous USV technology and capability for maritime, civil, security and military domains.
Anritsu Corp. has announced the availability of three new measurement software packages expanding the functions of the MT8870A Universal Wireless Test Set to support manufacturing tests of IoT/M2M applications.
Finmeccanica Security & Information Systems Division has signed a contract to replace the old air traffic control radars at 12 major Canadian airports including Toronto, Montreal, Ottawa, Vancouver and Calgary.
Smart Equipment Technology (SET), a leading supplier in high accuracy die-to-die and die-to-wafer bonders, announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. SET joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D die-to-wafer stacking technologies, using direct copper-to-copper bonding.