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European Industry News

Astrium delivers microwave radiometer for Sentinel-3A satellite

October 28, 2013

Astrium has delivered the proto-flight model of the microwave radiometer to the prime contractor, Thales Alenia Space, for installation on the Sentinel-3A satellite.


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Austrian Armed Forces select Cassidian Tracker UAS

International
October 28, 2013

The Austrian Ministry of Defence has ordered six Tracker mini unmanned air systems. This contract was won by Survey Copter in cooperation with the Kapsch Group.


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BAE Systems’ smaller, faster chips benefit space exploration

International
October 21, 2013

BAE Systems’ new 45 nm ASICs for space environments pack ten times more functionality and performance into the same size as current chips, without adding significant power needs.


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EuMW 2013, Nuremberg – Making Friends & Influencing People

October 16, 2013

Meet Experts, Make Friends was the motto for the 16th European Microwave Week that found a new home at the Nürnberg Convention Centre, NCC Ost from Sunday 6th to Friday 11th October. A higher number of unique delegates, along with exhibitors and visitors were able to discover that the beautiful city combines the culture, entertainment and history of a large metropolis, while affording the charm and warmth of a much smaller city. Whether in the conference sessions, workshops and short courses, on the exhibition floor or socialising at the Welcome Reception there was the opportunity to foster relationships, both professional and personal. This is a complete show summary.


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NXP delivers first RoadLINK automotive processor

International
October 15, 2013

NXP Semiconductors N.V. announced that the first product from the RoadLINK™ range, the SAF5100 flexible software-defined radio processor for C2C and C2I communication, is available for automotive customer design-in.


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AWR and NXP release ultra-wideband Doherty amplifier reference design

October 10, 2013

AWR Corp., the innovation leader in high-frequency electronic design automation (EDA), announces that NXP Semiconductor's ultra-wideband (UWB) Doherty reference design is now AWR Microwave Office design environment ready. The updated release features NXP’s BLF884P and BLF884PS transistors for ultra-wideband Doherty power amplifiers operating from 470 to 806 MHzand a 70 W DVB-T UWB LDMOS reference design using NXP’s patent-pending architecture capable of operating over an ultra-wideband spectrum in the UHF broadcast spectrum.


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Agilent leads celebrations as EuMW 2013 breaks records

October 9, 2013

By the time that Agilent Technologies celebrated its tenth year as Platinum Sponsors of EuMW with the annual Welcome Reception at the Nuremberg Convention Centre, the record for the total number of unique delegates at European Microwave Week 2013 had been surpassed, backing up the unrivalled number of unique exhibiting companies demonstrating their latest innovations on the show floor.


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Laird showcasing ECCOSORB and ECCOSTOCK products at EuMW 2013

October 8, 2013

Laird, a global technology company, announced it will attend European Microwave Week (EuMW), the largest microwave and radio frequency (RF) tradeshow in Europe. Laird will showcase ECCOSORB® and ECCOSTOCK® products and solutions for wireless and satellite communication, military and aerospace, automotive, medical and RFID markets. EuMW will take place October 8 through 10 in Nuremberg, Germany at the Nürnberg Convention Center. Laird will participate in the exhibition portion of the event and exhibit at booth #140.


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CST previewed CST STUDIO SUITE 2014 at EuMW 2013

Software/EDA
October 8, 2013

Computer Simulation Technology AG (CST) previewed the latest version of its flagship electromagnetic simulation tool, CST STUDIO SUITE® 2014, at European Microwave Week 2013.


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AVX exhibits full range of MLO diplexers at EuMW 2013

October 3, 2013

AVX Corp., a leading manufacturer of advanced passive components and interconnect solutions, is showcasing its full range of MLO™ diplexers at the European Microwave Week Exhibition. Based on its patented multilayer organic high density interconnect technology, AVX’s MLO diplexers employ high dielectric constant and low loss materials to realize high Q printed passive elements, such as inductors and capacitors in multilayer stack ups. 


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