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MTT-S IMS

San-tron reviews new pressurized and low PIM mini-DIN connectors at IMS

San-tron, Inc., a manufacturer of RF coaxial connectors and cable assemblies, reviewed several new innovative connectors and assemblies at the International Microwave Symposium in Tampa, Fla., June 3-6, 2014. Chief among are two small but robust connectors. First is their new pSeries pressurized connectors which provide low-loss, high-stability performance through 30 GHz at +/-65 psi. These pressurized connectors, which meet the IP68 standard, feature a simplified, three-piece design – body, center contact, and an innovative dielectric – which eliminates troublesome internal O-rings, gaskets, and silicone greases.


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Analog Devices introduces high-performance RF ICs

Analog Devices, Inc. introduced new highly integrated RF ICs that greatly simplify the design and reduce the development cost of multi-band base stations and point-to-point (PtP) radios. These new devices include the ADRF6720 I/Q modulator, ADRF6820 I/Q demodulator and ADRF6612 dual-mixer. The highly integrated devices enable the design of base station and high-performance radios requiring multi-band support, high dynamic range and wide channel bandwidths. These products are ideal for designs for 3G/4G communication, microwave PtP radios, military/aerospace and instrumentation applications. ADI’s new RF ICs offer the same performance as radio designs based on a combination of discrete solutions, yet in a significantly smaller form factor. The new devices feature an embedded low phase noise synthesizer, RF switch and balun, digital step attenuator (DSA) and programmable linearity optimization.


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TI adds RF gain blocks, mixers and modulator to product lineup

Texas Instruments (TI) expanded its RF portfolio today with the addition of high-performance RF gain blocks, down-converting mixers and a complex modulator that provide the industry’s best combination of power and performance. The new RF devices were demonstrated this week in TI's Booth 2041 at the International Microwave Symposium and complement TI's existing portfolio of transmit digital-to-analog converters (DACs), receive analog-to-digital converters (ADCs), IQ modulators, IF DVGAs, phase-locked loop (PLL) and RF synthesizers.


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Analog Devices unveils 2.5-GSPS A/D converter, driver amplifier and rapid prototyping FMC module

Analog Devices Inc. announced immediate availability of the AD-FMCADC2-EBZ FMC module with HDL code and software drivers for rapid design prototyping and interoperability with Xilinx FPGAs. The AD-FMCADC2-EBZ board incorporates the 12-bit, 2.5-GSPS AD9625-2.5 A/D converter and the ADA4961 RF amplifier, also introduced today, with input balun, power supplies and software stack.


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Skyworks introduced suite of breakthrough ultra low noise amplifiers at MTT-S 2014

Skyworks Solutions Inc., an innovator of high performance analog semiconductors enabling a broad range of end markets, unveiled a suite of new, ultra-low noise amplifiers (LNAs) for cellular infrastructure, wireless connectivity and broadcast communication applications.  The new LNAs provide best-in-class noise figure as well as high gain and linearity, improving receiver sensitivity and dynamic range.


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CTS new small size OCXO brings huge benefits to telecommunications and wireless applications

CTS Corporation, through its subsidiary, CTS Electronic Components, Inc., announces its new Model 149, a small size oven-controlled crystal oscillator (OCXO), that operates at temperatures suitable for commercial and industrial use. CTS introduced the new precision OCXO along with the company’s other cutting-edge offerings at the IEEE International Microwave Symposium (IMS) in Tampa, Fla., June 3-5 at booth number 322.


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Vectron International announces small form factor low G-sensitivity TCXO

Vectron International, a leader in the design and manufacture of precision oscillators and timing solutions for communication, industrial, military & space applications, announced the release of a low g-sensitivity TCXO for military, industrial and other harsh environment applications. This product will be showcased in Booth 1305 at the IMS 2014 Symposium in Tampa, FL from June 3-5th 2014.


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Cirexx presents ECLIPS at IMS 2014

Cirexx International is presenting the new ECLIPS technology this week at the International Microwave Symposium (IMS) at the Tampa Convention Center.  ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF and microwave Printed Circuit Boards (PCBs) employing an embedded low-CTE, thermally engineered metalized layer which has superior thermal conductivity characteristics.


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