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This series is an excellent tool for meeting the challenging bonding applications found in the RF, microwave, semiconductor, hybrid and medical device fields.
dSPACE has expanded its range of automotive radar test systems (DARTS) and launched a solution for automatic end-of-line testing of automotive radar sensors.
Gel-Pak will showcase its new Lid Clip Super System LCS2™, Polyurethane Device Carrier and Texturized Film JEDEC Carrier at the International Microwave Symposium (IMS) in Denver, Colo., June 21-23, 2022.
Global Communication Semiconductors, LLC. announced that its proprietary 0.15 um GaN/SiC foundry processes will now be offered to address the mmWave transceiver components up to Ka-Band frequency.
Indium Corporation will be promoting products developed to solve common issues facing companies that are producing technology for the RF/micro application sector, at IMS2022.
Learn how GORE® Microwave/RF Test Assemblies are a perfect fit for mmWave and higher frequency applications now and in the future at Gore's booth at IMS2022.
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