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Qorvo® announced that its 5 GHz front-end module (FEM) is enabling one of the industry’s fastest, most energy-efficient 802.11ax enterprise access points.
Sivers IMA has signed a joint development agreement with Ampleon to develop a single chip millimeter wave IC for 5G base stations. The companies plan to complete development and release the RFIC to market by the end of 2019.
Anokiwave has appointed Gary St. Onge as VP of business development, expanding his role providing strategic customer support and leadership in the San Diego office.
Targeting power electronics applications, pure-play semiconductor foundry Sanan Integrated Circuit Company has released a 6-inch SiC process to its foundry services portfolio, following full process qualification for commercial release.
Palomar Technologies announced new epoxy die attach capabilities for silver sintering. The silver jet dispensing process is an enhancement to the already wide breadth of Palomar Technologies' solutions for the telecom and datacom markets.
GlobalFoundries’ 9HP, 90 nm SiGe process is now available for prototyping on the company’s 300 mm wafer fab (Fab 10) in East Fishkill, New York. Process qualification and design kits are planned for completion during the second quarter of 2019.