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RFIC Channel

WaveIntegrity analysis tools from CWS selected by STMicroelectronics

RFIC Channel
Coupling Wave Solutions S.A.
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Coupling Wave Solutions S.A. (CWS) announced that STMicroelectronics has adopted the WaveIntegrity™ analysis tools to remove risk caused by on-chip, package and PCB parasitics. Following multiple evaluations, STMicroelectronics is deploying WaveIntegrity across multiple groups.


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Peregrine unveils STeP8 UltraCMOS process technology

Peregrine Semiconductor Corp.
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Peregrine Semiconductor Corp., a fabless provider of high-performance radio frequency integrated circuits (RFICs),  announced from Mobile World Congress in Barcelona the latest version of UltraCMOS® process technology — Semiconductor Technology Platform 8 (STeP8). STeP8 technology shows a 36 percent improvement in RonCoff performance over STeP5 technology announced just one year ago — dramatically improving the linearity, insertion loss, and isolation capabilities of Peregrine’s RFIC products.


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RFMD expands leadership in RF power management

RF Micro Devices Inc.
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RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency solutions, announced the addition of multiple new products to RFMD's industry-leading portfolio of envelope tracking (ET) power management and power amplifier (PA) solutions.


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Peregrine's newest digitally tunable capacitors tune LTE smartphone designs

Peregrine Semiconductor Corp.
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Peregrine Semiconductor Corp., a fabless provider of high-performance radio frequency integrated circuits (RFICs), announced from Mobile World Congress in Barcelona it has expanded its DuNE™ Digitally Tunable Capacitor (DTC) product line with six second-generation devices for antenna tuning in 4G LTE smartphones.


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RFMD expands portfolio of multimode multi-band PAs

RF Micro Devices Inc.
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RF Micro Devices Inc. announced the expansion of the company's family of multimode multi-band (MMMB) power amplifiers (PA) to include the highly integrated RF7388 3G/4G MMMB PA.


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Agilent announces host adapter for MIPI Alliance DigRF v4 RFICs

Agilent Technologies Inc., Santa Clara, CA
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Agilent Technologies Inc. announced a new protocol testing solution for MIPITM Alliance Gear2 DigRf v4 RFICs. The Agilent M9252A DigRF host adapter allows developers to speed testing and analysis of RFICs used in cellular phones, tablets and other mobile devices.


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Vishay's new MEPIC resistor is industry's first offered in integrated version

RFIC Channel
Vishay Precision Group Inc.
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To meet the demanding needs of pyrotechnic engineers, Vishay Intertechnology Inc. introduced a new massive electro-pyrotechnic ignitor chip (MEPIC) resistor offering Joule effect or flash ignition for fast firing times down to 250 µs.


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Richardson RFPD announces IIC China 2013 line-up

Richardson RFPD Inc.
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Richardson RFPD Inc. announces its participation and the line-up of suppliers and products it will feature at IIC China 2013, to be held at the Shenzhen Convention & Exhibition Center, Shenzhen, China, February 28 to March 2, 2013.


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Aeroflex/Inmet and Modelithics announce new chip attenuator, high-power resistor

Aeroflex/Inmet and Modelithics
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Aeroflex/Inmet Inc. and Modelithics Inc. have teamed to develop Global™ Models for Aeroflex/ Inmet surface mount attenuators (PCAF and PCAAF series) and high power chip resistors (NPC50-50W and NPC50-100W series). The advanced model features include  substrate scaling, pad geometry scaling and part value selectability.


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Qualcomm RF360 Front End Solution Enables Single, Global LTE Design for Next-Generation Mobile Devices

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Qualcomm Incorporated announced that its wholly-owned subsidiary, Qualcomm Technologies, Inc., introduced the Qualcomm RF360 Front End Solution, a comprehensive, system-level solution that addresses cellular radio frequency band fragmentation and enables for the first time a single, global 4G LTE design for mobile devices. The RF front end solution includes the industry’s first envelope power tracker for 3G/4G LTE mobile devices, a dynamic antenna matching tuner, an integrated power amplifier-antenna switch, and an innovative 3D-RF packaging solution incorporating key front end components.
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