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RFIC Channel

Richardson RFPD announces IIC China 2013 line-up

February 22, 2013

Richardson RFPD Inc. announces its participation and the line-up of suppliers and products it will feature at IIC China 2013, to be held at the Shenzhen Convention & Exhibition Center, Shenzhen, China, February 28 to March 2, 2013.


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Aeroflex/Inmet and Modelithics announce new chip attenuator, high-power resistor

February 21, 2013

Aeroflex/Inmet Inc. and Modelithics Inc. have teamed to develop Global™ Models for Aeroflex/ Inmet surface mount attenuators (PCAF and PCAAF series) and high power chip resistors (NPC50-50W and NPC50-100W series). The advanced model features include  substrate scaling, pad geometry scaling and part value selectability.


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Qualcomm RF360 Front End Solution Enables Single, Global LTE Design for Next-Generation Mobile Devices

February 21, 2013
Qualcomm Incorporated announced that its wholly-owned subsidiary, Qualcomm Technologies, Inc., introduced the Qualcomm RF360 Front End Solution, a comprehensive, system-level solution that addresses cellular radio frequency band fragmentation and enables for the first time a single, global 4G LTE design for mobile devices. The RF front end solution includes the industry’s first envelope power tracker for 3G/4G LTE mobile devices, a dynamic antenna matching tuner, an integrated power amplifier-antenna switch, and an innovative 3D-RF packaging solution incorporating key front end components.
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Cree and Eta Devices to demo the world’s most efficient PA (70%+) for mobile base stations at the MWC 2013

February 20, 2013

Cree Inc. and Eta Devices Inc. will demonstrate the world’s most efficient reported power amplifier for mobile base stations at the 2013 Mobile World Congress, February 24-28 in Barcelona, Spain.


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RFMD to showcase industry-leading products and technologies at MWC 2013

February 20, 2013

RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency solutions, announced the company will present its expanding portfolio of industry-leading radio frequency (RF) components for smartphones, tablets and other data-centric mobile devices at the 2013 Mobile World Congress (MWC 2013).


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Altair launches world's most advanced single-mode LTE-A chipset family

February 20, 2013

Altair Semiconductor (www.altair-semi.com), a developer of high performance, single-mode LTE chipsets, announced the launch ofa new family of chipsets, which includes two new baseband processors – the FourGee™-3800 and FourGee™-3802 – and a new radio chip – the FourGee™-6300.


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Dual interface and pure contactless smart cards will account for 16% of 2013 smart card shipments

February 15, 2013

ABI Research forecasts 8.6 billion smart cards will ship in 2013; a combined number spanning all smart card markets. Of total shipments, 16 percent are forecasted to use a contactless interface, rising to 30 percent in 2018. Government ID, transportation and ticketing, and payment cards continue strong double-digit growth in contactless adoption.


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Custom MMIC introduces the CMD132P3 ultra-low noise amplifier

February 14, 2013

Custom MMIC, (www.CustomMMIC.com), a developer of performance-driven monolithic microwave integrated circuits (MMICs), is adding a new 5 to 11 GHz ultra-low noise amplifier to its growing line of high-quality products. The CMD132P3 presents an ultra-low noise figure of 1.3 dB, delivers greater than 20 dB of gain across the entire bandwidth, and has a corresponding output 1 dB compression point of +10 dBm.


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Multi-output clock buffer and divider delivers low jitter to optimize noise performance

RFIC Channel
February 13, 2013

Analog Devices Inc. introduced a clock buffer and divider IC that combines high-speed, extremely low jitter (41 fs across the 12-kHz to 20-MHz band) and selectable division capability.


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Richardson RFPD and Cree Inc. sign distribution deal

RFIC Channel
February 6, 2013

Richardson RFPD Inc. announced it has completed an agreement to distribute Silicon Carbide power products from Cree Inc. Under the agreement, Richardson RFPD will distribute Cree's SiC Schotty diodes, MOSFETs and power modules worldwide.


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