- Buyers Guide
Coupling Wave Solutions S.A. (CWS) announced that STMicroelectronics has adopted the WaveIntegrity™ analysis tools to remove risk caused by on-chip, package and PCB parasitics. Following multiple evaluations, STMicroelectronics is deploying WaveIntegrity across multiple groups.
Peregrine Semiconductor Corp., a fabless provider of high-performance radio frequency integrated circuits (RFICs), announced from Mobile World Congress in Barcelona the latest version of UltraCMOS® process technology — Semiconductor Technology Platform 8 (STeP8). STeP8 technology shows a 36 percent improvement in RonCoff performance over STeP5 technology announced just one year ago — dramatically improving the linearity, insertion loss, and isolation capabilities of Peregrine’s RFIC products.
Peregrine Semiconductor Corp., a fabless provider of high-performance radio frequency integrated circuits (RFICs), announced from Mobile World Congress in Barcelona it has expanded its DuNE™ Digitally Tunable Capacitor (DTC) product line with six second-generation devices for antenna tuning in 4G LTE smartphones.
Agilent Technologies Inc. announced a new protocol testing solution for MIPITM Alliance Gear2 DigRf v4 RFICs. The Agilent M9252A DigRF host adapter allows developers to speed testing and analysis of RFICs used in cellular phones, tablets and other mobile devices.
To meet the demanding needs of pyrotechnic engineers, Vishay Intertechnology Inc. introduced a new massive electro-pyrotechnic ignitor chip (MEPIC) resistor offering Joule effect or flash ignition for fast firing times down to 250 µs.
Richardson RFPD Inc. announces its participation and the line-up of suppliers and products it will feature at IIC China 2013, to be held at the Shenzhen Convention & Exhibition Center, Shenzhen, China, February 28 to March 2, 2013.
Aeroflex/Inmet Inc. and Modelithics Inc. have teamed to develop Global™ Models for Aeroflex/ Inmet surface mount attenuators (PCAF and PCAAF series) and high power chip resistors (NPC50-50W and NPC50-100W series). The advanced model features include substrate scaling, pad geometry scaling and part value selectability.