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Later this month, Microwave Journal Publisher, Carl Sheffres and I will be travelling to Shanghai and Beijing where we will be meeting with many RF/microwave engineers and marketing professionals. The purpose of our trip will be to learn about the state of the industry in China from the perspective of local microwave component vendors and their customers. This exchange is an important step in identifying the authors and topics that will appear in future issues of Microwave Journal China. We will also be recruiting speakers, topics and sponsors/exhibitors for next year’s EDI CON event which will be held April 8-10, 2014 at the Beijing International Convention Center (BICC).

The Electronic Design Innovation Conference (EDI CON) debuted in Beijing, China on March 12-14th. You may have read some of the post-show news and reports that were sent out immediately following the event. By all accounts, it was a smashing success, exceeding even our most optimistic projections. The event drew nearly 2,500 attendees, more than 1,200 conference delegates and 22 media organizations. The Plenary session was completely full, many presentations were standing-room only and the exhibition was buzzing. Good stuff all-around.

As this month's WaveGuide makes its way over the internet and into your e-mail inbox, many of you are deeply immersed in creating marketing literature, data sheets and booth graphics for the upcoming season of trade shows. Whether your company’s engineering department orchestrates the release of new products to coincide with industry events or not, these gatherings represent the best opportunity to promote your latest solutions. While some traditionalists may wait until the event to make big announcements, it is advantageous to announce major releases before the trade show, enticing attendees with a pre-view of products and avoiding getting lost in the noise.  

With about a month to go until the industry convenes in Seattle for the annual IEEE MTT-S IMS event, Microwave Journal is working night and day (well, day anyway) to prepare for the show. Our May issue is at the printer and will soon be mailed to subscribers and shipped to Seattle for major distribution at the show. Thanks to all of our advertisers for your continued support. The issue looks great.

The next three months of editorial feature the innovation that defines our industry - from our preview of new products to be unveiled at IMS to our annual look at today’s evolving RFIC/MMIC/Semiconductor devices and the design technology supporting advance component and system development - it's springtime for new RF/microwave products and technologies. As Spring takes hold and outside temperatures rise, we look forward to presenting hot new products and technologies from around the world.