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Test and Measurement Channel

R&S takes wireless device precompliance testing into the lab

Rohde & Schwarz has added three new options for its compact R&S DST200 RF diagnostic chamber: the R&S DST-B160 automated 3D positioner, the R&S DST-B210 cross-polarized test antenna and the R&S DST-B270 communications antenna. The new options significantly speed up precompliance testing of wireless devices, allowing automated test sequences to be performed on the lab bench so that developers no longer require constant access to large RF test chambers.  


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UltraSource Inc. releases new thin film microcircuit CopperVia

UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd  at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.


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