- Buyers Guide
NMDG has demonstrated support for fully calibrated contactless loop probes, kindly provided by Rosenberger HF-Technik, in its Integrated Component Characterization Environment (ICE) flagship software.
OML introduces a solution for millimeter wave down converter measurements that consists of harmonic mixer, external diplexer, microwave signal analyzer and microwave signal generator. In this solution, the harmonic mixer overcomes the inherent microwave limitation while preserving greater than 1 GHz of bandwidth
Introduction to a portable wireless power meter with a wireless interface between a remote power unit and handheld display
Provides set up and measurement tips for time sidelobe measurements with pulse compression radar
Averna, a developer of test solutions and services for communications and electronics device makers worldwide, announces the availability of a field-ready multi-channel RF Recorder for RF applications covering 330 MHz to 2.5 GHz.
Agilent Technologies Inc. introduced five new PNA-L vector network analyzer models, offering design and manufacturing engineers the highest performance (up to 50 GHz) in a mid-range VNA, along with lower cost and future-proof capabilities.
Rohde & Schwarz has added three new options for its compact R&S DST200 RF diagnostic chamber: the R&S DST-B160 automated 3D positioner, the R&S DST-B210 cross-polarized test antenna and the R&S DST-B270 communications antenna. The new options significantly speed up precompliance testing of wireless devices, allowing automated test sequences to be performed on the lab bench so that developers no longer require constant access to large RF test chambers.
UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.
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