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Test and Measurement Channel

ME7873L RF/RRM Conformance Test System

ME7873L_FrontAnritsu Co. announces that its ME7873L RF/RRM Conformance Test System has achieved the world’s first test platform approval criteria (TPAC) for LTE-advanced carrier aggregation (CA). This industry-leading achievement in the Global Certification Forum (GCF) enables wireless device manufacturers to implement certification of devices employing this new technology. 


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Aeroflex introduces one-box LTE-A base station tester

Aeroflex Ltd., a wholly owned subsidiary of Aeroflex Holding Corp., has launched an extended version of its TM500 industry-standard base station tester capable of emulating several thousand LTE user equipments (UE), fading channel models, and LTE-A carrier aggregation functionality in a one-box benchtop unit. The TM500 Test Mobile delivers more leading edge LTE-A development capability with a higher UE density than any other solution on the market.


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Agilent announces ENA Series network analyzer that reduces cost, optimizes test of RF components

Agilent Technologies Inc. announced theE5063A ENA Series network analyzer, a low-cost ENA solution for manufacturing test. The instrument offers optimized performance and functionality for testing simple RF passive components, such as handset/BTS antennas, RF cables and filters. It can also be used in R&D for evaluation of RF passive devices and dielectric materials.


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Agilent introduces TDR/TDT solution for accurately characterizing multiport 25/28/100-Gb/s designs

Agilent Technologies Inc. introduced the Agilent N1055A 35/50-GHz (8-ps) time-domain reflectometry and transmission module for the Agilent 86100D DCA-X platform. The module provides fast, accurate impedance and S-parameter measurements on high-speed designs that have up to 16 ports.


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NI Trend Watch 2014 highlights technological breakthroughs

National Instruments released NI Trend Watch 2014, which summarizes the latest technology trends to help engineers meet evolving demands and integrate the ever-increasing power of technology into their work. The inaugural report examines a range of topics — from cyber-physical systems to the “SDR-ification” of RF instruments.


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Technical and educational sessions addressing high-speed signal integrity challenges to be conducted by Anritsu at DesignCon 2014

Anritsu Co. (DesignCon booth #501), a world leader in high-speed signal integrity test solutions, will present a series of technical and educational sessions during DesignCon to help engineers solve the measurement challenges associated with designing high-speed semiconductors, and communications systems and devices. Additionally, technical demonstrations will be held in the Anritsu booth throughout DesignCon, which is scheduled for January 28-31 in the Santa Clara Convention Center, Santa Clara, CA.


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