- Buyers Guide
EB (Elektrobit) has expanded into the People's Republic of China with the formation of EB Automotive Software (Shanghai) Ltd., the legal entity in Shanghai. This new global hub will particularly help EB to support the company's growing automotive customer base in China and neighboring markets in Central Asia.
ClearCount Medical Solutionsannounced that it has updated its existing platform and launched the SmartSponge® Flex, a new addition to the SmartSponge family of products.
Intelliconnect (Europe) Ltd., the UK based manufacturer of RF and Waterproof connectors, has extended its market leading range of high-reliability Triaxial connectors. Two new families of Triax connectors are now available; the TRB series bayonet connectors and the TRT series featuring a threaded coupling.
Richardson Electronics Ltd., a global provider of engineered and distributed solutions for the RF, microwave and display markets, announces the hiring of Daniel S. Nickolai as vice president of manufacturing. Nickolai will be responsible for strengthening Richardson Electronics’ manufacturing capabilities and positioning the company for future growth.
Linear Technology announces the LTC5544, a 4 GHz to 6 GHz high dynamic range downconverting mixer. The LTC5544 mixer offers high linearity with 25.9 dBm IIP3 (Input Third-Order Intercept), high conversion gain of 7.4 dB owing to its integrated IF amplifier, and a noise figure of 11.3 dB.
The UK’s Nanotechnology Knowledge Transfer Network (NanoKTN) announced details of a product developed by Plessey Semiconductors, as part of a project co-funded by the Technology Strategy Board (TSB), with support from the NanoKTN and JEMI UK.
e2v has signed a Memorandum of Understanding with Rio Tinto to develop large-scale ProWave™ microwave and radio frequency generators for use in mineral recovery.
RF laterally diffused MOS (LDMOS) is currently the dominant device technology used in high-power RF power amplifier (PA) applications for frequencies ranging from 1 MHz to greater than 3.5 GHz. This paper will include device and design considerations that specifically target enhancing ruggedness performance. The features of the products using this platform will also be presented.