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Cellular 4G/LTE Channel

M/A-COM Tech showcases new products at MTT-S 2012

June 13, 2012

M/A-COM Technology Solutions (M/A-COM Tech) is showcasing a broad portfolio of new products for wireless backhaul, CATV, optical communications, and aerospace and defense applications at the IEEE/MTT-S International Microwave Symposium tradeshow in Montréal, Canada. New product solutions on display in M/A-COM Tech’s Booth #815 include: 


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RFMD to exhibit at IMS 2012

June 12, 2012

Explore the RFMD® industry-leading RF and microwave product portfolio in booth 1210, with kiosks featuring solutions for WiFi and smart energy, wireless infrastructure, GaN RF power, microwave MMICs, and custom foundry services.

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Emerson & Cuming Microwave Products to attend IMS 2012

June 12, 2012

Laird Technologies Inc., a designer and supplier of customized performance-critical components and systems for advanced electronics and wireless products, announced it will be attending the 2012 International Microwave Symposium and Exhibition. The event is taking place at the Palais des Congrès de Montréal in Montreal, Canada, June 19-21, 2012. Emerson & Cuming Microwave Products, a unit of Laird Technologies can be found at booth #2308.


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ASC Signal introduces redundancy technology

June 11, 2012

ASC Signal released new redundancy technology and product options designed to provide simplified, seamless switching of virtually any active radio frequency component on the company’s fixed and transportable Earth station antennas. Additionally, these new capabilities support virtually any antenna system, regardless of manufacturer, when used in conjunction with ASC’s antenna controller products.


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Ericsson: 85% of population to have high-speed mobile internet in 2017

MarketWatch: International
June 11, 2012

Subscriptions by region, Q1 201According to Ericsson, 85 percent of the world's population will have internet coverage via 3G by 2017 and there will be close to nine billion mobile subscriptions, compared to six billion by the end of 2011.


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GaAs MMIC LNAs: CMD157 / CMD157P3

June 8, 2012

CMD157P3 ImageCustom MMIC, a developer of performance driven monolithic microwave integrated circuits (MMICs), is offering two new devices from its growing MMIC design library. The CMD157 (die) and CMD157P3 (packaged) are GaAs MMIC low-noise amplifiers (LNAs) for applications from 6 to 18 GHz.


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UltraSource Inc. releases new thin film microcircuit CopperVia

June 7, 2012

UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd  at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.


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Harris awarded $19 M to create healthcare mobility infrastructures for VA

June 7, 2012

Harris Corp. has been awarded a two-year, $19 million contract by the U.S. Department of Veterans Affairs Office of Information and Technology to create a wireless network infrastructure for medical centers nationwide.


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Aviat Networks joins Next Generation Mobile Networks Alliance

June 7, 2012

Aviat Networks Inc., a leading expert in microwave networking solutions, announced that it has joined the Next Generation Mobile Networks (NGMN) Alliance as an active sponsor along with a community of leading operators and manufacturers in the mobile industry. The company will also be showcasing its latest LTE proven products at the NGMN Industry Conference, which will be held June 13-15, in San Francisco, California.


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