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Cellular 4G/LTE Channel

TM500 network test system enables 4G IoT support

Cobham Wireless, a global leader in the provision of advanced wireless coverage and mobile communication systems, has announced that the next generation of the TM500 network test system has the capability to emulate tens of thousands of Machine Type Communications (MTC) devices, sometimes known as M2M devices.


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Qorvo expands support of highly anticipated marquee smartphone platform

Qorvo®, a leading provider of core technologies and RF solutions for mobile, infrastructure and defense applications, announced that Qorvo has been selected by a leading global smartphone manufacturer to expand its support of a marquee Android® smartphone platform launching in the current quarter. Qorvo has broadly expanded its participation in this highly anticipated device to include RF Fusion™ RF front end modules, diversity receive modules, power amplifier duplexers (PADs), switches, impedance tuners, low noise amplifiers (LNAs), duplexers and filters.


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Qorvo to showcase portfolio of RF solutions at 2016 Mobile World Congress

Qorvo® Inc. a leading provider of core technologies and RF solutions for mobile, infrastructure and defense applications, today announced it will present its expanding portfolio of radio frequency (RF) solutions at the 2016 Mobile World Congress, to be held in Barcelona on February 22-25, 2016. Qorvo’s comprehensive RF product portfolio includes discrete and highly integrated implementations of filters, multiplexers, switches, power amplifiers, antenna tuners, impedance tuners, low noise amplifiers, power management integrated circuits and other high performance 4G LTE and LTE-Advanced (LTE-A) solutions.


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Mobile Experts: Wi-Fi semiconductor market to reach more than $12B in 2020

Mobile Experts released a new report on Wi-Fi Semiconductors, highlighting the trends in combo chips, SoCs, power amplifiers, LNAs, switches, and Front End Modules (FEMs). The report covers both access point hardware and client devices, with detailed information regarding the trends to higher levels of integration, higher level MIMO, new standards, and changes in semiconductor process technologies.


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