- Buyers Guide
LTE TDD has gained wide ecosystem acceptance and backing from leading infrastructure and device vendors. Ovum expects that 25 percent of all LTE connections will include LTE TDD by 2016.
RF Micro Devices Inc. announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD® RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD’s FEMs achieve industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest reference designs from the world’s leading WiFi chipset providers.
Vishay Intertechnology Inc. introduced a new series of surface-mount multilayer ceramic chip capacitors (MLCCs) offering high self resonance,a high Q factor of ≥ 2000, and a low dissipation factor of ≤ 0.05% for operation in high-frequency commercial applications.
The Broadband and ICTs for smart, inclusive and sustainable societies event, organised by the International Telecommunication Union (ITU) and the Ministry of Communication of Brazil, outlined the critical role of broadband-enabled services and applications as facilitators for long-term sustainable economic development.
NEC Corporation announced that Mobile TeleSystems OJSC, the leading telecommunications provider in Russia and the CIS, together with NEC Neva Communications Systems, a subsidiary of NEC Europe, is providing a new femtocell service in Siberia.
Sumitomo Electric Device Innovations USA Inc. (SEDU) will be showing its full line of GaN HEMTs at this year’s MTT-S IMS 2012 Show in Montreal.
Anritsu Co. announces it will demonstrate the world’s only broadband Vector Network Analyzer (VNA) system that can conduct single sweeps from 70 kHz to 140 GHz in its booth (#807) at the International Microwave Symposium (IMS), to be held June 19-21, in Montreal. The on-wafer device characterization is one in a series of demonstrations to be conducted in Anritsu’s booth that will highlight test solutions for high-frequency designs, including E-band applications and high-speed signal integrity measurements.
Maxim Integrated Products, Inc. has launched the MAX5879 multi-Nyquist RF digital-to-analog converter (RF DAC) that delivers a fully digital software-defined radio (SDR) transmitter, enabling a common hardware platform for multicarrier, multiband, and multistandard base stations.
The OpenET Alliance has announced the availability of a new High Dynamic Range (HDR) system simulation model for handset Envelope Tracking applications. The ET System Simulation model, jointly developed by OpenET members Nujira and the University of Firenze, aids system optimization by making it easier for designers to identify sources of noise and distortion and to make the necessary design tradeoffs.
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