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Cellular 4G/LTE Channel

Ceragon receives follow-on orders in Mexico from Telefónica

March 18, 2013

Ceragon Networks Ltd. has received follow on orders from Telefónica for network upgrading in Mexico.


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RFMD selected by leading smartphone manufacturer to support 4th-gen flagship smartphone

March 15, 2013

RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency solutions, announced it has been selected by a leading smartphone manufacturer to supply multiple 3G/4G LTE components into a recently announced fourth-generation flagship smartphone platform.


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Tektronix demonstrates MIPI Alliance M-PHY test solution

March 15, 2013

Tektronix Inc. announced the industry’s first demonstration of a M-PHY test solution for silicon-proven HS-Gear3 IP, a key part of the MIPI Alliance M-PHY physical layer specification for mobile devices. The Tektronix test solution allows designers to quickly and efficiently characterize designs and verify performance.


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Making the Connection at EDI CON 2013

March 14, 2013

NEC first in U.S. to complete small cell LTE Interoperability testing for PSCR

March 8, 2013

NEC Corp. completed interoperability testing for the Public Safety Communications Research (PSCR) Program's 700 MHz Public Safety Demonstration Network at the Department of Commerce Boulder Laboratories.


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Broadcom tops 3 ABI Research wireless connectivity IC competitive assessments

March 7, 2013

Broadcom has been ranked number one vendor in three recent competitive assessments released by ABI Research on wireless connectivity IC markets. One was for overall wireless connectivity ICs, another on Bluetooth ICs, and a final on Wi-Fi ICs.


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Short-range wireless technology IC market to reach almost 5B units shipped in 2013

March 6, 2013

The total market for open short-range wireless (SRW) technology based ICs, i.e., Bluetooth, Wi-Fi, ZigBee, NFC, and GPS, is expected to reach almost 5 billion units in 2013 and grow to nearly 8 billion by 2018. This includes standalone wireless connectivity ICs, wireless connectivity combo ICs, and also platforms with integrated wireless connectivity.


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