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Tektronix Inc. announced the industry’s first demonstration of a M-PHY test solution for silicon-proven HS-Gear3 IP, a key part of the MIPI Alliance M-PHY physical layer specification for mobile devices. The Tektronix test solution allows designers to quickly and efficiently characterize designs and verify performance.

NEC Corp. completed interoperability testing for the Public Safety Communications Research (PSCR) Program's 700 MHz Public Safety Demonstration Network at the Department of Commerce Boulder Laboratories.

Broadcom has been ranked number one vendor in three recent competitive assessments released by ABI Research on wireless connectivity IC markets. One was for overall wireless connectivity ICs, another on Bluetooth ICs, and a final on Wi-Fi ICs.

The total market for open short-range wireless (SRW) technology based ICs, i.e., Bluetooth, Wi-Fi, ZigBee, NFC, and GPS, is expected to reach almost 5 billion units in 2013 and grow to nearly 8 billion by 2018. This includes standalone wireless connectivity ICs, wireless connectivity combo ICs, and also platforms with integrated wireless connectivity.

Answering the growing need for smartphone and tablet applications that update seamlessly, Texas Instruments Inc. (TI) announces a truly wireless solution with a unique over-the-air-download (OTA or OAD) feature in its BLE-Stack™ 1.3 software for use with the CC2540 and CC2541 Bluetooth low energy system-on-chips (SOCs). Single-mode Bluetooth® low energy or Bluetooth Smart is increasing in popularity because it allows consumers to connect to their smartphones and tablets to  automotive, home office, medical and health, sports and fitness as well as mobile and PC accessories.