- Buyers Guide
Cellular 4G/LTE Channel
Analog Devices Inc. (ADI), a global leader in high-performance semiconductors for signal-processing applications and leading provider of RF ICs (radio frequency integrated circuits), announced the release of a PLL synthesizer that offers leading phase noise performance. An upgrade to the widely used 4-GHz ADF4153 fractional-N PLL, the new, pin- and software-compatible ADF4153A PLL synthesizer facilitates improved integrated phase noise in a variety of applications including communications infrastructure, pulse-Doppler and FMCW (frequency-modulated continuous-wave) radar applications, test and instrumentation equipment, microwave point-to-point systems, PMR (professional mobile radio), VSATs (very small aperture terminals) and aerospace systems.
Richardson RFPD Inc. announces immediate availability and full design support capabilities for two new connector series from Carlisle Interconnect Technologies (Carlisle IT). The new series are extensions of Carlisle IT's push-on connector family.
RFMD to accelerate growth in entry-level smartphone segment through acquisition of Amalfi Semiconductor
RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency components, announced a definitive agreement to acquire Amalfi Semiconductor (Amalfi), a leading fabless semiconductor company specializing in cost effective, high performance RF and mixed-signal ICs for the rapidly growing entry-level smartphone market.
KRYTAR Inc., a leader in the design and production of ultra-broadband microwave components and test equipment announces the expansion of its line of directional couplers with the addition of a new model offering high performance over the ultra-broadband frequency range of 1.0 to 65.0 GHz, in a single, compact and lightweight package.
In the recent IMS/VoLTE Competitive Assessment, ABI Research rates Ericsson as the overall leader with respect to innovation and implementation. Ericsson’s large cache of IMS and VoLTE patents, industry leadership in interoperability testing, and market share firmly places them in the top position. Closely at their heels are Alcatel-Lucent and Nokia Siemens Networks, both of whom have strong portfolios, and in some aspects are superior. Alcatel-Lucent and Nokia Siemens Networks hold dominant positions at the most demanding, leading wave LTE IMS deployments, and Nokia Siemens Networks is ahead with virtualization technology. Additionally, the Huawei and ZTE unique propositions are noteworthy.
ViaSat Inc. has received orders in excess of $11 million for Joint IP Modem Network Control Centers (NCCs), remote modems, and Joint IP Modem enhancements. These production contracts enable the Department of Defense to complete its roll out of interoperable network services to warfighters from teleports and Strategic Tactical Entry Points (STEPs). In addition, the orders include further development of the Joint IP Modem to enable efficient regional connectivity within a larger global network footprint. These awards follow successfully deliveries against previous contract obligations.
The NGMN Board welcomes the launch of the LTE Patent Pool managed by VIA Licensing and combining the patent portfolios of 10 companies.
Cambridge Broadband Networks (CBNL) and NEC Europe Ltd. have announced a major agreement with QSC to provide high-speed wireless internet access to its enterprise customers. QSC, among the leading mid-size providers of ICT services in Germany, is installing CBNL’s VectaStar multipoint microwave equipment to meet the high-capacity internet demands of its enterprise customers across several cities in Germany. QSC’s initial deployment will consist of VectaStar access points and remote terminals, using the available 26GHz spectrum.
Worldwide handset shipments decreased 1.9 percent YoY to 387.3 million units in Q3 2012, according to new data from market intelligence firm ABI Research. Worldwide smartphone shipments increased 32.8 percent YoY to 155.5 million over the same period. Samsung retained the lead position in both handset and smartphone shipments. Underscoring its accomplishment, Samsung shipped more than double the smartphones of second place Apple.
TI expands its Bluetooth wireless connectivity portfolio with QFN packages, module designs, new software
Texas Instruments Inc. (TI), leading the industry with the most complete wireless connectivity portfolio for embedded applications,today announced that its Bluetooth® v4.0 technology-based CC2560 and CC2564 wireless devices are now available in easy-to-integrate QFN packages offered by TI and its distribution partners. TI also announced the availability of additional production-ready modules based on the two devices, as well as software and tools.