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Now in its 11th year, the FEKO Student Competition is open to all under-graduates and post-graduates who work on a supervised project in electromagnetic engineering and make use of FEKO. This annual competition is organised to give students an opportunity to showcase their work.

Piconics Inc. and Modelithics Inc. have collaborated to upgrade the previous Piconics conical inductor S-parameter models to full equivalent circuit models, now offering substrate scalability/selectability, series and shunt configurations, and broadband validation up to as high as 65 GHz for some configurations. These models represent the first comprehensive, measurement-based equivalent circuit models for conical inductors in the Modelithics Library.

AWR Corp. announces the addition of two new stories to its roster of university student and professor design successes using AWR software. These new stories include contributions from Okinawa National College of Technology in Japan and Macquarie University in Australia.

EHX is the only real-time EMC and EMI diagnostic tool that enables them to test ultra-high speed (> 2GHz) PCBs their lab-bench. With EHX, Wi-Fi designers and manufacturers can for example conduct tests and debug EMC and signal integrity problems up to the third harmonic. 

Answering the growing need for smartphone and tablet applications that update seamlessly, Texas Instruments Inc. (TI) announces a truly wireless solution with a unique over-the-air-download (OTA or OAD) feature in its BLE-Stack™ 1.3 software for use with the CC2540 and CC2541 Bluetooth low energy system-on-chips (SOCs). Single-mode Bluetooth® low energy or Bluetooth Smart is increasing in popularity because it allows consumers to connect to their smartphones and tablets to  automotive, home office, medical and health, sports and fitness as well as mobile and PC accessories.

AWR Corp., the innovation leader in high-frequency EDA software, announced the sponsorship of two major student design competitions in China as part of the company’s continuing focus on working with universities worldwide to empower students with RF/microwave software tool experience and jumpstart their engineering careers.

Agilent Technologies Inc. launched the Agilent EEsof EDA Student License Program, designed to provide access to Agilent EEsof EDA software on students’ personal computers. 

For its first year, the EDI CON organizers relied on their experience as editors of Microwave Journal and Microwave Journal China to put together a technical program that had something for mostly everyone involved in high-frequency electronic design and system integration. The latest systems of interest from space (GNSS) to 4G (TD-LTE) to very close (Near-Field Communications) are being represented in the technical tracks and workshops.

What: AWR is a gold sponsor at the Electronic Design Innovations Conference (EDI CON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, VSS™ system design software, as well as AXIEM® 3D planar EM software and Analyst™ 3D FEM EM software.

Anaren Inc. announced that its Anaren Integrated Radio (AIR) module team is partnering with Austin, Texas-based middleware developer Emmoco to create the AIR Support for BLE solution. As a guest supplier at the Premier-Farnell booth (#220, Hall 5) in the Embedded World 2013 exhibition, the AIR team will be explaining its technology concept for fast-emerging Bluetooth Low Energy (BLE) applications -- and will also be actively developing a pool for "beta-testers" for the upcoming AIR Support for BLE solution, which is scheduled for release in the spring/summer of 2013.