Analog Devices Inc. (ADI) announced the release of a new version of its popular ADIsimRF™ design tool. The free design tool is the software accompaniment to ADI's complete portfolio of RF-to-digital functional blocks, allowing engineers to model RF signal chains using devices from across ADI's RF IC and data converter portfolio.
TI announced two new software packages for its KeyStone-based multicore system-on-chips (SoCs): a new production ready small cell Physical (PHY) software package and a transport software package for wireless and other network-oriented applications.
AWR's new application note, “Using Analyst™ To Quickly And Accurately Optimize A Chip-Module-Board Transition,” highlights the unique features of its’s 3D finite element method (FEM) EM simulator by demonstrating the optimization of the transition from a board-to-chip signal path.
Agilent Technologies Inc. introduced the industry’s first software solution for decoding the Universal Flash Storage (UFS) protocol on oscilloscopes. The new protocol decoder provides design and validation engineers with a fast, easy way to validate and debug their UFS interfaces.
Pentek Inc.announced rackmount additions to its Talon® RF/IF signal recording and playback systems. The Model RTS 2707 rackmount system, and Model RTR 2747 rugged rackmount system, offer recording and playback of RF/IF signals up to 700 MHz with signal bandwidths up to 200 MHz.
AWR has just published a new Microwave Office® software application note titled, “End-to-end Design and Realization of an X-band Transmission Analyzer Using AWR Circuit, System, and EM Software.” The note examines the complete flow and details the design of several critical design elements for this device, which integrates many RF components on a single printed circuit board (PCB).
A new white paper from AWR, “Understanding and Correctly Predicting Critical Metrics for Wireless RF Links,” highlights the advantages of using Visual System Simulator™ (VSS) RF system simulation software for detailed insight into the full performance of an RF link in next-generation wireless products.