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Software/EDA Channel

Piconics and Modelithics partner to develop broadband models of conical inductors

Piconics Inc. and Modelithics Inc. have collaborated to upgrade the previous Piconics conical inductor S-parameter models to full equivalent circuit models, now offering substrate scalability/selectability, series and shunt configurations, and broadband validation up to as high as 65 GHz for some configurations. These models represent the first comprehensive, measurement-based equivalent circuit models for conical inductors in the Modelithics Library.


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TI delivers industry’s only OTA download capabilities for seamless software updates of Bluetooth Smart products

Answering the growing need for smartphone and tablet applications that update seamlessly, Texas Instruments Inc. (TI) announces a truly wireless solution with a unique over-the-air-download (OTA or OAD) feature in its BLE-Stack™ 1.3 software for use with the CC2540 and CC2541 Bluetooth low energy system-on-chips (SOCs). Single-mode Bluetooth® low energy or Bluetooth Smart is increasing in popularity because it allows consumers to connect to their smartphones and tablets to  automotive, home office, medical and health, sports and fitness as well as mobile and PC accessories.


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AWR sponsors student design competitions in China

AWR Corp., the innovation leader in high-frequency EDA software, announced the sponsorship of two major student design competitions in China as part of the company’s continuing focus on working with universities worldwide to empower students with RF/microwave software tool experience and jumpstart their engineering careers.


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Electronic Design Innovation Conference 2013: A Solid Technical Program from Start to Finish

For its first year, the EDI CON organizers relied on their experience as editors of Microwave Journal and Microwave Journal China to put together a technical program that had something for mostly everyone involved in high-frequency electronic design and system integration. The latest systems of interest from space (GNSS) to 4G (TD-LTE) to very close (Near-Field Communications) are being represented in the technical tracks and workshops.


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AWR to sponsor and exhibit at EDI CON 2013

What: AWR is a gold sponsor at the Electronic Design Innovations Conference (EDI CON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, VSS™ system design software, as well as AXIEM® 3D planar EM software and Analyst™ 3D FEM EM software.


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