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Software/EDA Channel

AWR Exhibits at COMCAS and IME 2013

AWR Corp., the innovation leader in high-frequency EDA software, exhibits at COMCAS 2013 and IME 2013 in Israel and China the week of October 21, 2013.  At each show, the latest release of Microwave Office®, Visual System Simulator™(VSS), Analyst™, AXIEM®, and Analog Office® for the design of MMICs, RF PCBs, RFICs, microwave modules, communication systems, radar systems, antennas and more will be showcased.


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AWR and NXP release ultra-wideband Doherty amplifier reference design

AWR Corp., the innovation leader in high-frequency electronic design automation (EDA), announces that NXP Semiconductor's ultra-wideband (UWB) Doherty reference design is now AWR Microwave Office design environment ready. The updated release features NXP’s BLF884P and BLF884PS transistors for ultra-wideband Doherty power amplifiers operating from 470 to 806 MHzand a 70 W DVB-T UWB LDMOS reference design using NXP’s patent-pending architecture capable of operating over an ultra-wideband spectrum in the UHF broadcast spectrum.


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AWR announces AWR Connected for AMPSA

AWR Corp., the innovation leader in high-frequency electronic design automation (EDA), and AMPSA, supplier of RF and microwave amplifier design software, announce AWR Connected™ for AMPSA, a synthesis-through-simulation design flow specifically developed to improve design throughput and productivity for amplifier designers.


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Agilent accelerates smartphone, defense simulations by a factor of 64

Agilent Technologies Inc. announced that SystemVue, its premier platform for communications and aerospace/defense systems design, supports high-performance distributed computing. System architects of wireless, 4G smartphone and radar applications can now verify next-generation system performance up to 64 times faster using Linux-based grid computing managers such as the IBM Platform Load Sharing Facility.


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Overcome signal integrity challenges in ultra-high speed (>2 GHz) PCB designs in real-time

Software/EDA

At very high frequencies, signal propagation and transmission line effects on PCBs tend to happen earlier and become prominent. PCBs may also exhibit multiple resonances and power decoupling becomes more challenging than ever before. To overcome these challenges, PCB Designers and Engineers can count on the new EMSCAN EHX to verify the impact of rerouting signals or modifying PCB layout or materials used on the PCBs.


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