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AWR Corp., the innovation leader in high-frequency EDA software, announced the sponsorship of two major student design competitions in China as part of the company’s continuing focus on working with universities worldwide to empower students with RF/microwave software tool experience and jumpstart their engineering careers.
Agilent Technologies Inc. launched the Agilent EEsof EDA Student License Program, designed to provide access to Agilent EEsof EDA software on students’ personal computers.
For its first year, the EDI CON organizers relied on their experience as editors of Microwave Journal and Microwave Journal China to put together a technical program that had something for mostly everyone involved in high-frequency electronic design and system integration. The latest systems of interest from space (GNSS) to 4G (TD-LTE) to very close (Near-Field Communications) are being represented in the technical tracks and workshops.
What: AWR is a gold sponsor at the Electronic Design Innovations Conference (EDI CON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, VSS™ system design software, as well as AXIEM® 3D planar EM software and Analyst™ 3D FEM EM software.
Anaren Inc. announced that its Anaren Integrated Radio (AIR) module team is partnering with Austin, Texas-based middleware developer Emmoco to create the AIR Support for BLE solution. As a guest supplier at the Premier-Farnell booth (#220, Hall 5) in the Embedded World 2013 exhibition, the AIR team will be explaining its technology concept for fast-emerging Bluetooth Low Energy (BLE) applications -- and will also be actively developing a pool for "beta-testers" for the upcoming AIR Support for BLE solution, which is scheduled for release in the spring/summer of 2013.
Analog Devices Inc. (ADI) announced the release of a new version of its popular ADIsimRF™ design tool. The free design tool is the software accompaniment to ADI's complete portfolio of RF-to-digital functional blocks, allowing engineers to model RF signal chains using devices from across ADI's RF IC and data converter portfolio.
TI announced two new software packages for its KeyStone-based multicore system-on-chips (SoCs): a new production ready small cell Physical (PHY) software package and a transport software package for wireless and other network-oriented applications.
Blighter Surveillance Systems has unveiled a new multi-language version of its BlighterView sensor and control software.
AWR's new application note, “Using Analyst™ To Quickly And Accurately Optimize A Chip-Module-Board Transition,” highlights the unique features of its’s 3D finite element method (FEM) EM simulator by demonstrating the optimization of the transition from a board-to-chip signal path.
Agilent Technologies Inc. introduced the industry’s first software solution for decoding the Universal Flash Storage (UFS) protocol on oscilloscopes. The new protocol decoder provides design and validation engineers with a fast, easy way to validate and debug their UFS interfaces.