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Tektronix Inc. announced the industry’s first demonstration of a M-PHY test solution for silicon-proven HS-Gear3 IP, a key part of the MIPI Alliance M-PHY physical layer specification for mobile devices. The Tektronix test solution allows designers to quickly and efficiently characterize designs and verify performance.

Passive Plus Inc. is the newest addition to the Modelithics Vendor Partner (MVP) Program. Passive Plus Inc. (PPI) and Modelithics Inc. have collaborated to develop Global™ Models for four series of PPI’s ultra-low ESR capacitors.

Now in its 11th year, the FEKO Student Competition is open to all under-graduates and post-graduates who work on a supervised project in electromagnetic engineering and make use of FEKO. This annual competition is organised to give students an opportunity to showcase their work.

Piconics Inc. and Modelithics Inc. have collaborated to upgrade the previous Piconics conical inductor S-parameter models to full equivalent circuit models, now offering substrate scalability/selectability, series and shunt configurations, and broadband validation up to as high as 65 GHz for some configurations. These models represent the first comprehensive, measurement-based equivalent circuit models for conical inductors in the Modelithics Library.

AWR Corp. announces the addition of two new stories to its roster of university student and professor design successes using AWR software. These new stories include contributions from Okinawa National College of Technology in Japan and Macquarie University in Australia.

EHX is the only real-time EMC and EMI diagnostic tool that enables them to test ultra-high speed (> 2GHz) PCBs their lab-bench. With EHX, Wi-Fi designers and manufacturers can for example conduct tests and debug EMC and signal integrity problems up to the third harmonic. 

Answering the growing need for smartphone and tablet applications that update seamlessly, Texas Instruments Inc. (TI) announces a truly wireless solution with a unique over-the-air-download (OTA or OAD) feature in its BLE-Stack™ 1.3 software for use with the CC2540 and CC2541 Bluetooth low energy system-on-chips (SOCs). Single-mode Bluetooth® low energy or Bluetooth Smart is increasing in popularity because it allows consumers to connect to their smartphones and tablets to  automotive, home office, medical and health, sports and fitness as well as mobile and PC accessories.