Test and Measurement Channel

STMicroelectronics Lays Foundations in China

The first stone has been laid at the site of STMicroelectronics’ future chip packaging and test facility in Longgang, Guangdong Province, China, in the presence of senior officials of the Shenzhen Municipal government and other dignitaries. The site will consist of up to 40,000 m 2 of manufacturing space,...
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S.E.T. and CEA Leti Form New Bond

The partnership between S.E.T. (formerly the SUSS MicroTec Device Bonder Division) and CEA Leti has resulted in a radically new generation of high accuracy (0.5 μm), high force (4,000 N) device bonder for wafer diameters up to 300 mm. The bonder includes a built-in chamber for collective reflow in...
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