Test and Measurement Channel

S.E.T. and CEA Leti Form New Bond

The partnership between S.E.T. (formerly the SUSS MicroTec Device Bonder Division) and CEA Leti has resulted in a radically new generation of high accuracy (0.5 μm), high force (4,000 N) device bonder for wafer diameters up to 300 mm. The bonder includes a built-in chamber for collective reflow in...
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Agilent and Anite Announce Strategic Partnership

Agilent Technologies Inc. and Anite plc announced that they have entered into a strategic partnership to deliver industry-leading 3GPP Long Term Evolution (LTE) test solutions to wireless R&D engineers designing next-generation mobile communications products. Under the terms of this partnership, Agilent and Anite will provide a broad, comprehensive portfolio...
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ARMMS Embraces Wide Area of Coverage

The papers presented at the SJ Technologies sponsored ARMMS conference in Corby, UK, on 5 and 6 November, covered a wide range of topics in the RF and microwaves sector. The Society is a non-profit, independent professional society comprised of electronics engineers with an interest in high frequency design...
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