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COMSOL Inc. announced the release of a major upgrade of its add-on Acoustics Module for its flagship product COMSOL Multiphysics. This latest version of the Acoustics Module offers new capabilities and expanded multiphysics user interfaces for simulating thermoacoustic effects, poroelastic waves, acoustic-shell interactions, and piezo-acoustic devices. The new version...

AWR Corp. announced the availability of a Microwave Office™ model library for Mitsubishi Electric ’s nonlinear GaAs and GaN RF devices. The model library includes high power and low noise HEMT devices, which are commonly used in base station and DBS receivers and other radio communications equipment, given their...

DesignArt Networks announced the availability of its Unified Mobile Backhaul (UMB) software pack for gigabit+ wireless backhaul applications, suitable for all layers of the heterogeneous mobile radio access network (HetNet) evolution. Together with the software the company released a complete UMB evaluation kit and reference design. Operators have attempted...

Numerical Innovations announced the release of its new product: “DFM Now!™” DFM Now! allows PCB designers and engineers to verify that their Gerber and Drill files are ready for PCB manufacturing. It also facilitates PCB Quotation and has many other high-end CAM features only found in software costing thousands...

United Monolithic Semiconductors announced the availability of the majority of its design kits for various process technologies for use with Agilent’s recently released Advanced Design System (ADS) 2011.01 EDA software. “Agilent worked closely with us to make sure our PDK’s now support complete EM analysis,” said Eric Leclerc, Manager...