Software & CAD

Subscribe

Agilent Technologies Inc. announced the industry’s first secure digital ultra-high speed card-compliance test software. The new SD UHS-II bus interface technology increases secure digital performance with data rates up to 1.56 Gb/sec in consumer electronics applications. The compliance test package helps designers accelerate the development of SD UHS-II card-based...

Remcom announced an update to its electromagnetic simulation software, XFdtd® Release 7 (XF7), with expanded import functionality and specialized options for biological EM applications. This update, Release 7.2.2, also features enhanced functionality for Remcom’s unique CAD Merge capability, with support for printed circuit board (PCB) models now included. In...

Agilent Technologies Inc. and Accelicon Technologies announced they have signed a definitive acquisition agreement. Accelicon, a privately held company, provides device-level modeling and validation software for the electronics industry. The transaction, subject to customary closing conditions, is expected to be completed in 60 to 90 days. Financial details were...

M/A-COM Technology Solutions ' Belfast business unit has added Mesuro 's Active Load Pull test and measurement capabilities to its existing line-up. Having worked with Cardiff University and more recently Mesuro, the Belfast Design Centre is equipped with the latest CAD software, automatic assembly tools and test and measurement...

Agilent Technologies Inc. announced that Ron Nersesian has been appointed Executive Vice President and Chief Operating Officer. Nersesian has been President of Agilent’s largest business, the Electronic Measurement Group (EMG), since 2009. Nersesian, 52, will have day-to-day responsibility for Agilent’s three businesses, Electronic Measurement, Chemical Analysis and Life Sciences,...

AWR Corp. will be spotlighting its 2011 software portfolio, inclusive of Microwave Office™, AXIEM® and Visual System Simulator™ during activities at MWE 2011 (Microwave Workshop & Exhibition 2011) from November 30 to December 2 in Pacifico Yokohama, Japan. Company & Partner Demonstrations AWR (Room B, 3:30 to 4:15 PM,...

Aimed at advancing Vietnam's electrical and mechanical engineering curricula and support the country's growing high-tech industry, Cadence Design Systems Inc. has joined the Higher Engineering Education Alliance Program (HEEAP) with an in-kind donation of electronic design automation software and services valued at over $40 M. The donation enables students...