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In its first 2022 volume, "RF Front-End Module Comparison 2022 – Vol. 1 – Focus on Apple," Yole SystemPlus provides insights into technology and cost data for FEMs and several components found in 18 smartphones from the Apple iPhone series since 2017.
X-FAB Silicon Foundries announced a further expansion of its longstanding partnership with the Leibniz Institute for High Performance Microelectronics (IHP) where X-FAB will now license IHP’s SiGe technology.
Cadence Design Systems, Inc. announced that it has collaborated with GlobalFoundries (GF) to accelerate 5G and mobile design innovation through the delivery of the Cadence® RF and mmWave flow for the GF 22FDX platform.
Richardson RFPD, Inc. announced the availability and full design support capabilities for a new GaN high-power amplifier from United Monolithic Semiconductors.
An international research team at WPI-MANA has used a transmission electron microscope (TEM) to create a 2.8 nm transistor consisting of nanochannels embedded in metallic carbon nanotubes (CNTs), which exhibits quantum transport at room temperature.
3DGaNTMinnovators Finwave Semiconductor, Inc.ctor, Inc. announced a $12.2 million Series A funding round to expand the company’s team, product development activities and lab facilities.
IQE plc announced that it has filed a lawsuit against Tower Semiconductor, as IQE has significant evidence that Tower misappropriated IQE’s trade secrets to unlawfully obtain patents on IQE’s technology.
In a new partnership, Indium Corporation and SAFI-Tech will evaluate market applications for supercooled solder materials and explore the development of new products.
The 68th annual IEEE International Electron Devices Meeting (IEDM), the leading forum for the unveiling of breakthroughs in transistors and related micro/nano technologies, will be held December 3-7, 2022 in San Francisco.