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Sivers Semiconductors AB announced the launch of the new highly integrated, state-of-art 5G NR RFICs, TRB02801 and TRB03901, together with very high-powered RFIC and antenna RF modules, BFM02801 and BFM03901, covering all licensed 5G mmWave bands.
New solutions announced at GlobalFoundries' GF Technology Summit include rich features essential for smart mobile devices, datacenter, IoT and automotive.
X-FAB Silicon Foundries is now able to support volume heterogeneous integration via micro-transfer printing (MTP), thanks to a licensing agreement that has just been secured with X-Celeprint.
ACM Research, Inc. announced the launch of ACM’s Ultra ECP GIII plating tool to support wafer-level packaging for compound semiconductors, with product offerings for SiC, GaN and GaAs.
Cadence Design Systems, Inc. and Tower Semiconductor announced the release of a silicon-validated SP4T RF SOI switch reference design flow using the Cadence® Virtuoso®
Design Platform and RF Solution.
Element Six and University of Warwick will join forces to shape the technology of the future as part of the eight Prosperity Partnerships announced in support of the government’s ambitious new Innovation Strategy.
GlobalFoundries announced its expansion plans for its most advanced manufacturing facility in upstate New York over the coming years, including immediate investments to address the global chip shortage at its existing Fab 8 facility as well as construction of a new fab on the same campus that will double the site’s capacity.