Materials/Packages

Planar EM Simulation of Multi-chip Modules and BGA Packages

Effect of planar electromagnetic simulators on multi-chip modules and ball grid array mounting techniques
Technical Feature Planar EM Simulation of Multi-chip Modules and BGA Packages Jim DeLap Agilent EEsof EDA Westlake Village, CA As electronics vendors and consumers demand smaller and lower cost products, manufacturers must find ways to increase levels of integration while maintaining product functionality. These higher levels of integration are...
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Rigorous Analytical Expressions for Electromagnetic Parameters of Transmission Lines: Coupled Sliced Coaxial Cable

A set of accurate closed-form formulas for primary parameter matrices and even- and odd-mode impedances for coupled sliced coaxial cables
Technical Feature Rigorous Analytical Expressions for Electromagnetic Parameters of Transmission Lines: Coupled Sliced Coaxial Cable This article is a continuation of a previous article that appeared in Microwave Journal and is the first part in the development of accurate closed-form formulas for the primary parameters (inductance [L] and capacitance...
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Coping with Hidden Spurious Harmonic Modes in the Design of Low Pass Corrugated Waveguide Filters

Proposed simulation scheme to predict the frequency band location and hidden spurious harmonic modes in low pass corrugated waveguide filters
Technical Note Coping with Hidden Spurious Harmonic Modes in the Design of Low Pass Corrugated Waveguide Filters Hidden spurious harmonic modes in corrugated waveguide filters are investigated from both theoretical and practical points of view. It has been found that multiple mode couplings occurring at more than one place...
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An Aluminum Nitride High Power Dissipation RF Packaging Platform

Introduction to a low cost, highly flexible aluminum nitride (AlN) high power dissipation platform utilizing co-fired AlN in a variety of configurations
Product Feature An Aluminum Nitride High Power Dissipation RF Packaging Platform CMC Wireless Components Phoenix, AZ Aluminum nitride (AlN) is an ideal electrically insulating material for use in high power electronic packaging applications. Possessing both high thermal conductivity and a non-toxic chemical nature, AlN is commercially available in a...
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A DC to 50 GHz and Beyond MMIC Carrier

Introduction to a novel interconnection structure for high performance and high volume DC to millimeter-wave chip carrier applications
Product Feature A DC to 50 GHz and Beyond MMIC Carrier HEI Broadband, HEI Inc. Victoria, MN With frequency spectrum demands at a premium many of today's wireless applications are moving higher and higher in frequency. Many of the systems now operate in the Ku and Ka frequency bands....
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Design and Prototyping of a Transimpedance Front-end Amplifier for Dense Wavelength Division Multiplexing Circuits

Development of an optical power monitor for use in dense wavelength division multiplexing circuits using a logarithmic operational amplifier transimpedance front-end amplifier
Technical Note Design and Prototyping of a Transimpedance Front-end Amplifier for Dense Wavelength Division Multiplexing Circuits As part of the development of an optical power monitor for use in dense wavelength division multiplexing (DWDM) circuits, the effectiveness of a logarithmic operational amplifier transimpedance front-end amplifier was investigated, and the...
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Low Phase Noise Voltage Tunable Oscillators

Introduction to a new line of fast tuning, low phase noise voltage tunable oscillators
PRODUCT FEATURE Low Phase Noise Voltage Tunable Oscillators Paratek Columbia, MD Driven by the VCO market's insatiable need for lower phase noise and wider tuning ranges, a new line of voltage tunable oscillators (VTO) has been introduced with superior performance in these areas. The new VTOs operate at fundamental...
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