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Materials/Packages

Arlon Features New Lower Loss, Lowest PIM Antenna Materials

October 8, 2007
Arlon announced it will feature new low loss, low PIM antenna materials for base station antennas at this year's European Microwave Week. Woven Glass Reinforced PTFE with Micro Dispersed Ceramic • AD255A reduces Loss Tangent 17 percent over PTFE/glass designs • AD260A, AD300A and AD320A reduce loss tangent by...
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Rogers Corp. Showcases Advanced Circuit Materials

October 8, 2007
Rogers Corp. will showcase several advanced circuit materials this week at EuMW in Booth #A 510-512. These products are used in a wide range of high frequency applications, including the advanced packaging, antenna and power amplifier markets. Products that Rogers Corp. will display at EuMW include: New Enhanced Copper...
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Taconic Advanced Dielectric Division exhibits at European Microwave Week

October 2, 2007
Europe's largest RF & microwave trade show, European Microwave Week, takes place from 9th - 11th October in Munich.
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Arlon to Feature Thermally Conductive Low Loss PTFE Laminates

October 2, 2007
Arlon announced it will feature new thermally conductive low loss PTFE laminates for power amplifiers and circuits that require higher dielectric constant stability vs. temperature. Lowers Junction Temperatures for Improved Power Amplifier Reliability • Power density continues to increase • Packaging getting smaller and hotter • Higher temperatures reduce...
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Arlon Displayed CLTE-XT for Multi-layer, Phase Sensitive Microwave Circuits

September 25, 2007
Arlon displayed high performance, "Best-in-Class" CLTE-XT for multi-layer, phase sensitive microwave circuits for radar, antennas and other circuits requiring high reliability at this year's EuMW. CLTE-XT represents the eXtended Technology of the existing CLTE product line. CLTE-XT is a micro dispersed ceramic PTFE composite utilizing a woven fiberglass reinforcement...
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picoChip Receives Strategic Investment from Samsung

September 25, 2007
Samsung has made a strategic investment in UK company picoChip . The amount of the investment is undisclosed, but it forms part of the $27 M of ‘D-round’ new investment announced in July by picoChip. The round has brought the total company funding to $70.5 M, which will enable...
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Chomerics Opens New Facility

September 21, 2007
Chomerics Asia Pacific division of Parker Hannifin Corp. announced the opening of a new facility in Sriperumbudur near Chennai, India. Located adjacent to the 260 acre Special Economic Zone, the facility will enable Chomerics to better serve the rapidly growing Indian market for IT, telecom and consumer electronic products....
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Tower Wins Fab2 Deal with Top-tier US IDM

September 21, 2007
Tower Semiconductor Ltd. , a pure-play independent specialty foundry, announced that it has won a multi-million dollar per month manufacturing deal for its Fab2 at the 0.13-micron technology generation from a first-tier, US integrated device manufacturer (IDM). Under this deal, technology will be transferred during the coming several quarters...
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Rogers Corporation Showcases High-Performance Laminate Solutions at Antenna Systems 2007

September 19, 2007
Rogers Corporation (NYSE:ROG) will showcase several high performance antenna solutions, including its newly developed RO4500(tm) antenna grade laminates, at Antenna Systems 2007.
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Rogers Corporation Showcases High-Performance Laminate Solutions at Antenna Systems 2007

September 19, 2007
Rogers Corporation (NYSE:ROG) will showcase several high performance antenna solutions, including its newly developed RO4500(tm) antenna grade laminates, at Antenna Systems 2007.
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