Materials/Packages

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On December 13, 2002, we sent a questionnaire to 75 companies that provide products and services in this field, with a response deadline of January 11th. We used e-mail rather than the USPS so that we would have feedback that all the questionnaires were received. On January 3, 2003,...

In today's competitive environment designers and engineers are looking for any features that can give them the edge. When it comes to RF connectors, areas where that advantage can be gained are in the speed of installation, flexibility of connection and efficient utilization of space. The QuickLock family of...

When developing and producing complex RF connector housings, costs can be high and the process complex due to the sheer number of required machined metal components and the diversity of the necessary assembly. However, these difficulties can be overcome by employing molded injected metal (MIM) technology for connector manufacturing....

With all the talk about a wireless society, there is still a need for high performance coaxial cable assemblies. One of the areas still getting lots of development attention is cable assemblies for airborne electronic warfare. Most of these applications are at power levels too high for fiber optic...

As this article is written, it is estimated that 90 to 98 percent of first-level IC interconnects are made using wire bonding technologies. The remaining connections are primarily bump, or flip-chip connections. This ratio is expected to remain the same for the foreseeable future. In general, it will be...

The trend towards faster and higher frequency communications is driving the search for high reliability packaging solutions that satisfy ever more demanding performance requirements. However, when utilizing the packaging materials commonly available today, designers often come up against thermal, mechanical and/or cost barriers. To meet these demands, Osprey Metals,...

A new substrate technology has been developed that addresses the dense component placement, high heat dissipation, harsh environments and high frequencies associated with high performance devices such as microwave amplifiers for base stations, broadband amplifiers designed into multi-media networks, and high power microwave power combiners with on-board terminations. The...

When employing circuit board plotters for product development the main requirement is for fast, efficient and flexible operation. Consequently, the high costs incurred by the long waiting periods inherent when externally procuring circuit board prototypes, particularly those with RF substrates, can be avoided. The ProtoMat 95s/II meets these requirements,...

There are several reasons for the wide use of printed transmission lines. They are simple to produce, they operate over a wide bandwidth, and have small weight and dimensions. The earliest form of printed transmission lines was the stripline ( Figure 1a ). 1,2 The printed stripline consists of...

In today's age of high speed Internet, high frequency wireless and wireline communications, conventional materials are reaching their performance limits. Copper-based electrical connections are being limited by the dielectric properties of the insulating layer. Solutions using optical connections are available but are too expensive. Liquid crystalline polymers (LCP) are...