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Materials/Packages

A Deterministic Method for Optimizing VSWR

By using in conjuction both frequency and time domain reflection measurements, it is possible to positively identify the specific circuit discontinuities that contribute to a given VSWR lobe. Corrective action can then be readily determined for optimum...
November 1, 2003
Improving VSWR is typically an iterative trial-and-error exercise when utilizing either frequency or time domain information. For example, while circuit modifications which decrease time domain reflectometry (TDR) "bumps" (discontinuities) are generally a good thing, decreasing a specific TDR bump does not necessarily improve VSWR within a frequency band of...
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A High Frequency Broadband Filter

September 1, 2003
X2Y® technology is a new balanced component capable of high frequency performance across a broad frequency range. The component uses a standard ceramic capacitor with subtle, but important modifications to its structure. These structural changes create a circuit inside the capacitor that is capable of broadband electromagnetic interference (EMI)...
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Two New High Performance Resonator Materials

June 1, 2003
In the telecoms and other RF component markets, today's climate means that there can no longer be a trade-off between cost and performance - the designer needs to achieve both. Temex has recognized this fact and addressed it through the evolution of two new generations of materials on which...
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High Speed Digital Packaging

This article presents the detailed design drivers for high speed digital packaging. Transmission line and interconnect requirements for packaging high speed digital assemblies are discussed. Details of the mechanical requirements to properly attach the...
May 1, 2003
A number of factors are driving the design of high speed digital packaging. At the assembly level, metal boxes are the dominant configuration due to mounting and interconnect constraints. The next assembly connectivity is accomplished through cables, requiring coaxial connectors. Since a variety of companies manufacture many of the...
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A Broadband Package Utilizing High Thermal Performance Aluminum Nitride

April 1, 2003
The CMC-SOIC8 ceramic SOIC8 surface-mount package is ideal for packaging RF/microwave MMIC and discrete devices for applications from DC to 18 GHz. This new addition to CMC's standard product line is fabricated using aluminum nitride (AlN), a ceramic material with thermal conductivity of 180 W/m-K, about 10 times higher...
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2003 Connector, Cable and Cable Assembly Survey

This is the first survey of connectors, cables and cable assemblies sponsored by Microwave Journal. We hope to update it annually with increased industry participation.
March 1, 2003
On December 13, 2002, we sent a questionnaire to 75 companies that provide products and services in this field, with a response deadline of January 11th. We used e-mail rather than the USPS so that we would have feedback that all the questionnaires were received. On January 3, 2003,...
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Quick Mating N Connectors for RF Applications

March 1, 2003
In today's competitive environment designers and engineers are looking for any features that can give them the edge. When it comes to RF connectors, areas where that advantage can be gained are in the speed of installation, flexibility of connection and efficient utilization of space. The QuickLock family of...
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MIM Technology for RF Connector Production

March 1, 2003
When developing and producing complex RF connector housings, costs can be high and the process complex due to the sheer number of required machined metal components and the diversity of the necessary assembly. However, these difficulties can be overcome by employing molded injected metal (MIM) technology for connector manufacturing....
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Self-locking Connectors to Reduce Aircraft Service Times

March 1, 2003
With all the talk about a wireless society, there is still a need for high performance coaxial cable assemblies. One of the areas still getting lots of development attention is cable assemblies for airborne electronic warfare. Most of these applications are at power levels too high for fiber optic...
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Gold Stud Bumps in Flip-chip Applications

As power requirements and operating frequencies increase, more and more designs will look toward ball bumps as an interconnect solution. While solder has traditionally been the incumbent material for these bumps, its limitations have become manufacturi...
March 1, 2003
As this article is written, it is estimated that 90 to 98 percent of first-level IC interconnects are made using wire bonding technologies. The remaining connections are primarily bump, or flip-chip connections. This ratio is expected to remain the same for the foreseeable future. In general, it will be...
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