December 13, 2006
Aeroflex has announced it has added the ability to undertake live receiver testing and transmitter testing, including HSDPA on its highly successful 6413A UMTS basestation test system.Read More
October 16, 2006
Metal-clad Fibers with Significant Weight Savings and EMI Performance
Micro-Coax, Pottstown, PA
Micro-Coax is now offering the ARACON“ family of metal-clad fibers that combines the conductivity of metal with the strength, light weight and flexibility of Kevlar® aramid fibers. The ARACON fibers are a superior lightweight alternative to traditional nickel-plated copper wire for EMI shielding. Replacing standard wire with ARACON offers significant weight savings without sacrificing EMI performance, as well as other benefits that copper and alloy wires cannot match.
August 3, 2006
The advantageous physical properties and manufacturing characteristics of Osprey Controlled Expansion (CE) alloys are currently being exploited in a variety of electronic applications. The ability to tailor the coefficient of thermal expansion (CTE) values of these alloys to ceramic circuit boards and components operating at high frequencies, combined with...Read More
June 20, 2006
Ideal for Devices Used in WiMAX, Military and Space Applications; Hermetic Surface Mount Package Allows Products to Operate at Higher FrequenciesRead More
For quality control in the design of microwave and millimeter-wave circuitry and devices, it is important to have a good measure of the dielectric properties of the materials employed. The standards and methods that are often employed for this purpose ...
December 1, 2003
The setups presented are essentially of two types - thin dielectric sheet testers and z-axis testers. These are the tools that are employed to independently measure the components of the substrate dielectric constant. It is supposed that suitable propagation models may use this information to better predict propagation mode...Read More
By using in conjuction both frequency and time domain reflection measurements, it is possible to positively identify the specific circuit discontinuities that contribute to a given VSWR lobe. Corrective action can then be readily determined for optimum...
November 1, 2003
Improving VSWR is typically an iterative trial-and-error exercise when utilizing either frequency or time domain information. For example, while circuit modifications which decrease time domain reflectometry (TDR) "bumps" (discontinuities) are generally a good thing, decreasing a specific TDR bump does not necessarily improve VSWR within a frequency band of...Read More
September 1, 2003
X2Y® technology is a new balanced component capable of high frequency performance across a broad frequency range. The component uses a standard ceramic capacitor with subtle, but important modifications to its structure. These structural changes create a circuit inside the capacitor that is capable of broadband electromagnetic interference (EMI)...Read More
June 1, 2003
In the telecoms and other RF component markets, today's climate means that there can no longer be a trade-off between cost and performance - the designer needs to achieve both. Temex has recognized this fact and addressed it through the evolution of two new generations of materials on which...Read More
This article presents the detailed design drivers for high speed digital packaging. Transmission line and interconnect requirements for packaging high speed digital assemblies are discussed. Details of the mechanical requirements to properly attach the...
May 1, 2003
A number of factors are driving the design of high speed digital packaging. At the assembly level, metal boxes are the dominant configuration due to mounting and interconnect constraints. The next assembly connectivity is accomplished through cables, requiring coaxial connectors. Since a variety of companies manufacture many of the...Read More
April 1, 2003
The CMC-SOIC8 ceramic SOIC8 surface-mount package is ideal for packaging RF/microwave MMIC and discrete devices for applications from DC to 18 GHz. This new addition to CMC's standard product line is fabricated using aluminum nitride (AlN), a ceramic material with thermal conductivity of 180 W/m-K, about 10 times higher...Read More