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Materials/Packages

STMicroelectronics Lays Foundations in China

The first stone has been laid at the site of STMicroelectronics’ future chip packaging and test facility in Longgang, Guangdong Province, China, in the presence of senior officials of the Shenzhen Municipal government and other dignitaries. The site will consist of up to 40,000 m 2 of manufacturing space,...
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Infineon Ships One Billionth RF Transceiver

Infineon Technologies , a supplier of communication ICs, has shipped its one billionth RF transceiver. For more than 15 years the company has supplied its communication ICs to all major companies in the mobile phone segment, including Nokia, Samsung, Motorola, Sony Ericsson and LG. It shipped more than 230...
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StratEdge Moves to New San Diego Facilities

StratEdge , a leader in the design and production of semiconductor packages for microwave, millimeter-wave and high speed digital devices, announced it has moved its headquarters to new, state-of-the-art facilities. Still located in San Diego, CA, the new site enables StratEdge to increase capabilities and space for package design,...
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AMTA 2007 Conference Wrap-up

From the 4 th of November through the 9 th , the Antenna Measurement Techniques Association (AMTA) held its 29 th annual symposium in St. Louis, MO. AMTA is a non-profit, professional organization that promotes advances in electromagnetic technologies applicable to antenna and radar cross-section measurements. The organization was...
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Arlon Displayed CLTE-XT for Multi-layer, Phase Sensitive Microwave Circuits

Arlon displayed high performance, "Best-in-Class" CLTE-XT for multi-layer, phase sensitive microwave circuits for radar, antennas and other circuits requiring high reliability at this year's EuMW. CLTE-XT represents the eXtended Technology of the existing CLTE product line. CLTE-XT is a micro dispersed ceramic PTFE composite utilizing a woven fiberglass reinforcement...
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