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Materials/Packages

picoChip Receives Strategic Investment from Samsung

September 25, 2007
Samsung has made a strategic investment in UK company picoChip . The amount of the investment is undisclosed, but it forms part of the $27 M of ‘D-round’ new investment announced in July by picoChip. The round has brought the total company funding to $70.5 M, which will enable...
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Chomerics Opens New Facility

September 21, 2007
Chomerics Asia Pacific division of Parker Hannifin Corp. announced the opening of a new facility in Sriperumbudur near Chennai, India. Located adjacent to the 260 acre Special Economic Zone, the facility will enable Chomerics to better serve the rapidly growing Indian market for IT, telecom and consumer electronic products....
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Tower Wins Fab2 Deal with Top-tier US IDM

September 21, 2007
Tower Semiconductor Ltd. , a pure-play independent specialty foundry, announced that it has won a multi-million dollar per month manufacturing deal for its Fab2 at the 0.13-micron technology generation from a first-tier, US integrated device manufacturer (IDM). Under this deal, technology will be transferred during the coming several quarters...
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Rogers Corporation Showcases High-Performance Laminate Solutions at Antenna Systems 2007

September 19, 2007
Rogers Corporation (NYSE:ROG) will showcase several high performance antenna solutions, including its newly developed RO4500(tm) antenna grade laminates, at Antenna Systems 2007.
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Rogers Corporation Showcases High-Performance Laminate Solutions at Antenna Systems 2007

September 19, 2007
Rogers Corporation (NYSE:ROG) will showcase several high performance antenna solutions, including its newly developed RO4500(tm) antenna grade laminates, at Antenna Systems 2007.
Read More

Capabilities of Multi-Layer Organic Packaging

September 14, 2007
IC packaging has become a critical bottleneck to achieving further reductions in the size of wireless products. While Moore’s law provides a continuous increase in the density of digital silicon components with each new process node, there is no Moore’s law for the RF components used in today’s broadband...
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Rogers Corporation New RO4500(tm) High Frequency Circuit Laminates Enable Cost-Effective Antenna Designs

September 5, 2007
Rogers Corporation (NYSE: ROG) announced today, its RO4500(tm) laminates, a new addition to Rogers' RO4000(r) product family of high performance antenna-grade materials.
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New RO4500(tm) High Frequency Circuit Laminates Enable Cost-Effective Antenna Designs

September 5, 2007
Rogers Corporation (NYSE: ROG) announced today, its RO4500(tm) laminates, a new addition to Rogers' RO4000(r) product family of high performance antenna-grade materials.
Read More

New RO4500(tm) High Frequency Circuit Laminates Enable Cost-Effective Antenna Designs

September 5, 2007
Rogers Corporation announced today, its RO4500(tm) laminates, a new addition to Rogers' RO4000(r) product family of high performance antenna-grade materials.
Read More

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