Agilent Technologies Inc. introduced the InfiniiMax III+ differential probes, a new generation of 4-, 8- and 13-GHz differential active probes for general-purpose, high-speed differential bus probing. The company also introduced new QuickTip accessories for InfiniiMax probes to help engineers make quick and reliable measurements.
Ideally suited for commercial and military S-band radar applications Richardson RFPD Inc. announces full design support capabilities and immediate availability of four new gallium nitride on silicon carbide (GaN on SiC) power amplifiers (PAs) from TriQuint. The new S-band amplifiers are fabricated on TriQuint’s production 0.25 μm GaN on SiC process (TQGaN25).
Linear Technology Corp. announces the LTC2107, a 16-bit 210 Msps high performance high-speed analog-to-digital converter (ADC) for high-end communications receivers and instrumentation applications. The LTC2107 has superior AC performance specifications, achieving 80 dB SNR performance, 4 dB higher than alternative products, and industry leading 98 dB SFDR at baseband.
Centellax offers a range of ultra-broadband amplifier MMICs and modules DC-65 GHz for RF and microwave communications, test equipment and military systems. MMICs include 0-30 dB gain control, temperature-reference power detector and low noise option. Visit the Microwave Product Page for more information.
The Centellax OA3SSQL is a surface-mount, quad channel, high performance, broadband 28 Gb/s electro-absorptive optical modulator driver with low jitter, 2.0 Vp-p amplitude and excellent gain and group delay flatness. The OA3SSQL is intended as a 100 Gb/s Ethernet (25 Gbps x 4) driver for EAMs. It includes single-ended inputs and outputs. Visit the OA3SSQL Product Page for more information.
Mini-Circuits AVM-273HP+ is a three stage balanced, wideband monolithic amplifier delivering up to 0.5 W power and operating over 13 to 26.5 GHz. It is designed using PHEMT technology and is unconditionally stable. Its outstanding isolation enables it to be used as a wideband isolation amplifier or buffer amplifier in a variety of microwave systems.
The SMP snap-on connector has become a popular RF connector for use in high density RF system packaging. SHP has developed additional variants of these connectors, which improve their attachment characteristics. Including a robust aluminum compatible connector and a robust kovar compatible connector for solder applications. These connectors provide superior hermetic performance in thermal cyclic environments.
Richardson RFPD Inc. announces immediate availability and full design support capabilities for five new gallium nitride (GaN) on silicon carbide (SiC) high-electron-mobility transistors (HEMTs) RF transistors from M/A-COM Technology Solutions (MACOM).
RFMW Ltd. announces design and sales support for Sangshin Elecom triplexers targeting avionics applications for Automatic Dependent Surveillance-Broadcast (ADS-B), Universal Access Transceiver (UAT) and Traffic Collision Avoidance System (TCAS). Sangshin’s TPX978/1030/1090SA triplexer offers excellent isolation of 45 dB between each band along with only 2.5 dB of insertion loss.