Mercury Computer Systems Inc. announced it received $2.8 million in follow-on orders from a global provider of electronic equipment for digital signal processing modules for an airborne synthetic aperture radar (SAR) application. The orders are expected to be shipped over the next four quarters.
Intelsat S.A., the world’s leading provider of satellite services, and International Launch Services (ILS) announced that an ILS Proton M vehicle successfully launched the Intelsat 22 satellite in Kazakhstan.
Diamond Antenna Europe BVBA has been formed as a joint venture between AML Microtechnique Lorraine S.A. and Diamond Antenna and Microwave Corp. to manufacture rotary joints in Metz, France. The venture will provide production, customer service, and sales to designated European markets.
Richardson RFPD Inc. announced it has completed a global distribution agreement with TRU Corp., a leader in the design, development and manufacture of custom, high performance RF/microwave interconnect solutions. TRU’s sophisticated, durable High Power cable assemblies provide power handling capabilities up to 6 times better than traditional RF assemblies.
New from the Engineering Division of Link Microtek is a series of waveguide switches that offer environmental sealing to IP65 standard, enabling them to operate reliably even when subjected to dusty or moist environmental conditions.
Cassidian, the defense and security division of EADS, has demonstrated, in a simulation study, the operational advantages of the Eurofighter’s future e-scan radar and has introduced the first pilots to the particular features of this technology.
API Technologies Corp.. has completed the acquisition, through its UK-based subsidiary API Technologies (UK) Ltd., of the entire issued share capital of C-MAC Aerospace Ltd. for a total purchase price of £20.95 million (approximately $33 million).
SemiGen Inc. has announced the grand opening of their new RF Supply Center and is accepting online orders for immediate shipment of low volumes of popular epoxies, adhesive films, bonding tools, gold wire and other supplies used in die attach, substrate attach, chip bonding, assembly, screen printing, and surface mounting of microwave modules and components.
TE Connectivity (TE) is featuring the latest board level innovative products and solutions enabling open architecture, increased bandwidth and reduced SWaP at Avionics Europe this week, on 21-22 March, in Munich Germany.