Discusses the forces in the commercial sector that are driving applicable capability in COTS test equipment, the architecture of the COTS instrumentation selected and the results of the collaboration to produce a realistic SIGINT ISR collection environment code-named LoBSTER
Explores the history of AESA radars and how continuing advances in MMIC materials and fabrication technologies, advancing packaging technology and exponential growth in digital circuits opens many possibilities for the future
Cassidian will equip the new Offshore Patrol Vessel of the Finnish Border Guard with its proven TRS-3D naval radar. The STX Shipyard in Rauma, Finland has awarded the company a contract to deliver the radar by mid-2013.
Cobham has been awarded a $65 million contract to supply electronic systems to Boeing’s Wideband Global SATCOM satellite program. The contract funds production on three satellite flight sets, with additional options for three more sets.
Integrated Microwave Technologies LLC (IMT), a business unit within the Vitec Group’s Videocom Division, and a leader in advanced digital microwave systems for MAG (Military, Aerospace & Government) markets, unveilsits CTx Ultra Compact SD COFDM transmitter at AUVSI 2012, the Association for Unmanned Vehicle Systems International's Annual North American Symposium and Exposition (Booth 2917).
Redline Communications (www.rdlcom.com) Group Inc., a leading provider of broadband wireless solutions for industrial machine-to-machine (M2M) communications, announced the availability of the RAS Smart Antenna System. The solid state RAS is the first wireless broadband networking system that instantly locates, steers toward and connects to a network base station, automatically establishing reliable high speed connectivity to and from roving assets.
Tektronix Component Solutions, a custom microelectronics services provider, announced an agreement with leading supply chain aggregator MOSIS to help customers develop complete, high-performance ASIC solutions while reducing the cost of early-stage ASIC development. Through the use of multi-project wafer runs for device prototyping and package development early in the design cycle, customers can costeffectively improve the time to first packaged ASIC.